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Reporting to the Senior Vice President, Parts Operations, this role serves as the organization's technical authority for component-level electronics repair, reverse engineering, failure analysis, and repair methodology development. The successful candidate will possess expert-level expertise in component-level troubleshooting, multilayer PCB repair, advanced surface-mount rework, BGA/FPGA replacement, and the development of innovative repair solutions where OEM documentation is unavailable. Working collaboratively with Operations, Technical Support, and Field Service, the Senior Electronics Repair Engineer develops standardized repair methodologies and engineering solutions that improve repair quality, increase first-pass yield, reduce replacement costs, expand Probo Medical's advanced repair capabilities, and extend the operational life of critical medical imaging equipment supporting healthcare providers worldwide.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Diagnose, troubleshoot, and repair complex multilayer PCB assemblies to the component level utilizing advanced engineering diagnostic techniques. 
• Perform precision surface mount rework, BGA/FPGA replacement, thermal profile development, and advanced PCB restoration including trace, pad, via, and multilayer interconnect reconstruction. 
• Perform advanced troubleshooting of analog, digital, mixed-signal, RF, embedded, and power electronic circuits utilizing oscilloscopes, logic analyzers, X-ray inspection systems, and other engineering diagnostic equipment. 
• Reverse engineer electronic assemblies and develop validated repair methodologies, engineering work instructions, electrical test procedures, and technical documentation where OEM documentation is unavailable. 
• Perform engineering-level failure analysis, identify recurring failure modes, and implement corrective actions that improve repair quality, reliability, and first-pass yield. 
• Execute precision rework of fine-pitch surface-mount components, including QFP, QFN, CSP, BGA, and FPGA devices, utilizing advanced rework systems such as the Ersa HR600 XL and Ersa IR/PL650A. 
• Remove, reball, replace, and functionally verify FPGA and BGA devices while developing and optimizing thermal profiles for complex multilayer PCB assemblies. 
• Collaborate with Quality, Operations, Technical Support, Supply Chain, and Field Service to develop new repair capabilities and improve engineering processes. 
• Ensure compliance with ISO 13485 Quality Management System requirements, ESD standards, and established engineering documentation practices. 
• Evaluate emerging repair technologies, equipment, and engineering techniques that expand the organization's advanced electronics repair capabilities.

Primary job responsibilities are those which an employee must be able to perform with or without accommodation. The list of requirements, duties and responsibilities is not exhaustive but is the most accurate list for the current job. Probo Medical reserves the right to revise the job description as well as require that other duties be performed as needed.

Required Education and Experience:

• High School Diploma/GED, or equivalent from two-year university or technical school; or a minimum of 5 years of related experience to the work activities or equivalent combination of education and experience. 
• Exceptional analytical, troubleshooting, and engineering problem-solving abilities with the technical judgment to independently resolve highly complex electronic failures. 
• Meticulous attention to detail and an uncompromising commitment to quality, reliability, and engineering excellence. 
• Excellent technical communication and documentation skills with the ability to effectively communicate complex engineering concepts across cross-functional teams. 
• Demonstrated innovation and creativity in developing new repair methodologies, solving unsupported electronic failures, and driving continuous improvement. 
• Strong technical leadership with the ability to mentor engineers and technicians while serving as a trusted subject matter expert in advanced electronics repair. 
• Exceptional analytical, troubleshooting, and engineering problem-solving abilities with the technical judgment to independently resolve highly complex electronic failures. 
• Meticulous attention to detail and an uncompromising commitment to quality, reliability, and engineering excellence. 
• Excellent technical communication and documentation skills with the ability to effectively communicate complex engineering concepts across cross-functional teams. 
• Demonstrated innovation and creativity in developing new repair methodologies, solving unsupported electronic failures, and driving continuous improvement. 
• Strong technical leadership with the ability to mentor engineers and technicians while serving as a trusted subject matter expert in advanced electronics repair. 

Preferred Education and Experience:

• Degree in Electronics or related engineering field preferred.
• Extensive experience in advanced component-level repair of complex multilayer printed circuit board assemblies (PCBAs).
• Experience diagnosing and repairing high-density analog, digital, mixed-signal, RF, embedded, and power electronic assemblies utilizing advanced troubleshooting, BGA/FPGA rework, multilayer PCB restoration, reverse engineering, and engineering-level failure analysis. 
• Experience supporting diagnostic medical imaging, aerospace, defense, semiconductor manufacturing equipment, industrial automation, or other high-reliability electronic systems.
• Preferred Certificates and Standards:
• Working knowledge of IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs), including BGA assembly, inspection, thermal profiling, re-balling, and advanced FPGA/BGA rework best practices 
• IPC-A-610 - Acceptability of Electronic Assemblies 
• IPC J-STD-001 - Requirements for Soldered Electrical and Electronic Assemblies 
• IPC-7711/7721 - Rework, Repair and Modification of Electronic Assemblies 
• ANSI/ESD S20.20 Electrostatic Discharge Control 

TRAVEL REQUIREMENTS

• No travel requirements specified 

WORK ENVIRONMENT  

The work environment characteristics described here are representative of those an individual encounters while performing the essential functions of this position. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions of the job.

• Monitor the typical office/field safety and environmental conditions within the designated facility and report deficient conditions if needed in accordance with the PROBO Safety Manual.  

The physical and mental requirements described here are representative of those that must be met by an individual to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions of the job.

• Ability to lift, carry and move various items of a minimum of 40 lbs. while utilizing proper technique. 
• While performing the essential functions of this job, the employee is frequently required to stand, walk, sit. 
• The employee must have use of hands and fingers and be able to reach with hands and arms, speak and hear.
• Required to stoop, kneel or crouch and bend. 
• Ability to perform precision component-level electronics repair for extended periods. 
• Manual dexterity and visual acuity required for microscopic inspection and precision soldering. 
• Ability to safely operate within an ESD-controlled engineering laboratory using specialized repair and test equipment. 
• Ability to comply with all Environmental, Health, and Safety (EHS) policies, procedures, and PPE requirements.

Equal Opportunity Employer/Vet/Disabled. 

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