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Package Design Jobs (NOW HIRING)

Nvidia

Package Design Methodology Engineer

Austin, TX · On-site

NVIDIA's Advanced Package Engineering team sits at the intersection of cutting-edge chip design and the physical reality of getting silicon to product - and we're expanding it. As AI systems grow ...

Micron

Senior Package Design Engineer

Boise, ID

Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip ...

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How much do package design jobs pay per hour?

As of Aug 11, 2026, the average hourly pay for package design in the United States is $17.97, according to ZipRecruiter salary data. Most workers in this role earn between $15.87 and $18.75 per hour, depending on experience, location, and employer.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

More about Package Design jobs
What cities are hiring for Package Design jobs? Cities with the most Package Design job openings:
What are the most commonly searched types of Package Design jobs? The most popular types of Package Design jobs are:
What states have the most Package Design jobs? States with the most job openings for Package Design jobs include:
Package Design jobs near you
Infographic showing various Package Design job openings in the United States as of August 2026, with employment types broken down into 78% Full Time, 10% Part Time, and 12% Contract. Highlights an 84% Physical, 2% Hybrid, and 14% Remote job distribution, with an average salary of $37,374 per year, or $18 per hour.

Staff Package Design Engineer

Renesas Electronics

Tempe, AZ • On-site

Full-time

Re-posted 7 days ago

Job description

Company Description
Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced packaging capabilities and seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver next-generation, high-performance package solutions that support our world-class product portfolio across automotive, industrial, infrastructure, and IoT applications.
Job Description
In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.
Key Responsibilities
  • Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
  • Develop and maintain package CAD databases, ensuring accuracy and adherence to package design guidelines, DFM, and DFA requirements to support manufacturability, yield, and long-term reliability.
  • Manage the package design cycle, including schematic creation, netlist import, footprint assignment, layout implementation, verification, and generation of manufacturing release outputs such as Gerber/drill data, fabrication drawings, assembly drawings, bump maps, and related documentation.
  • Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features.
  • Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams to support package-level co-optimization and participate in design reviews.
  • Ensure package designs comply with applicable foundry, OSAT, substrate vendor, and manufacturing design rules, including DRC, LVS, connectivity, and netlist verification requirements.
  • Support Engineering Change Order cycles, design updates, revision control, and release documentation throughout the project lifecycle.

Qualifications
  • 4+ years of hands-on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
  • Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
  • High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, or equivalent CAD platforms.
  • Proven experience applying advanced package design rules, substrate vendor constraints, OSAT assembly requirements, DFM/DFA principles, and manufacturing release standards.
  • Experience interfacing directly with Tier-1 OSATs, substrate suppliers, foundries, silicon design teams, and product engineering teams.
  • Working understanding of SI/PI fundamentals, high-speed routing, impedance control, power/ground distribution, and crosstalk mitigation.
  • Strong communication, presentation, and technical documentation skills, with demonstrated experience working effectively in global, cross-functional engineering environments.

Education
  • Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, 'To Make Our Lives Easier.'
At Renesas, you can:
  • Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
  • Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
  • Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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