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Ltd Module Development Engineer Jobs in Arizona (NOW HIRING)

AWS infra engineer Job Location: Phoenix AZ Job Type: Contract * Strong understanding and ... Terraform module development Should have built AWS services modules and provisioned the services on ...

The Role and Impact Join • • • • • as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This ...

The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers ...

Terraform module development Should have built AWS services modules and provisioned the services on AWS through terraform Mandatory Skills : AWS Lambda,AWS S3,AWS Database Service,AWS Infra Services ...

Terraform module development Should have built AWS services modules and provisioned the services on AWS through terraform Mandatory Skills : AWS Lambda,AWS S3,AWS Database Service,AWS Infra Services ...

... module development Should have built AWS services modules and provisioned the services on AWS through terraform Mandatory Skills : AWS Lambda,AWS S3,AWS Database Service,AWS Infra Services,AWS VPC ...

As such, your role may include elements of module-level process development in support of the ... Engineering experience in the semiconductor industry. * Experience supporting high-volume ...

Showing results 21-40

Ltd Module Development Engineer information

See Arizona salary details

$45.7K

$89.6K

$143K

How much do ltd module development engineer jobs pay per year?

As of Sep 9, 2026, the average yearly pay for ltd module development engineer in Arizona is $89,605.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,100.00 and $99,200.00 per year, depending on experience, location, and employer.

What is an Ltd Module Development Engineer?

An Ltd Module Development Engineer is a professional who specializes in the design, development, and optimization of specific modules or components within a larger technical system, often in industries like semiconductors or electronics manufacturing. Their role typically involves collaborating with cross-functional teams to develop process modules, ensuring they meet performance, reliability, and quality standards. They may also troubleshoot issues, implement improvements, and support the integration of new technologies or processes into production environments. This position requires strong technical skills, problem-solving abilities, and knowledge of industry standards.

What are the key skills and qualifications needed to thrive as a Ltd Module Development Engineer?

To thrive as a Ltd Module Development Engineer, you need a strong background in engineering principles, semiconductor process knowledge, and typically a degree in materials science, chemical engineering, or a related field. Familiarity with semiconductor fabrication tools, statistical process control (SPC) software, and industry-specific certifications such as Six Sigma can be highly beneficial. Strong problem-solving skills, teamwork, and effective communication are crucial soft skills for success in collaborative and fast-evolving technical environments. These skills and qualifications are important for ensuring robust process development, rapid problem resolution, and innovation in semiconductor manufacturing.

What are some typical challenges faced by an Ltd Module Development Engineer when integrating new technologies into existing manufacturing processes?

Ltd Module Development Engineers often encounter challenges when introducing new technologies, such as aligning new module designs with legacy systems and ensuring seamless compatibility. They must address issues related to process optimization, troubleshooting unanticipated technical problems, and collaborating closely with cross-functional teams like process engineers, quality assurance, and production staff. Effective communication and adaptability are key, as balancing innovation with manufacturing constraints is a regular part of the role. Overcoming these challenges provides valuable experience and can open doors to senior engineering or technical leadership positions.
Infographic showing various Ltd Module Development Engineer job openings in Arizona as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $89,605 per year, or $43.1 per hour.

ATD MIHL Equipment Development Engineer

Phoenix, AZ • On-site

Intel Corporation
Manufacturing • 10K+ employees

Full-time

Medical, Retirement, PTO

Re-posted 19 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

18th of 161 rated electronics manufacturers


Job description

Job Details:
Job Description:
The Role and Impact
Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.
Business group
Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.
Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer
- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
- Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
- Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
- Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
- Lead problem-solving initiatives and drive continuous improvement in equipment and processes.
- Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
- Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. This position is not eligible for Intel immigration sponsorship.
Minimum Qualifications
  • Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
  • -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
  • -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.

Relevant experience should include any of following:
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
- Competency in mechanical design software such as SolidWorks or AutoCAD.
Preferred Qualifications
- Proven ability to lead technical innovation and manage complex, time-sensitive projects.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Experience with high-precision manufacturing methods, including stamping and CNC machining.
Join Intel's team of innovators and contribute to defining the future of technology. Apply now to make your mark and help shape industry-leading packaging solutions.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968