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Package Design Jobs in California (NOW HIRING)

DensityAI

Advanced Packaging Engineer

Mountain View, CA · On-site

$160K/yr

Use and develop AI-assisted tool flows to accelerate package design and signoff timelines What we're looking for * Exceptional abilities across the full advanced packaging design and tradeoffs * 10+ ...

transpak

Packaging Design Engineer I

Hayward, CA

$155K/yr

... package testing/qualification, and resolving packaging related issues. * Knowledge of packaging testing, design standards (ISO, Mil-spec, etc.), ASTM/ ISTA standards, transportation, and material ...

transpak

Packaging Design Engineer I

San Jose, CA · On-site

$159K/yr

... package testing/qualification, and resolving packaging related issues. * Knowledge of packaging testing, design standards (ISO, Mil-spec, etc.), ASTM/ ISTA standards, transportation, and material ...

TransPak

Packaging Design Engineer I

San Jose, CA · On-site

$72K/yr

... package testing/qualification, and resolving packaging related issues. * Knowledge of packaging testing, design standards (ISO, Mil-spec, etc.), ASTM/ ISTA standards, transportation, and material ...

DensityAI

Advanced Packaging Engineer

Mountain View, CA · On-site

$200K - $350K/yr

Use and develop AI-assisted tool flows to accelerate package design and signoff timelines What we're looking for * Exceptional abilities across the full advanced packaging design and tradeoffs * 10+ ...

DensityAI

Advanced Packaging Engineer

Mountain View, CA

$200K - $350K/yr

Use and develop AI-assisted tool flows to accelerate package design and signoff timelines What we're looking for * Exceptional abilities across the full advanced packaging design and tradeoffs * 10+ ...

Career Site

TEMP Packaging Designer

San Francisco, CA · Hybrid

$45 - $55/hr

Support package design development for upcoming programs/launches on designated brands. Partner with product development and packaging teams to achieve the highest level of quality for each project ...

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All JobsPackage Design JobsPackage Design Jobs in California

Package Design information

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How much do package design jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for package design in California is $17.73, according to ZipRecruiter salary data. Most workers in this role earn between $15.67 and $18.51 per hour, depending on experience, location, and employer.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

What are the most commonly searched types of Package Design jobs in California? The most popular types of Package Design jobs in California are:
What cities in California are hiring for Package Design jobs? Cities in California with the most Package Design job openings:
Package Design jobs near you
Infographic showing various Package Design job openings in California as of August 2026, with employment types broken down into 77% Full Time, 10% Part Time, and 13% Contract. Highlights an 83% Physical, 3% Hybrid, and 14% Remote job distribution, with an average salary of $36,884 per year, or $17.7 per hour.

Principal Photonics Package Architect

Astera Labs

San Jose, CA • On-site

Other

Re-posted yesterday

Job description

Principal Photonics Package Architect

About the Role 

Astera Labs is seeking a Principal Photonics Package Architect to define and drive package architecture for next-generation photonics products for scale up and scale out AI infrastructure applications. This is a high-impact senior individual contributor role focused on aligning electrical, thermal, and mechanical design requirements across functions, enabling robust package implementation, and guiding package technology decisions for NPO and CPO products. 

Responsibilities 

  • Define photonics package architecture, define electrical and optical interface specifications, and establish signal integrity and power integrity requirements. 
  • Establish and manage Thermal Design Power (TDP) budgets and thermal performance targets. 
  • Drive cross-functional alignment with EIC, PIC, and hardware teams on co-design constraints and drive system optical link budget. 
  • Partner with validation, test, and reliability teams to define DFT and DFR requirements and acceptance criteria. 
  • Finalize bump map and ball map, and manage ECOs and revision control of package design databases. 
  • Lead package-level design reviews and own the package design technical roadmap. 

Basic Qualifications 

  • B.S., M.S., or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field. 
  • 10+ years of experience in semiconductor or photonics package development, package design, or package integration, with demonstrated technical leadership. 
  • Strong understanding of package architecture tradeoffs across electrical, optical, thermal, mechanical, and manufacturability considerations. 
  • Experience working across chip, board, and system-level design electrical and optical interfaces in complex product development environments. 
  • Experience with package EDA tools and electrical simulation tools, including Cadence APD+ and Ansys HFSS. 
  • Experience with advanced packaging design, including 2.5D and 3D package architectures. 
  • Familiarity with package design flows, design database management, and engineering change control practices. 
  • Ability to drive technical decisions, resolve cross-functional issues, and communicate architecture direction clearly to stakeholders. 
  • Strong foundation in design reviews, risk assessment, and design quality from concept through production release. 

Preferred Qualifications 

  • Experience with industry-standard optical interfaces and interconnect technologies relevant to package design. 
  • Experience with advanced photonics packaging technologies for data center interconnects. 
  • Experience supporting package bring-up and correlating design assumptions with validation results. 
  • Experience supporting cross-functional design closure with silicon, photonics, board, validation, test, and reliability teams. 
  • Knowledge of package design for NPO or CPO products. 

Apply