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We are seeking a German intern/trainee (Praktikant - w/m/d) for our US offices. The internship will ... Internships abroad as well as other additional qualifications are an advantage Who we serve : Our ...

Intern - International

Montgomery, AL

$14.75 - $19.75/hr

Job Title - Internship - International Abroad Location - Various International Locations What You ... Personal coaching from an intern champion who cares about you and your career * Leaders who listen

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Program Management Intern - SiC Power Modules

Program Management Intern - SiC Power Modules

Navitas Semiconductor

Irvine, CA • On-site

$25 - $40/hr

Other

Re-posted 23 days ago


Job description

Job Purpose:

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.

With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications. 

We are seeking a high-performing graduate-level intern to join our Program Management team supporting the development of high-power SiC-based modules for AI infrastructure and electrification applications. The intern will take an active role in our New Product Introduction (NPI) process — coordinating cross-functional teams, tracking program milestones, and engaging directly with semiconductor suppliers to drive development projects to launch on time and within specification.

Key Responsibilities and Duties:

  • Lead and support NPI program management activities for SiC high-power module development programs targeting AI and electrification end markets.
  • Own and maintain detailed program schedules, milestone trackers, and risk registers to ensure programs launch on time and within technical specifications.
  • Coordinate and communicate with suppliers, manufacturing partners, and internal stakeholders to align on program requirements and deliverables.
  • Execute and refine the NPI process gate reviews — including design reviews, qualification milestones, and product release criteria.
  • Collaborate cross-functionally with R&D, applications engineering, operations, and quality teams to track action items and resolve program blockers.
  • Prepare executive program status reports, dashboards, and presentations for senior leadership review.
  • Support supplier development activities including monitoring qualification progress, tracking sample deliveries, and facilitating corrective action plans.
Minimum Qualifications
  • BS in Electrical Engineering (required); currently enrolled in or accepted to a graduate-level MS or PhD program in Electrical Engineering, Power Electronics, or closely related discipline.
  • Ability to communicate clearly with the internal team and external suppliers abroad. Professional, articulate speaking skills required.
  • Foundational knowledge of semiconductor device physics, power electronics, or semiconductor manufacturing processes.
  • Strong organizational and communication skills with demonstrated ability to manage multiple concurrent tasks and deadlines.
  • Proficiency in Microsoft Office Suite (Excel, PowerPoint, Project) and/or project management tools (e.g., Asana, Jira, Smartsheet).
  • Expert at using AI tools to assist in automating tasks and ideation (Copilot, Claude, PowerAutomate, PowerBI are preferred)
Preferred Qualifications
  • Prior internship, co-op, or research experience within the semiconductor, power electronics, or hardware product development industry.
  • Familiarity with Silicon Carbide (SiC) or Wide Bandgap (WBG) semiconductor technologies, process flows, or device characterization.
  • Exposure to NPI, stage-gate, or structured product development processes in a technology or hardware environment.
  • Understanding of power module packaging concepts (e.g., substrate types, thermal management, module assembly) for high-power applications.
  • Experience working in cross-functional or cross-cultural teams; prior exposure to Asia-Pacific supplier ecosystems is a plus.
  • Coursework or research in AI hardware, power conversion systems, or electrification platforms (EV, data center, renewable energy).