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Semiconductor Assembly Packaging Engineer Jobs (NOW HIRING)

IC Packaging Engineer - WLP

California, MO ยท On-site

$100 - $125/hr

MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging ... Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging ...

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...

Packaging Engineer We are seeking an experienced Packaging Engineer to lead the design, development ... Develop and approve final assembly racks that ship directly to customers and meet all customer ...

Optical Packaging Engineer

Milpitas, CA ยท On-site

$150K - $194K/yr

The Associate Engineer will build fiber-coupled optical packages with photonic chips and work ... Exposure to semiconductor assembly, precision alignment systems, or automated manufacturing ...

Deformation and interconnect stress govern assembly yield, reliability, and optical coupling, since ... semiconductor packaging or electronic systems, including one product carried from architecture ...

Photonic Packaging Engineer

Carlsbad, CA ยท On-site

$136K - $198K/yr

Automate assembly systems and apply AI/ML and analytics to optimize high-volume manufacturing ... Data analysis (SQL/JMP) in a semiconductor production environment * Software development using C# ...

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump ...

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump ...

Principal Packaging Engineer

Austin, TX ยท On-site

$200K - $300K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and ... semiconductor packaging, package-level signal and power integrity, substrate and assembly ...

Principal Packaging Engineer

Austin, TX ยท On-site

$200K - $500K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and ... semiconductor packaging, package-level signal and power integrity, substrate and assembly ...

Principal Packaging Engineer

Austin, TX ยท On-site

$200K - $300K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and ... semiconductor packaging, package-level signal and power integrity, substrate and assembly ...

Principal Packaging Engineer

Santa Clara, CA ยท On-site

$200K - $300K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and ... semiconductor packaging, package-level signal and power integrity, substrate and assembly ...

Principal Packaging Engineer

Boston, MA ยท On-site

$200K - $300K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and ... semiconductor packaging, package-level signal and power integrity, substrate and assembly ...

Showing results 41-60

Semiconductor Assembly Packaging Engineer information

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How much do semiconductor assembly packaging engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for semiconductor assembly packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What are popular job titles related to Semiconductor Assembly Packaging Engineer jobs?

For Semiconductor Assembly Packaging Engineer jobs, the most frequently searched job titles are:

IC Packaging Engineer - WLP

California, MO โ€ข On-site

Socket.dev
Network Securityย โ€ขย 1 - 10 employees

$100 - $125/hr

Other

This job post hasย expired 3 days ago.ย Applications are no longer accepted.


Job description

DESCRIPTION

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.

Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.

MINIMUM QUALIFICATIONS
  • Minimum requirement of a bachelors degree
PREFERRED QUALIFICATIONS
  • MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab. Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards. Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
  • Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
  • Ability to work independently and orchestrate projects with cross functional teams
  • Solution-oriented mindset with strong fundamentals in engineering physics
  • Good program management skills.
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