Packaging Engineer Jobs in Quebec (NOW HIRING)

Advanced Microsystems Technologies (AMT) is a technology division of Sanmina Corporation, focused on RF, microelectronic, optical components and integrated subsystems. We provide services from design concept through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We partner with customers to enable products through the full product lifecycle.

At AMT, you will work on innovative programs across markets including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing, medical devices and diagnostics, and test & measurement systems. You will be part of a team that challenges you to excel and is empowered to make a difference.

Join us to contribute to a team that delivers advance microelectronic solutions and packaging technologies with a strong emphasis on materials science, thermal/mechanical analysis, reliability engineering, and wafer-level assembly and processing.

The Microelectronic Design Engineering team represents a strategic growth area within Sanmina's Global Design Engineering Team. The team provides engineering and design services in microelectronics, optical and semiconductor advanced packaging solutions, supported by deep expertise in materials science, thermal/mechanical analysis, reliability engineering, and advanced wafer-level assembly and processing technologies.

We are seeking a Senior Design Engineer, Microelectronics and Advanced Packaging to lead and support technology and product development programs from initial concept and technology selection through detailed design, prototyping, qualification and volume manufacturing.

• Technical Leadership: Act as the lead for microelectronic and advanced packaging solutions within a multidisciplinary team (RF, Optical, Reliability, and Process Engineering).
• Design and Engineering: Engineer microelectronic packages and modules, integrating material selection, substrate layout, thermal/mechanical analysis, and Design for Manufacturing (DFM).
• Strategic Assessment: Evaluate industry trends to select microelectronic technologies and define design concepts aligned with customer requirements and market standards.
• Supplier & Lifecycle Management: Define specifications for custom outsourced components and manage documentation, including BOMs, assembly drawings, and Engineering Change Orders (ECO).
• Mentorship: Provide technical oversight and guidance to junior members of the microelectronics design team.
• Communications: Interface with customers, management and project stakeholders on updates, issues and status.
• Business Development: Support growth by interfacing with prospective customers, preparing technical proposals, and drafting quotations for novel engineering solutions.

• Education: Bachelor’s Degree in Mechanical Engineering, Physics, or a related technical discipline.
• Experience: Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.
• Technical Expertise: Extensive background in microelectronic and advanced packaging technologies, materials, components, and manufacturing methods. Proven track record leading end-to-end product development from prototype to volume manufacturing.
• Software Proficiency: CAD: AutoCAD and SolidWorks; Analysis: experience with commercial FEA tools; Substrate Design: Cadence Allegro Package Designer Plus.
• Security Clearance: Security clearance is an asset.

• Collaborative Problem Solver: Ability to navigate complex, novel issues within a fast-paced team environment.
• Communication: Exceptional verbal and written skills; ability to distill complex technical data into concise updates for stakeholders and customers.
• Agility: Comfortable managing multiple high-priority programs simultaneously.

• The compensation range for this position is $110,000 - $160,000 annually.
• This position is for an existing vacancy.
• The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.