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Technical Link

RFIC Engineer

San Diego, CA · On-site

... on-Si processes to achieve breakthroughs in power density and energy efficiency for 5G/6G and SATCOM CPE. * Advanced PA Design: Execute high-performance MMIC/Hybrid PA designs for mobile RF front ...

Wanco, Inc.

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Systems Integration & Test Specialist

Arvada, CO · On-site

$65K - $110K/yr

In this role, you will own the assembly, integration, and validation of our mobile solar light ... Serve as the subject matter expert on Victron Energy systems (MPPT controllers, inverters, Cerbo GX ...

Ayar Labs

Sr. Principal Engineer, SoC Architect

San Jose, CA · On-site

$250K - $304K/yr

... of the energy needed to fuel the explosive growth of AI models. Backed by industry giants like ... Familiarity with automotive, AI/ML, datacenter, networking, or mobile SoC platforms. * Publications ...

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As of Jul 28, 2026, the average hourly pay for mobile si energy in the United States is $25.32, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $20.19 per hour, depending on experience, location, and employer.
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RFIC Engineer

RFIC Engineer

Technical Link

San Diego, CA • On-site

Other

Posted 6 days ago

Job description

Job DescriptionKey Responsibilities

  • IP Development: Identify and document novel circuit architectures and design techniques to contribute to the company''s growing Intellectual Property (IP) portfolio.

  • Technology Integration: Utilize E-Mode GaN-on-Si processes to achieve breakthroughs in power density and energy efficiency for 5G/6G and SATCOM CPE.

  • Advanced PA Design: Execute high-performance MMIC/Hybrid PA designs for mobile RF front ends, optimized for Envelope Tracking (ET) and Average Power Tracking (APT) operation.

  • End-to-End Development: Contribute to the full design lifecycle, including architecture support, tape-out, prototype characterization, and debugging for high-volume production.

  • Collaboration: Work cross-functionally to document designs and ensure thermal management strategies are integrated into high-power density applications.

Qualifications & Skills

  • Master''s or PhD in Electrical Engineering, RF/Microwave Engineering, or Physics.

  • 20+ years of experience in RF semiconductor design, with a proven track record of shipping high-volume PA products for the global smartphone market.

  • Strong teamwork, communication, organization, and documentation skills.

  • In-depth understanding of RFFE requirements for Tier-1 smartphone OEMs and current 3GPP standards.

  • Proven ability to develop creative solutions for complex RF challenges, supporting the development of internal design specifications and patentable innovations.

Technical Expertise

  • Device Physics: Mastery of GaN (preferred), III/V (GaAs), or SOI compound semiconductor device physics and advanced modeling.

  • Thermal Design: Deep understanding of thermal management strategies for high-power density applications in flip-chip configurations.

  • EDA Tools: Expert proficiency with Keysight ADS and Ansys HFSS for MMIC and laminate co-simulation.

  • Linearity Management: Expertise in balancing Noise Figure (NF), Gain, and Input Third-Order Intercept Point (IIP3) for high-performance mobile RF front ends.

  • Hands-on experience with RF/microwave test equipment, including network analyzers, probe stations, source/load pull systems, noise figure measurement equipment, and signal sources/analyzers for modulated signals.

  • Familiarity with noise theory is a plus, including Low Noise Amplifier (LNA) design, impedance matching, and understanding the impact of parasitic losses on Noise Figure (NF).

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