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Overnight Computer Chip Engineer Jobs in Alabama

Senior FPGA Engineer

Huntsville, AL · On-site

$86.80 - $165.20/hr

Embedded processor and System on a Chip development for FPGA devices. * Experience with Microblaze ... D. in Electrical or Computer Engineering (preferred). Benefits * Salary range: $86,800 - $165,200.

Electrical Engineer (Experienced, Lead)

Huntsville, AL · On-site

$157K - $164K/yr

... chip ( SOC ). * Familiar with high-speed serial interface protocol like ethernet, PCIe ... computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and ...

Electrical Engineer (Experienced, Lead)

Huntsville, AL · On-site

$157K - $164K/yr

... chip ( SOC ). * Familiar with high-speed serial interface protocol like ethernet, PCIe ... computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and ...

Electrical Engineer (Experienced, Lead)

Huntsville, AL · On-site

$157K - $164K/yr

... chip ( SOC ). * Familiar with high-speed serial interface protocol like ethernet, PCIe ... computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and ...

Electrical Engineer (Experienced, Lead)

Huntsville, AL · On-site

$157K - $164K/yr

... chip ( SOC ). * Familiar with high-speed serial interface protocol like ethernet, PCIe ... computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and ...

Senior Electrical Engineer

Birmingham, AL · On-site

$100K - $131K/yr

Knowledge of databases, data structures, computer networking is desirable as well as an aptitude to ... Some overnight travel may be required but this is not extensive. Knowledge, Skills & Abilities

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Overnight Computer Chip Engineer information

What is the difference between Overnight Computer Chip Engineer vs Day Shift Computer Chip Engineer?

AspectOvernight Computer Chip EngineerDay Shift Computer Chip Engineer
Work HoursNight shifts, typically overnightDaytime hours, standard business hours
Work EnvironmentManufacturing or R&D facilities during night shiftsSame facilities during daytime
CredentialsSimilar certifications, such as EE degrees and chip design experienceSame credentials as overnight roles
Industry UsageUsed in 24/7 manufacturing plants and R&D labsStandard daytime operations in tech companies

The main difference between Overnight Computer Chip Engineer and Day Shift Computer Chip Engineer lies in their work hours and shift timing. Both roles require similar skills, credentials, and are used in the same industry environments. The overnight position allows companies to maintain continuous production or development, while day shift roles are typical for standard working hours.

What are the most commonly searched types of Computer Chip Engineer jobs in Alabama?

The most popular types of Computer Chip Engineer jobs in Alabama are:

What are popular job titles related to Overnight Computer Chip Engineer jobs in Alabama?

For Overnight Computer Chip Engineer jobs in Alabama, the most frequently searched job titles are:

What job categories do people searching Overnight Computer Chip Engineer jobs in Alabama look for?

The top searched job categories for Overnight Computer Chip Engineer jobs in Alabama are:

What cities in Alabama are hiring for Overnight Computer Chip Engineer jobs?

Cities in Alabama with the most Overnight Computer Chip Engineer job openings:

Infographic showing various Overnight Computer Chip Engineer job openings in Alabama as of August 2026, with employment types broken down into 1% As Needed, 85% Full Time, 10% Part Time, 1% Temporary, 2% Contract, and 1% Nights. Highlights an 73% Physical, 2% Hybrid, and 25% Remote job distribution.

Principal Design Engineer

Sanmina Corporation

Huntsville, AL • On-site

$110 - $140/hr

Other

Posted 3 days ago

New


Sanmina rating

6.3

Company rating: 6.3 out of 10

Based on 40 frontline employees who took The Breakroom Quiz

139th of 160 rated electronics manufacturers


Job description

Job Summary

We are seeking a highly skilled PCBA Liquid Cooling Design Engineer to lead the development of innovative thermal management systems for advanced electronic assemblies. In this role, you will design direct-to-chip cold plates, custom fluid loops, and micro-channel systems that sit directly on high-density PCBAs. You will collaborate closely with hardware layout designers and manufacturing partners to build reliable, leak-free, and highly efficient cooling architectures.

Key Responsibilities
  • Thermal Solution Design: Architect and engineer board-level liquid cooling systems, including direct-to-chip cold plates, manifolds, and custom fittings.
  • Simulation & Analysis: Perform Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) using tools like Ansys Icepak, FloTherm, or Fluent to predict fluid dynamics, pressure drops, and thermal resistance.
  • Component Integration: Select and specify critical loop components such as pumps, quick-disconnect valves, hoses, and leak detection sensors.
  • PCBA Cross-Collaboration: Partner with PCB layout engineers to optimize component placement, layout thickness, and copper weight for maximum thermal dissipation.
  • Prototyping & Testing: Set up and execute hardware-level thermal validation tests, including hydrostatic pressure, leak/decay verification, and environmental chamber cycling.
  • Failure Analysis: Conduct root-cause analysis on structural stress, thermal throttling, galvanic corrosion, and fluid degradation.
  • DFM Optimization: Ensure designs comply with Design for Manufacturing (DFM) requirements to guarantee scalable assembly and fluid charging processes on the production line.
Required Technical Skills
  • CAD Software: Proficiency in 3D modeling tools like SolidWorks, PTC Creo, or Siemens NX for physical integration.
  • CFD/FEA Tools: Advanced skills in thermal simulation software such as Ansys Icepak, FloTherm, or SimScale.
  • PCBA Familiarity: Practical knowledge of PCB fabrication, electronic component layouts, and standard testing tools like oscilloscopes and multimeters.
  • Fluid Dynamics & Metallurgy: Strong grasp of single-phase/two-phase heat transfer, fluid flow behavior, and material compatibility (e.g., copper-to-coolant interactions).
  • Lab Equipment: Experience with flow meters, thermocouples, pressure transducers, and data acquisition (DAQ) systems.
Qualifications
  • Education: Masters degree in Mechanical Engineering, Thermal Engineering, or a highly related technical field.
  • Experience: 3+ years of experience specifically focused on electronic cooling, liquid loops, or data center thermal design.
  • Standards: Familiarity with international standards governing pressure vessels and electronics cooling, such as ASME, ISO, and ASHRAE guidelines.
Preferred Qualifications
  • Experience designing cooling for AI hardware clusters, high-performance computing (HPC) environments, or EV power electronics.
  • In-depth understanding of immersion cooling or phase-change cooling mechanisms.
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