Job Description TITLE: Plating Process Development Engineer Comp: $140,000-$180,000 Location: New Albany, IN Our client is seeking immediate assistance in identifying a candidate for a Plating Process Development Engineer direct hire position in New Albany, IN. Responsibilities: Design and execute experiments focused on electrochemical deposition and development of novel plating materials Characterize deposited materials using analytical tools, coordinating both internal and external lab testing efforts Support both R&D and production teams with plating process development, optimization, and troubleshooting Collaborate with chemical suppliers and equipment vendors to evaluate and implement new plating technologies Lead the transition of new plating processes from development into full-scale production Drive product testing, validation, and qualification of new materials and processes Maintain lab procedures, documentation, and ensure compliance with safety and environmental standards Support continuous improvement initiatives to enhance plating quality, consistency, and performance Required Skills: 10+ years of hands-on experience in electroplating, electrolytic plating, or similar surface coating processes Strong experience working in reel-to-reel or strip line plating environments Direct experience with gold and nickel plating processes Hands-on materials characterization experience using tools such as SEM, XRD, XRF, or similar Ability to work effectively in both lab and production environments Proven troubleshooting skills related to plating quality and process improvement Comfortable working in a chemical environment with a strong focus on safety and proper material handling Strong communication skills with the ability to collaborate cross-functionally #ID9515