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Mobile Amkor Jobs (NOW HIRING)

$150 - $210/hr

... and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea. Essential Duties and Responsibilities: * Drive and ...

... the mobile communications and computing space * Establish close relationships with key decision makers at various levels and groups within Amkor and the customer * Establish annual revenue and ...

... and mobile market segments. The successful candidate will serve as a senior customer-facing leader and primary interface with Tier 1 customers, Amkor's global R&D centers, and cross-functional ...

Mobile Amkor information

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$10

$60

$93

How much do mobile amkor jobs pay per hour?

As of Aug 27, 2026, the average hourly pay for mobile amkor in the United States is $60.14, according to ZipRecruiter salary data. Most workers in this role earn between $45.67 and $78.37 per hour, depending on experience, location, and employer.

What is the difference between Mobile Amkor vs Mobile Test Engineer?

AspectMobile AmkorMobile Test Engineer
CredentialsElectronics or Electrical Engineering degree, certifications in testing or quality assuranceElectronics or Computer Engineering degree, certifications in testing or QA
Work EnvironmentManufacturing facilities, semiconductor packaging plantsDesign labs, testing facilities, R&D departments
Industry UsageSemiconductor manufacturing, electronics assemblyMobile device testing, software/hardware validation

Mobile Amkor professionals focus on semiconductor packaging and manufacturing processes, often working in production environments. In contrast, Mobile Test Engineers primarily work on testing mobile devices or components, ensuring functionality and quality. While both roles require technical knowledge and certifications, their work environments and specific responsibilities differ significantly.

What are the most commonly searched types of Amkor jobs?

The most popular types of Amkor jobs are:

Infographic showing various Mobile Amkor job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 71% Full Time, 18% Part Time, 9% Contract, and 1% Nights. Highlights an 94% Physical, 1% Hybrid, and 5% Remote job distribution, with an average salary of $125,095 per year, or $60.1 per hour.

Director, Chiplets/FCBGA Integration Amkor Technology Advancing What's Next

Semiconductor Engineering

On-site

$150 - $210/hr

Other

Posted 9 days ago


Job description

Position Summary:

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor’s leading edge R&D center in South Korea.


Essential Duties and Responsibilities:
  • Drive and coordinate development activities with customers, in conjunction with Amkor’s R&D development teams in Korea.
  • Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
  • Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
  • Manage customer product management through the development phase and into initial production ramp.

Required Qualifications:
  • Bachelor’s Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master’s degree is a plus.
  • 10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging.
  • The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages.
  • A working knowledge of mechanical stress/strain and IC package warpage is required.
  • Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required.
  • Excellent written and verbal communication skills are needed.
  • This position requires 10-20% travel including domestic and international travel.

Preferred Qualifications:
  • Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
  • Mechanical or Thermal simulation experience.
  • Familiarity with Design of Experiments and Statistical Process Control.

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.


Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.

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