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Ltd Module Development Engineer Jobs in Arizona (NOW HIRING)

Module Engineering Managers TSMC is looking for managers in the following modules: CMP, CVD ... development * 8 years of overall experience in semiconductor industry * BS degree in an engineering ...

Module Engineering Managers TSMC is looking for managers in the following modules: CMP, CVD ... development * 8 years of overall experience in semiconductor industry * BS degree in an engineering ...

Senior Software Engineer

Tempe, AZ · On-site

$205K - $307K/yr

Operating under a DevOps model, the team is responsible for supporting existing software and ... Experience with Nginx configuration and module development * Experience with Cloud services (AWS ...

You will have engineering product ownership, with the need for implementing feasible designs ... You will work with extended quality, R&D and manufacturing organizations to ensure the highest ...

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Ltd Module Development Engineer information

See Arizona salary details

$45.7K

$89.6K

$143K

How much do ltd module development engineer jobs pay per year?

As of Jun 11, 2026, the average yearly pay for ltd module development engineer in Arizona is $89,605.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,100.00 and $99,200.00 per year, depending on experience, location, and employer.

What is an Ltd Module Development Engineer?

An Ltd Module Development Engineer is a professional who specializes in the design, development, and optimization of specific modules or components within a larger technical system, often in industries like semiconductors or electronics manufacturing. Their role typically involves collaborating with cross-functional teams to develop process modules, ensuring they meet performance, reliability, and quality standards. They may also troubleshoot issues, implement improvements, and support the integration of new technologies or processes into production environments. This position requires strong technical skills, problem-solving abilities, and knowledge of industry standards.

What are some typical challenges faced by an Ltd Module Development Engineer when integrating new technologies into existing manufacturing processes?

Ltd Module Development Engineers often encounter challenges when introducing new technologies, such as aligning new module designs with legacy systems and ensuring seamless compatibility. They must address issues related to process optimization, troubleshooting unanticipated technical problems, and collaborating closely with cross-functional teams like process engineers, quality assurance, and production staff. Effective communication and adaptability are key, as balancing innovation with manufacturing constraints is a regular part of the role. Overcoming these challenges provides valuable experience and can open doors to senior engineering or technical leadership positions.

What are the key skills and qualifications needed to thrive as a Ltd Module Development Engineer, and why are they important?

To thrive as a Ltd Module Development Engineer, you need a strong background in engineering principles, semiconductor process knowledge, and typically a degree in materials science, chemical engineering, or a related field. Familiarity with semiconductor fabrication tools, statistical process control (SPC) software, and industry-specific certifications such as Six Sigma can be highly beneficial. Strong problem-solving skills, teamwork, and effective communication are crucial soft skills for success in collaborative and fast-evolving technical environments. These skills and qualifications are important for ensuring robust process development, rapid problem resolution, and innovation in semiconductor manufacturing.
TD Media and Collaterals Development Engineer

TD Media and Collaterals Development Engineer

Intel Corporation

Phoenix, AZ • On-site

$115K - $162K/yr

Full-time

Medical, Retirement, PTO

Posted 9 days ago


Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers


Job description

Job Details:
Job Description:
Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral quality and reliability. Performs and influences media and collateral design, material selection and prototype development to meet assembly module needs, based on fundamental understanding of failure mechanisms. Provides consultation concerning design problems and improvements in the assembly packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Possess a BS/MS/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field.
• Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Preferred Qualifications:
• Strong mechanical design software experience (SolidWorks, AutoCAD, etc)
• Portfolio of self-completed project examples from concept to fabrication
• Assembly equipment, process, media, and/or collateral experience
• Technical innovation and deliver results for complex, time critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968