ZipRecruiter

Log In

1

Packaging Jobs in Toronto, ON (NOW HIRING)

Semtech

Principal Packaging Engineer

Burlington, ON · On-site

Our Packaging Technology team sits at the heart of this mission, bridging the gap between silicon and system through world-class IC package design, signal integrity engineering, and close ...

Menasha Corporation

Packaging Labour Estimator

Brampton, ON · On-site

CA$55K - CA$65K/yr

Our two businesses, Menasha Packaging and ORBIS Corporation, are leaders in their industries, providing corrugated and plastic packaging products and related services to major global companies. Our ...

Amd

Sr. Manager Packaging Engineering

Thornhill, ON · Hybrid

Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met. * Drive execution in fast-paced, dynamic, and ...

ABL Careers

Be Seen First

Cannabis Packager

Bradford, ON · On-site

CA$17.60/hr

Convenient afternoon shift (330pm-12am) You will be trimming, pruning, packaging, sorting, weighing and processing raw cannabis. No experience needed! All applicants must be at least 19 years of age ...

ABL Employment

Order Picking / Packaging

Burlington, ON · On-site

CA$19.27/hr

We are hiring entry level candidates to join a global parcel distribution company in Burlington, as warehouse associate. These roles are full-time ongoing, and are great opportunity to build ...

previous pagenext page

Showing results 21-40

All JobsPackaging JobsPackaging Jobs in Toronto, ON

Packaging information

What is a packaging job?

Packaging jobs involve preparing products for shipment or sale by placing them into containers, boxes, or other packaging materials. Workers in this field may operate machinery, inspect products for quality, label packages, and ensure items are securely packed to prevent damage during transportation. These roles are found in various industries, including food production, manufacturing, and retail. Attention to detail, physical stamina, and the ability to follow safety guidelines are important for success in packaging jobs.

What are the key skills and qualifications needed to thrive in a packaging role?

To thrive in a Packaging role, you need attention to detail, manual dexterity, and a basic understanding of safety and quality standards, often supported by a high school diploma or equivalent. Familiarity with packing machinery, conveyor systems, and inventory management software is typically required. Reliability, teamwork, and effective communication are important soft skills that help maintain workflow and product quality. These skills ensure efficient and safe packaging processes, minimize errors, and support overall production goals.

What are some common challenges faced by packaging professionals, and how can they be addressed?

Packaging professionals often encounter challenges such as tight production deadlines, ensuring product safety, and adapting to evolving sustainability standards. Balancing cost-effectiveness with high-quality packaging materials is also a frequent concern. To address these issues, effective communication with suppliers, staying updated on industry regulations, and collaborating closely with design and production teams are essential strategies. Embracing new technologies and continuous learning can also help packaging specialists stay ahead in this dynamic field.

What is the difference between Packaging vs Packaging Operator?

AspectPackagingPackaging Operator
CredentialsHigh school diploma or equivalent, sometimes technical trainingHigh school diploma, on-the-job training
Work EnvironmentManufacturing or warehouse settings, often in production linesManufacturing plants, operating packaging machinery
Job FocusDesigning, planning, and overseeing packaging processesOperating and maintaining packaging equipment
Common UsageInvolved in packaging design and logisticsHands-on role in packaging production

Packaging involves planning and managing the packaging process, while Packaging Operators focus on operating machinery and executing packaging tasks on the production line. Both roles are essential in manufacturing, but they differ in responsibilities and skill requirements.

How to become a packaging?

To become a packaging worker, you typically need a high school diploma or equivalent. Relevant skills include attention to detail, manual dexterity, and knowledge of packaging equipment; some positions may require on-the-job training or certifications. Experience in manufacturing or warehouse environments can be beneficial.

Is packaging a stable career?

Packaging is generally considered a stable career as it is essential to manufacturing, shipping, and retail industries. Jobs in packaging often require physical skills and can offer opportunities for advancement, with some roles requiring certifications or experience with machinery. The demand for packaging workers tends to remain steady due to ongoing production and distribution needs.

What are the most commonly searched types of Packaging jobs in Toronto, ON?

The most popular types of Packaging jobs in Toronto, ON are:

What are popular job titles related to Packaging jobs in Toronto, ON?

For Packaging jobs in Toronto, ON, the most frequently searched job titles are:

What job categories do people searching Packaging jobs in Toronto, ON look for?

