Japan Materials Science Jobs in Oregon (NOW HIRING)

JOB DESCRIPTION SUMMARY:

The Process Engineer  IV position is located in Hillsboro, OR and supports the business objectives of  Semiconductor Equipment Division (SED) related to sales of Reactive Ion Etch (RIE or Plasma Etch) equipment to the semiconductor industry.  This position’s main objective is to provide process engineering support to SED’s various cross-functional teams, demonstration labs, customer activities, and development programs.

The position will join one of two process engineering teams supporting advanced process nodes (2nm, 14A, 10A and beyond) in FEOL and BEOL dry etch modules.

• The Demo Team supports development of  advanced dry etch processes that win customer tool-of-record selections by rapidly executing process development, optimization, and DOE-driven tuning to meet customer specifications, performance targets, and device integration requirements. 
• The Productivity Team supports the ramp of advanced high-volume manufacturing (HVM) etch processes through development, sustaining, troubleshooting, and customer escalation support ensuring etch module performance meets productivity, defectivity, availability, and cost-of-ownership requirements.

PRIMARY RESPONSIBILITIES

• Perform all responsibilities in a safe manner. Comply with all company policies including Environmental, Health, and Safety procedures and requirements. Protect company intellectual property and confidential information.
• Quickly learn, train, and upskill to latest equipment and technology. Ability to learn through on-the-job training. Establish and maintain an awareness of maintenance and lab procedures.
• Responsible for hands-on process engineering development, research, and evaluation support to deliver solutions that meet or exceed customer requirements for current and future technology semiconductor manufacturing processes. Work with a team on projects and development-related tasks, including data collection, analysis, and reporting to meet customer expectations.
• Ability to work within a matrix environment. Interface with internal customers, managers, and teammates within the organization.
• Hold a position-relevant understanding of the relationships between plasma principals, etch fundamentals, and hardware functionality and relates them to process/project impact.
• Hold a position-relevant understanding of business context, technology and industry trends, and competitor capabilities.
• Professionally represents the company to the customer; able to create internal and external documentation for projects and products, including presentations, technical reports, and process engineering specifications. 
•  Responsible for hands-on process engineering development, research, and evaluation support to deliver solutions that meet or exceed customer requirements for current and future technology semiconductor manufacturing processes.  Performs project and development related tasks including data collection, analysis, and reporting. The position is expected to be able to drive multiple projects simultaneously with a high level of autonomy; ensuring that necessary support is given to meet customer expectations.
•  Ability to work within a matrix environment. Acts as a resource across the department working with diverse stakeholders across multiple teams, and lead cross-team or cross group efforts involving more people.  May lead small projects with manageable risks and resource requirements. 
•  Supports customer account and technology managers in support of product demos and other business development activities.  May be expected to interface with Hitachi’s global engineering teams and their corporate R&D headquarters in Japan.   

EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS

• BS, MS, or PhD Degree in Chemical Engineering, Materials Science, Physics, or related field

EXPERIENCE AND TRAVEL REQUIREMENTS

• Prior work experience is required. Experience developing plasma etch processes for semiconductors or other processes utilizing semiconductor manufacturing equipment is preferred.
• Experience working with semiconductor equipment is highly desirable.
• Experience working in a cleanroom or Fab is highly desirable.
• Minimum travel required (<5%). Some travel will be required for onsite customer support and training, including possible travel to Japan.
•  PhD with 3+ years of relevant work experience; or MS with 6+ years of relevant work experience; or BS with 8+ years of relevant work experience. Plasma Etch Process Experience and/or semiconductor processing preferred.
• Possible travel to Japan for training or customer sites worldwide as needed.  The employee must be willing to travel to Japan for specific training and/or projects as necessary. 

SKILLS AND ABILITIES REQUIREMENTS

• Ability to learn and understand dry etch/RIE and plasma science at an advanced level.
• Familiarity with a variety of metrology and characterization methods used in the semiconductor industry.
• Proficient engineering analytical and problem-solving skills. Understanding of and experience with the Scientific Method. In-depth understanding of Statistical Process Control (SPC) and Design of Experiments (DOE).
• Familiarity with working in a laboratory and ability to work in a clean room environment for extended hours.
• Ability to perform tasks requiring a high degree of manual dexterity. Ability to learn and operate Hitachi plasma etch systems and all associated metrology equipment involved in performing process engineering development projects and train new engineers in the use of these toolsets.
• Effective organization skills and demonstrated flexibility to adapt to shifting priorities to meet business needs and deadlines.
• Demonstrated proactive mindset, dependability, and ability to drive projects to completion with on-time delivery of milestones.
• Demonstrated excellent work ethic and self-motivation with the ability to focus on both accuracy and output in a complex and matrix work environment.  Tolerance of ambiguity and flexibility to adapt to new situations. Be reliable and independent, as well as work within a team and support each other.
• Excellent collaboration ability in a team environment. Must possess the ability to professionally build effective relationships with internal and external customers, vendors, and other stakeholders.  Ability to connect with and maintain effective working relationships with management team and other employees.
• Ability to work overtime, shift work, and/or flexible schedule as needed.
• Excellent time management abilities, including but not limited to punctuality for work and training, on-time completion of assignments, and strong preparation for assignments
• Proactively protects IP/confidentiality.
• Ability to adapt to new procedures concerning work in the facility. Create and maintain technical and/or procedural documentation.
• Maintain appropriate records and documentation for all work performed.
• Portray professionalism and pride in appearance while conforming to policy.
• Provide a positive attitude to all employees and customers.
• Demonstrated commitment to valuing diversity and contributing to an inclusive working and learning environment.
• Advanced understanding and experience with dry etch/RIE and plasma science.
•  Familiarity with a variety of metrology and characterization methods used in the semiconductor industry.
•  Strong engineering analytical/problem solving skills.  Understanding of Scientific Method and experience using it. In depth understanding of statistical process control (SPC) and design of experiments (DOE).

ES&H Technical Services, L.L.C. is an affiliate and a division of ES&H. Specifically; it is a semiconductor consulting company and a staff augmentation company offering high quality services at modest prices.
ES&H Technical Services, L.L.C. provides professional domestic engineering and technician personnel throughout the United States. Our customers include Semiconductor Original Equipment Manufacturers (OEM) and Integrated Devise Manufacturers (IDM).