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Semiconductor Assembly Packaging Engineer Jobs (NOW HIRING)

Apple

Packaging Assembly Engineer

Austin, TX · On-site

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...

Apple Inc.

Packaging Assembly Engineer

Austin, TX · On-site

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Semiconductor Packaging field. Working knowledge in materials characterization and analysis

NCSU

CLAWS Packaging Engineer

Raleigh, NC · On-site

Essential Job Duties We are seeking an experienced semiconductor device Packaging Engineer to join ... Packaging Design and Assembly Workflows (25%) * Specify package solutions that meet the performance ...

Cspeed

FEA Packaging Engineer

Palo Alto, CA · On-site

Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure ... Deformation and interconnect stress govern assembly yield, reliability, and optical coupling, since ...

Cisco

Photonic Packaging Engineer

Carlsbad, CA · On-site

$136K - $198K/yr

Automate assembly systems and apply AI/ML and analytics to optimize high-volume manufacturing ... Data analysis (SQL/JMP) in a semiconductor production environment * Software development using C# ...

Apple

Packaging Assembly Engineer

Austin, TX

$184K - $324K/yr

We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...

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Semiconductor Assembly Packaging Engineer information

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How much do semiconductor assembly packaging engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for semiconductor assembly packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

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For Semiconductor Assembly Packaging Engineer jobs, the most frequently searched job titles are:

Semiconductor Process Applications Engineer

Chandler, AZ • On-site

Finetech
IT Services • 11 - 50 employees
Learn more about Finetechexternal

Other

This job post has expired 1 day ago. Applications are no longer accepted.

Job description

Job description

Position Overview

We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment.

Key Responsibilities

  • Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
  • Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
  • Collaborate with customers to understand application requirements and develop customized process solutions.
  • Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
  • Provide technical training to customers and internal staff on equipment operation and process optimization.
  • Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
  • Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
  • Represent the company at industry events, conferences, and customer meetings as a technical expert.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
  • Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
  • Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
  • Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
  • Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
  • Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
  • Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).

Preferred Skills

  • Customer-focused mindset with a proactive approach to solving challenges.
  • Team player able to collaborate across departments and with external partners.
  • Adaptable and eager to learn about new technologies and industry trends.
  • Self-motivated, organized, and able to manage multiple priorities effectively.
  • Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.

Why Join Us?

Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package.


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