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Packaging Engineer Jobs in Phoenix, AZ (NOW HIRING)

As a Packaging Module Development Engineer, you will: • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future ...

The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...

Solid understanding of thermal, mechanical, and electrical aspects of package design. * Bachelor'''''s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related ...

Hybrid Senior Medical Packaging Engineer Tempe, AZ Join a role focused on developing and improving sterile packaging systems for medical devices. This position contributes to packaging design ...

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The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of ...

The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of ...

The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of ...

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral ...

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral ...

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: • Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to ...

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to ...

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Packaging Engineer information

See Phoenix, AZ salary details

$19

$42

$66

How much do packaging engineer jobs pay per hour?

As of Aug 9, 2026, the average hourly pay for packaging engineer in Phoenix, AZ is $42.06, according to ZipRecruiter salary data. Most workers in this role earn between $32.45 and $48.94 per hour, depending on experience, location, and employer.

How does a packaging engineer typically collaborate with other departments during the product development process?

Packaging Engineers work closely with teams in product design, marketing, manufacturing, and quality assurance to ensure that packaging solutions are functional, cost-effective, and align with brand requirements. They frequently attend cross-functional meetings to gather input on packaging needs, address manufacturability concerns, and ensure regulatory compliance. This collaborative approach helps streamline the launch of new products and resolves issues quickly, making strong communication skills essential for success in this role.

What is a packaging engineer?

A packaging engineer is an engineer who specializes in developing containers and packages for products that meet the manufacturer’s needs. As a packaging engineer, your responsibilities and duties include working with the product manufacturer to decide what kind of package or container (box, bottle, bag, stretch wrap, molded forms, etc.) is best for the product. You discuss what material (paper, plastic, glass, metal, etc.) is best. You determine the most efficient method to produce the containers and how they will appear. This job often requires travel to meet with clients.

Are packaging engineers in demand?

Packaging engineers are in demand due to the growth of e-commerce, manufacturing, and consumer goods industries that require innovative and sustainable packaging solutions. They often need skills in materials, design, and manufacturing processes, with employment opportunities available across various sectors.

What is the difference between Packaging Engineer vs Packaging Technician?

AspectPackaging EngineerPackaging Technician
CredentialsBachelor's degree in engineering, packaging science, or related fieldHigh school diploma or equivalent; technical training often preferred
Work EnvironmentDesign, development, and testing of packaging solutions; collaboration with R&D and manufacturingImplementation, setup, and troubleshooting of packaging processes on the production line
Employer & Industry UsageManufacturers, consumer goods, food & beverage, pharmaceuticalsPackaging facilities, manufacturing plants, distribution centers

Packaging Engineers focus on designing and developing packaging solutions, requiring technical degrees and working in R&D or design settings. Packaging Technicians handle the practical implementation and maintenance of packaging processes on the production floor, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and required qualifications.

What does a packaging engineer do?

A Packaging Engineer is responsible for designing, developing, and testing packaging solutions for products. They work to ensure that packaging is cost-effective, meets safety and regulatory standards, and protects the product during shipping and storage. Packaging Engineers collaborate with product development, manufacturing, and marketing teams to create packaging that is functional, sustainable, and appealing to customers. They may also research new materials and technologies to improve packaging performance and reduce environmental impact.

What are the key skills and qualifications needed to thrive as a packaging engineer, and why are they important?

To thrive as a Packaging Engineer, you need a solid background in materials science, mechanical engineering, and packaging design, often supported by a bachelor's degree in engineering or a related field. Familiarity with CAD software, packaging testing equipment, and regulatory standards such as ISTA or ASTM is typically required. Strong problem-solving, project management, and collaboration skills help you innovate and work effectively with cross-functional teams. These abilities ensure the creation of cost-effective, sustainable, and compliant packaging solutions that protect products and meet business objectives.
What are the most commonly searched types of Packaging Engineer jobs in Phoenix, AZ? The most popular types of Packaging Engineer jobs in Phoenix, AZ are:
What job categories do people searching Packaging Engineer jobs in Phoenix, AZ look for? The top searched job categories for Packaging Engineer jobs in Phoenix, AZ are:
What cities near Phoenix, AZ are hiring for Packaging Engineer jobs? Cities near Phoenix, AZ with the most Packaging Engineer job openings:
Infographic showing various Packaging Engineer job openings in Phoenix, AZ as of August 2026, with employment types broken down into 90% Full Time, 5% Part Time, and 5% Contract. Highlights an 88% Physical, 4% Hybrid, and 8% Remote job distribution, with an average salary of $87,495 per year, or $42.1 per hour.

$127K - $179K/yr

Full-time

Medical, Retirement, PTO

Posted 16 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers


Job description

Job Description

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.


As a Packaging Module Development Engineer, you will:


• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:


• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.


Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:


• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.


• Experience listed above should be a combination of the following:

Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:


One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.


Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968