Optoelectronics Jobs in California (NOW HIRING)

Principal Optoelectronic Packaging Engineer

Location: San Diego, CA | Santa Clara, CA | Colorado Springs, CO
Relocation Assistance Available: The preferred location for this position is in San Diego/Vista, CA. At this site, the salary range is $187,000 – $212,000 annually, based on experience, plus generous bonuses paid three times per year (February, August, and late fall).

A secondary option is in Santa Clara, CA, where the salary range is $220,000 – $250,000 annually, based on experience, plus the same bonus structure.

The third location is in Colorado Springs, CO, with a salary range of $159,000 – $180,000 annually, based on experience, plus bonuses as noted above.

Relocation assistance is available only for moves to the preferred location (San Diego/Vista, CA).

About the Opportunity

An industry-leading technology company is seeking a Principal Optoelectronic Packaging Engineer to lead the development of next-generation optical and photonic packaging solutions. This is a highly visible technical leadership role responsible for driving advanced packaging architectures, manufacturing processes, and technology roadmaps for innovative optoelectronic products serving commercial, aerospace, defense, telecommunications, and high-performance computing markets.

This position offers the opportunity to work with cutting-edge optical technologies while influencing product strategy from concept through production.

Key Responsibilities

• Lead the design and development of advanced optoelectronic packaging solutions for next-generation products.
• Develop packaging architectures utilizing semiconductor, optical, and interconnect technologies.
• Research and evaluate emerging materials, manufacturing processes, and packaging technologies.
• Drive process development efforts from prototype through high-volume manufacturing.
• Establish and document robust assembly and manufacturing processes using Design of Experiments (DOE), FMEA, and Six Sigma methodologies.
• Collaborate with engineering, operations, manufacturing, and product management teams to ensure successful product launches.
• Support reliability testing, qualification activities, and root cause investigations.
• Transfer scalable manufacturing processes to domestic and international production facilities.
• Mentor and develop engineers in packaging, assembly, and process development disciplines.
• Interface with suppliers, equipment vendors, and strategic technology partners.

Required Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or related technical discipline.
• 15+ years of engineering experience within optoelectronics, photonics, semiconductor packaging, microelectronics, or related advanced technology environments.
• Demonstrated experience developing complex packaging and assembly solutions for optical, photonic, or semiconductor products.
• Strong understanding of materials, interconnect technologies, and assembly processes.
• Experience supporting products from research and development through manufacturing transfer.
• Knowledge of reliability testing, failure analysis, and process qualification methodologies.
• Excellent communication, leadership, and cross-functional collaboration skills.

Preferred Qualifications

• Experience with optical transceivers, photonic integrated circuits (PICs), silicon photonics, or optical modules.
• Knowledge of advanced packaging technologies such as flip-chip, wire bonding, die attach, wafer-level packaging, 2.5D/3D integration, or heterogeneous integration.
• Experience with automated assembly equipment and manufacturing process optimization.
• Six Sigma, Lean Manufacturing, or Design for Manufacturability (DFM) experience.
• Background supporting aerospace, defense, telecommunications, data center, or high-performance computing applications.

What You'll Bring

• Technical leadership and innovation mindset.
• Ability to translate emerging technologies into manufacturable products.
• Strong analytical and problem-solving capabilities.
• Passion for developing next-generation photonic and optoelectronic solutions.
• Ability to thrive in a collaborative, fast-paced engineering environment.

Competitive compensation, performance bonuses, comprehensive benefits, retirement programs, and relocation assistance available.

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