The top searched job categories for Packaging jobs in Toronto, ON are:

What cities near Toronto, ON are hiring for Packaging jobs?

Cities near Toronto, ON with the most Packaging job openings:

Packaging jobs near you
Infographic showing various Packaging job openings in Toronto, ON as of August 2026, with employment types broken down into 83% Full Time, 12% Part Time, 1% Temporary, 2% Contract, and 2% Nights. Highlights an 93% Physical, 3% Hybrid, and 4% Remote job distribution.

Principal Packaging Engineer

Semtech

Burlington, ON • On-site

Full-time

Re-posted 22 days ago

Key responsibilities

  • Lead the design and electrical characterization of advanced high-speed IC packages for Datacenter connectivity products.

  • Perform 3D signal integrity modeling, including experimental validation, and develop PCB and substrate layouts for reliability and electrical performance.

  • Serve as a technical interface with manufacturing suppliers, drive alignment during NPI, and contribute to continuous improvement of design methodologies.

Job description

Our Team

Semtech's Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries - powering the interconnects that move data inside the world's largest hyperscaler data centers. Our Packaging Technology team sits at the heart of this mission, bridging the gap between silicon and system through world-class IC package design, signal integrity engineering, and close collaboration with a global network of advanced manufacturing partners.

You will be joining a highly integrated team of digital, analog, physical, and systems engineers who are passionate about solving hard problems at the intersection of speed, density, and reliability. If you thrive in a technically challenging, fast-moving environment where your work directly impacts next-generation Datacenter connectivity products - this is your team.

Job Summary

As a Principal Engineer in IC Package Design and Signal Integrity, you will lead the design and electrical characterization of advanced high-speed IC packages for Semtech's Datacenter connectivity product portfolio. Your primary responsibilities will span 3D electrical signal integrity modeling, IC package layout, and cross-functional collaboration across design, manufacturing, quality, and reliability engineering disciplines.

This role requires a deep understanding of high-speed transmission line behavior, advanced packaging architectures, and the full NPI lifecycle from concept through qualification. You will work closely with internal teams and external manufacturing partners, serving as a key technical authority on package-level signal and power integrity. The ideal candidate brings strong hands-on experience in EDA tooling, RF/SI measurement, and a track record of delivering complex package designs into high-volume production.

Responsibilities

Design high-speed IC packages and Chip-On-Board (COB) solutions to meet new product technical and financial requirements; develop robust solutions that achieve the highest levels of quality and reliability in fast-paced Datacenter connectivity environments.

Perform 3D signal integrity modeling at silicon, package, and system levels, including experimental validation via Scattering Parameter (S-parameter) and Time-Domain Reflectometer (TDR) measurements where required.

Prepare technical reports and application notes for internal teams and external customers/suppliers, covering Signal and Power Integrity (SI/PI), PCB layout guidance, and assembly process instructions.

Design and produce PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.

Serve as technical interface with manufacturing suppliers throughout new product introduction (NPI), package definition, and design phases; drive alignment between design intent and manufacturing capability.

Identify, evaluate, and launch projects with new strategic suppliers and emerging package technologies to advance Semtech's packaging roadmap.

Mentor junior packaging engineers and contribute to continuous improvement of design methodologies, tools, and workflows.

Minimum Qualifications

  • Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
  • Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity - including crosstalk, impedance control, and return-loss optimization.
  • Hands-on proficiency with industry-standard EDA tools: Keysight Advanced Design System (ADS), Cadence Advanced Package Designer (APD/SiP), and Ansys HFSS.
  • Demonstrated experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
  • Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out (FOCOS), high-density substrate, silicon bridge interconnects, and Chip-On-Board (COB).
  • Experience in optoelectronics package design or opto-electronic assembly is a strong asset.
  • Working knowledge of JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) and its design implications.
  • Proven ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification phases.
  • Strong written and verbal communication skills, with the ability to produce high-quality technical documentation for both internal and customer-facing audiences.

Desired Qualifications

  • Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
  • Experience with opto-electronic package assembly and photonic integration is highly desirable.
  • Background in Datacenter or high-speed communications product development (400G, 800G, 1.6T).
  • Familiarity with thermo-mechanical simulation tools and reliability engineering methodologies (e.g., finite element analysis for package stress modeling).
  • Experience working in a fabless semiconductor environment with global contract manufacturing partners.

Career Growth Philosophy

At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel - both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents maybe requiredto perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee's total compensation package.

Apply