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Packaging Integration Engineer Jobs (NOW HIRING)

GlobalFoundries inc.

$143K - $247K/yr

As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged ...

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

$184K - $324K/yr

... Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...

Apple Inc.

IC Packaging Integration Engineer

Austin, TX · On-site

... IC Packaging Engineer to join our team! Description * You will be responsible for IC packaging development * Work with cross‑functional teams and lead SoC Package integration and architecture ...

Apple

IC Packaging Integration Engineer

Austin, TX

$184K - $324K/yr

... Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...

Apple

IC Packaging Integration Engineer

Austin, TX · On-site

... Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...

Apple

IC Packaging Integration Engineer

Bodega Bay, CA · On-site

$184K - $324K/yr

We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...

GlobalFoundries inc.

$85K - $146K/yr

## Packaging Integration Engineer (2026 New College Graduate)Applylocations: Essex Junctiontime type: Full timeposted on: Posted Todayjob requisition id: JR-2603869**About GlobalFoundries*

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How much do packaging integration engineer jobs pay per year?

As of Sep 9, 2026, the average yearly pay for packaging integration engineer in the United States is $124,275.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $140,000.00 per year, depending on experience, location, and employer.

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Packaging Integration Engineer

Essex Junction, VT • On-site

GlobalFoundries
Manufacturing • 10K+ employees
Learn more about GlobalFoundriesexternal

$143K - $247K/yr

Full-time

Re-posted 5 hours ago

GlobalFoundries rating

8.3

Company rating: 8.3 out of 10

Based on 35 frontline employees who took The Breakroom Quiz

65th of 547 rated manufacturers

Job description

About GlobalFoundries
GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role
As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.
Essential Responsibilities include:
  • Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

  • Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.

  • Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).

  • Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.

  • Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.

  • Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.

  • Support cost modeling and drive package cost reduction initiatives aligned with GF's B2B supply chain strategy.

  • Present technical updates and roadmaps to internal stakeholders and external partners.

Other Responsibilities
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

  • Travel up to 25% to other GlobalFoundries facilities or external partner sites may be necessary.

Required Qualifications
  • Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.

  • 8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.

  • Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.

  • Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.

  • Understanding of reliability standards and qualification methodologies for optical modules.

  • Excellent analytical, problem-solving, and communication skills.

  • Experience in bringing packaged products from development into production.

  • Strong written and spoken English communication skills.

Preferred Qualifications
  • Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).

  • Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.

  • Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.

  • Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).

  • Familiarity with GF's Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.

  • Experience working with OSATs and managing external development partners.

  • Demonstrated ability to lead cross-functional teams and influence technical direction.

Expected Salary Range
$143,000.00 - $247,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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