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Packaging Design Manager Jobs (NOW HIRING)

Intel

ADCE Packaging Design Architect

Austin, TX · On-site

$220K - $311K/yr

Strong organization, time management, and communication skills, self-motivated. * Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.

Intel

ADCE Packaging Design Architect

Folsom, CA · On-site

$220K - $311K/yr

Strong organization, time management, and communication skills, self-motivated. * Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.

Intel

ADCE Packaging Design Architect

Santa Clara, CA

$220K - $311K/yr

Strong organization, time management, and communication skills, self-motivated. * Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.

Intel

$220K - $311K/yr

Strong organization, time management, and communication skills, self-motivated. * Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.

Intel

ADCE Packaging Design Architect

Phoenix, AZ · On-site

$220K - $311K/yr

Strong organization, time management, and communication skills, self-motivated. * Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.

Intel

ADCE Packaging Design Architect

Hillsboro, OR · On-site

$220K - $311K/yr

Strong organization, time management, and communication skills, self-motivated. * Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.

Intel

Silicon Packaging Design Engineer

Hillsboro, OR · On-site

$148K/yr

... management system to ensure traceability and efficient collaboration. - Conduct reviews with ... packaging technology leadership for the AI era, enabling our customers to design leadership ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$135K/yr

... management system to ensure traceability and efficient collaboration. - Conduct reviews with ... packaging technology leadership for the AI era, enabling our customers to design leadership ...

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All JobsPackaging Design Manager Jobs

Packaging Design Manager information

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$29.5K

$87.7K

$142.5K

How much do packaging design manager jobs pay per year?

As of Jun 24, 2026, the average yearly pay for packaging design manager in the United States is $87,669.00, according to ZipRecruiter salary data. Most workers in this role earn between $62,500.00 and $112,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Packaging Design Manager, and why are they important?

To thrive as a Packaging Design Manager, you need a strong background in graphic design, materials knowledge, and project management, typically supported by a bachelor's degree in design or a related field. Expertise in industry-standard design software such as Adobe Creative Suite, CAD programs, and familiarity with packaging production processes is essential. Leadership, creativity, and effective communication are crucial soft skills for guiding teams and collaborating with stakeholders. These competencies ensure innovative, cost-effective packaging solutions that meet brand objectives and regulatory requirements.

How does a Packaging Design Manager typically collaborate with marketing and production teams during a project?

A Packaging Design Manager works closely with marketing to ensure the design aligns with brand messaging and appeals to the target audience, while also collaborating with production teams to confirm that concepts are feasible for manufacturing and meet regulatory requirements. This role often acts as a bridge, facilitating clear communication between creative and technical departments to ensure timelines, budgets, and quality standards are met. Regular meetings, feedback sessions, and cross-functional reviews are common to keep projects on track and address any challenges quickly.

What is the difference between Packaging Design Manager vs Packaging Designer?

AspectPackaging Design ManagerPackaging Designer
CredentialsBachelor's degree in Graphic Design, Packaging Engineering, or related field; experience in project managementBachelor's degree in Graphic Design, Industrial Design, or related field; portfolio required
Work EnvironmentOversees teams, collaborates with marketing and production departmentsFocuses on creating packaging concepts and designs, often working independently or in small teams
Industry UsageUsed in companies with large packaging needs, managing multiple projectsUsed by individual designers or small studios creating packaging visuals

The Packaging Design Manager oversees the entire packaging design process, managing teams and coordinating with other departments. In contrast, the Packaging Designer focuses on creating specific packaging designs. Both roles require relevant design credentials, but the manager's role involves leadership and project oversight, while the designer's role emphasizes creative execution.

What does a Packaging Design Manager do?

A Packaging Design Manager oversees the creation and development of packaging for products, ensuring that designs are both visually appealing and functional. They coordinate with marketing, product development, and manufacturing teams to align packaging with brand identity and production requirements. Their responsibilities may include managing a team of designers, overseeing project timelines, and ensuring compliance with industry standards and regulations. Ultimately, they play a key role in enhancing product shelf appeal and customer experience through innovative packaging solutions.
What cities are hiring for Packaging Design Manager jobs? Cities with the most Packaging Design Manager job openings:
What are the most commonly searched types of Packaging Design jobs? The most popular types of Packaging Design jobs are:
What states have the most Packaging Design Manager jobs? States with the most job openings for Packaging Design Manager jobs include:
Packaging Design Manager jobs near you
Infographic showing various Packaging Design Manager job openings in the United States as of June 2026, with employment types broken down into 95% Full Time, 4% Part Time, and 1% Contract. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $87,669 per year, or $42.1 per hour.
ADCE Packaging Design Architect

ADCE Packaging Design Architect

Intel

Austin, TX • On-site

$220K - $311K/yr

Full-time

Medical, Retirement, PTO

Posted 14 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

10th of 139 rated electronics manufacturers

Job description

Job Details:Job Description: 

Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.

Required Skills and Experience:

  • Self-motivated engineer who has strong technical background in design and electrical analysis.
  • Solid background in semiconductor fabrication and packaging
  • Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions. - Ability to work independently and at various levels of abstraction
  • Strong organization, time management, and communication skills, self-motivated.
  • Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc.
  • Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
  • Experience and knowledge with assembly process, test and characterization techniques preferred
Qualifications:
  • Ph.D./master's in electrical engineering/ chemical engineering/ mechanical engineering or Material Science.
  • 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple CitiesBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.The application window for this job posting is expected to end by 06/09/2026

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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