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Pcb Packaging Engineer Jobs (NOW HIRING)

We are seeking a Packaging Engineer with a focus on mechanical simulation. This is a unique ... PCB interfaces. * Generate and maintain reusable simulation templates, material libraries, and ...

We're seeking experienced engineers to contribute to flip chip package development and assembly ... Understanding of system-level interactions (PCB attach, second-level interconnect reliability). #J ...

We're seeking experienced engineers to contribute to flip chip package development and assembly ... Understanding of system-level interactions (PCB attach, second-level interconnect reliability). #J ...

We're seeking experienced engineers to contribute to flip chip package development and assembly ... Understanding of system-level interactions (PCB attach, second-level interconnect reliability). #J ...

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are ... Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced ...

The PCB Design Engineer develops high-quality printed circuit boards for advanced engine ... Collaborate with Mechanical and Electrical Engineers to optimize packaging, thermal, and electrical ...

We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging ... Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced ...

The PCB Design Engineer develops high-quality printed circuit boards for advanced engine ... Collaborate with Mechanical and Electrical Engineers to optimize packaging, thermal, and electrical ...

PCB Design Engineer

San Francisco, CA · On-site

$100 - $125/hr

We're looking for PCB design engineers to design and own various PCB boards that are components in ... Experience with chip package and PCB board interactions and design for manufacturing * Experience ...

PCB Design Engineer

Austin, TX · On-site

$100 - $125/hr

We're looking for PCB design engineers to design and own various PCB boards that are components in ... Experience with chip package and PCB board interactions and design for manufacturing * Experience ...

PCB Design Engineer

Boston, MA · On-site

$100 - $125/hr

We're looking for PCB design engineers to design and own various PCB boards that are components in ... Experience with chip package and PCB board interactions and design for manufacturing * Experience ...

PCB DESIGN ENGINEER LOCATION: San Jose, CA * . MUST HAVES: * Bachelor's degree in electrical ... Create netlist and routing rules (logical Design) from customer provided information packages and ...

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How much do pcb packaging engineer jobs pay per hour?

As of Sep 8, 2026, the average hourly pay for pcb packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

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Infographic showing various Pcb Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Packaging Engineer

Redmond, WA • On-site

Microsoft
Computer and Computer Peripheral Equipment and Software Wholesalers • 10K+ employees

Full-time

Posted 15 days ago


Microsoft rating

8.6

Company rating: 8.6 out of 10

Based on 134 frontline employees who took The Breakroom Quiz

70th of 247 rated software companies


Job description

Overview
Overview
Microsoft's Quantum Systems organization is a multidisciplinary organization advancing cutting-edge quantum technologies to address some of the world's most complex challenges. We are seeking a Packaging Engineer with a focus on mechanical simulation. This is a unique opportunity to shape the future of quantum systems in a dynamic, mission-driven environment.
At Microsoft Quantum, we aim to empower science and scientists to solve the world's biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind's currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum .
Microsoft's mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
We are looking for a Packaging Engineer with a focus on mechanical simulation. Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials.
Responsibilities
  • Thermal, structural, and thermo-mechanical simulations for quantum packaging hardware, including substrates, interposers, chip attach, cryogenic fridge components, and supporting cryogenic structures.

  • Develop simulations that span hand calculations, reduced-order models, and full finite-element analysis (FEA) depending on fidelity and program needs.

  • Structural and thermo-mechanical simulations to assess CTE mismatch, interfacial stress, warpage, and deformation across thermal cycles.

  • packaging reliability assessments, including risks associated with flip-chip attach, solder joints, substrate bonding, and PCB interfaces.

  • Generate and maintain reusable simulation templates, material libraries, and modeling workflows to improve consistency and efficiency across the packaging team.

  • Work in teams or independently as required.

  • Embody our Culture and Values

Qualifications
Required/Minimum Qualifications
  • Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field
    • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience
    • OR equivalent experience

Other Requirements
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screening
    • Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

  • Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

  • Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation).

  • Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI

Additional/Preferred Qualifications
  • Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field
    • OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience
    • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience
    • OR equivalent experience

  • Experience with cryogenic or extreme-environment hardware (cryogenic, vacuum, low-vibration, or high-precision systems).
  • Proficiency with FEA tools such as ANSYS, COMSOL, Abacus, or equivalent, including model setup, meshing strategies, and convergence assessment
  • Familiarity with advanced packaging technologies (flip chip, substrates, interposers, solder joints, PCB attach).
  • Experience correlating simulation with cryogenic test data and iterating models based on measurement feedback.
  • Strong fundamentals in heat transfer, solid mechanics, and numerical methods.
  • Demonstrated ability to translate ambiguous design questions into well-scoped simulation problems and actionable outputs.

#Quantum #QuantumCareers #MDQCareers
Hardware Engineering IC3 - The typical base pay range for this role across the U.S. is USD $102,100 - $202,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $133,800 - $219,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

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About Microsoft

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Our infrastructure is comprised of a large global portfolio of more than 100 datacenters and 1 million servers. Our foundation is built upon and managed by a team of subject matter experts working to support services for more than 1 billion customers and 20 million businesses in over 90 countries worldwide. With environmental sustainability and optimization at the forefront of our datacenter design and operations, we continue to grow and evolve as we meet the ever-changing business demands that hold Microsoft as a world-class cloud provider.

Industry

Computer and computer peripheral equipment and software wholesalers

Company size

10,000+ Employees

Headquarters location

Redmond, WA, US

Year founded

1975

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