Pcb Process Engineer Jobs (NOW HIRING)

Job Details: Job Location: PHOENIX, AZ85021. Position Type: Full Time. Job Shift: Day. Job Category: Engineering.

The Process Engineer is responsible for developing, improving, and sustaining manufacturing processes across Titan Circuits’ high‑mix PCB assembly environment. This role supports SMT, reflow, AOI/X‑ray, selective solder, hand solder, mechanical assembly, and NPI builds by ensuring processes are stable, repeatable, documented, and capable of delivering high yields with minimal rework.

This is a hands‑on, floor‑focused engineering role—Titan expects the Process Engineer to be visible on the production line, solving issues in real time, tightening process controls, and owning yield performance and escape reduction within their area.

Key ResponsibilitiesProcess Development & Optimization

• Develop, refine, and sustain manufacturing processes for SMT, reflow, selective solder, wave, hand solder, mechanical assembly, and conformal coating.
• Build stable process windows, define critical parameters, and enforce discipline around their use.
• Optimize equipment setup, changeover, programming, and material flow to improve throughput and reduce labor hours.
• Perform DOE, capability studies, and data‑driven problem‑solving to identify improvement opportunities.

SMT & AOI Engineering Support

• Create, modify, and maintain SMT programs (pick/place, fiducials, feeders, offsets).
• Develop accurate stencil aperture designs and drive proper stencil ordering.
• Profile ovens and maintain reflow parameters to meet solder quality requirements.
• Create and maintain AOI programs with correct calls, tolerances, and defect libraries.
• Support X‑ray inspection criteria and programming.

NPI Readiness & DFM

• Participate in early design reviews; identify DFM issues and alternatives.
• Validate BOMs, AVL requirements, tooling, fixtures, and build documentation before release.
• Drive complete NPI packages—routing, travelers, process sheets, reflow profiles, tooling—and support first‑article builds.

Quality, Yield, & Escape Reduction

• Investigate chronic defects, scrap patterns, and rework trends; implement permanent corrective actions.
• Support Quality on 8D, 5‑Why, and root‑cause activities.
• Work cross‑functionally with Quality, Production, and Engineering to resolve issues quickly.
• Ensure parameters and documentation match AS9100 requirements—no undocumented shop‑floor changes.

Documentation & Training

• Maintain accurate, controlled work instructions, setup guides, reflow profiles, SMT build sheets, and AOI specs.
• Train technicians, operators, and production staff on new processes and updates.
• Ensure all process documentation remains synchronized with current revision levels.

Equipment & Tooling Support

• Support preventive maintenance standards for process equipment.
• Assist in identifying and justifying capital equipment improvements.
• Design or source tooling, fixtures, and work aids as needed.

Qualifications

• Required Experience

• 2–5+ years of process engineering experience in PCB assembly or electronics manufacturing.
• Hands‑on SMT, reflow profiling, AOI programming, or selective solder experience.
• Strong understanding of soldering fundamentals, IPC‑A-610, J‑STD‑001, and general electronics manufacturing practices.
• Ability to read and interpret technical documents: BOMs, assembly drawings, schematics, and datasheets.
• Proficiency with data analysis, SPC, and problem‑solving tools.

• Preferred Experience

• High‑mix, low/medium‑volume PCB assembly environment.
• Aerospace/defense manufacturing or AS9100 familiarity.
• Experience with DOE, capability studies, or statistical analysis tools.
• Experience with fixture/tooling design (3D CAD skills a plus).
• ERP experience (Cetec preferred).

Key Competencies / Behaviors

• Floor‑first mentality: Visible, responsive, and deeply engaged with production.
• Technical depth: Understands why processes work—not just how.
• Data‑driven: Uses measured evidence to drive decisions and validate improvements.
• Documentation discipline: No undocumented changes or tribal knowledge workflows.
• Urgency: Moves fast when quality or production flow is at risk.
• Problem‑solving depth: Fixes root causes—doesn’t patch symptoms.
• Clear communicator: Direct, concise, and factual in updates and escalations.
• Ownership mindset: Treats yield and escapes as personal responsibilities.

Physical & Work Environment Requirements

• Extensive time on the production floor in SMT, soldering, and assembly areas.
• Occasional lifting of tooling, fixtures, or equipment components (~25 lbs).
• Work in ESD‑controlled environments with relevant PPE.