About the Role Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the ... Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
About the Role Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the ... Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
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Manufacturing Quality Manager
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... quantum computing, radars, railway, space, test and measurement, wireless infrastructure and 5G, and more.
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Be Seen First
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... Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and ... Manage full customer engagement lifecycle from initial design award through development, ramp, high ...
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Senior Engineer, Chips About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative ... Manage spare parts usage, assist with parts ordering, and work with vendors for field service ...
Senior Supply Chain Business Analyst
$142K - $200K/yr
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$142K - $200K/yr
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Phoenix, AZ · On-site
$135K/yr
Intel put Silicon in Silicon Valley. No one else is obsessed with engineering and has a brighter ... management. * Hands on experience with industry standard formal verification tools such as ...
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Phoenix, AZ · On-site
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About the Role The CEG NAG (Networking Architecture Group) is Intel's premier team focused on ... computing systems. We are seeking a Senior SoC Network Subsystem Architect to define and lead the ...
New
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New
Packaging Module Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
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Phoenix, AZ · On-site
$115K - $219K/yr
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Intel Corporation is the world's largest semiconductor company and a technology leader driving ... Collaborative leadership style with experience managing stakeholder relationships across different ...
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Phoenix, AZ · On-site
$76K - $104K/yr
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$135K/yr
... of computing and connectivity. As a key contributor to Intel's cutting-edge technology, you will ... management system to ensure traceability and efficient collaboration. - Conduct reviews with ...
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Phoenix, AZ · On-site
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Director of Manufacturing Operations About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an ... risk management Required Skills and Experience * Bachelor's degree in Electrical Engineering ...
Director of Manufacturing Operations About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an ... risk management Required Skills and Experience * Bachelor's degree in Electrical Engineering ...
About the Role Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the ... Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
About the Role Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the ... Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
About the Role The CEG NAG (Networking Architecture Group) is Intel's premier team focused on ... computing systems. We are seeking a Senior SoC Compute/Memory Subsystem Architect to define and ...
New
About the Role The CEG NAG (Networking Architecture Group) is Intel's premier team focused on ... computing systems. We are seeking a Senior SoC Compute/Memory Subsystem Architect to define and ...
New
Director of Manufacturing Operations About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an ... risk management Required Skills and Experience * Bachelor's degree in Electrical Engineering ...
Director of Manufacturing Operations About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an ... risk management Required Skills and Experience * Bachelor's degree in Electrical Engineering ...
This position not eligible for Intel immigration sponsorship. Minimum Qualifications: * Bachelor's degree in Supply Chain Management, Engineering, Operations, Business Administration, Data Analytics ...
This position not eligible for Intel immigration sponsorship. Minimum Qualifications: * Bachelor's degree in Supply Chain Management, Engineering, Operations, Business Administration, Data Analytics ...
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers ...
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers ...
Manager Intel Quantum Computing information
Is quantum computing a millionaire maker?
Is quantum computing well paying?
What is the difference between Manager Intel Quantum Computing vs Quantum Software Engineer?
| Aspect | Manager Intel Quantum Computing | Quantum Software Engineer |
|---|---|---|
| Required Credentials | Advanced degree in Computer Science, Physics, or related field; leadership experience | Degree in Computer Science, Physics, or Engineering; programming skills in quantum languages |
| Work Environment | Team leadership, project management, collaboration with R&D teams | Developing and testing quantum algorithms, coding in Qiskit, Cirq, or similar |
| Employer & Industry Usage | Research labs, tech companies, industry R&D departments | Tech firms, startups, research institutions focused on quantum software development |
The main difference is that the Manager Intel Quantum Computing oversees projects and teams, focusing on strategy and coordination, while the Quantum Software Engineer concentrates on developing and implementing quantum algorithms. Both roles require technical knowledge, but their responsibilities and work focus differ significantly.
How hard is it to get hired at Intel?
What is the highest paying job in Intel?
Full-time
Medical, Retirement, PTO
Posted 7 days ago
Intel rating
8.8
Based on 143 frontline employees who took The Breakroom Quiz
8th of 139 rated electronics manufacturers
Job description
About the Role
Join Intel's Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions.
Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.
What You'll Do
Key responsibilities will include but not limited to:
- Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
- Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
- Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity, mechanical forces)
- Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions
- Define equipment specifications and partner with vendors to meet technical and performance requirements
- Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques
- Lead technical problem-solving efforts and contribute to process innovation initiatives
- Document findings and best practices through technical reports and knowledge-sharing forums
- Support standardization of qualification processes, quality systems, and engineering methodologies
Behavioral traits that we are looking for:
- Strong analytical and problem-solving mindset
- Effective written and verbal communication skills
- Ability to work independently and collaboratively in a team environment
- Adaptability in a fast-paced, innovation-driven setting
- Continuous improvement mindset with attention to detail
Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
See Intel Benefitsfor more details.
Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Note:
For information on Intel's immigration sponsorship guidelines, please see
Intel U.S. Immigration Sponsorship Information
Minimum Qualifications and Experience:
Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. Or a Master's degree in the same field with 2 years of experience and a PhD in the same field.
Your experience described above must be in the following:
- Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Mechanical design software such as SolidWorks or AutoCAD.
- Mechanical drawings and Geometric Dimensioning and Tolerancing.
Preferred Qualifications and Experience:
- Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
- Experience with high-precision manufacturing methods, including stamping and CNC machining.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Previous related work experience in a semiconductor foundry preferred.
Be part of Intel's mission to innovate and advance the future of technology. Apply today to make an impact and shape the future of packaging solutions.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968