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Intel Wafer Level Assembly Jobs (NOW HIRING)

INTEL

Module Development Engineer

Hillsboro, OR

$109K - $154K/yr

Experience in direct wafer-level assembly module engineering or fab process and hardware technology ... Intel's advanced manufacturing technologies. Explore how your skills and expertise can shape the ...

INTEL

Module Development Engineer

Portland, OR

$109K - $154K/yr

Experience in direct wafer-level assembly module engineering or fab process and hardware technology ... Intel's advanced manufacturing technologies. Explore how your skills and expertise can shape the ...

Intel

Module Development Engineer

Hillsboro, OR · On-site

Join Intel as a Module Development Engineer and become a key driver in advancing cutting-edge ... Experience in direct wafer-level assembly module engineering or fab process and hardware technology ...

INTEL

Module Development Engineer

Vernonia, OR

$109K - $154K/yr

Experience in direct wafer-level assembly module engineering or fab process and hardware technology ... Intel's advanced manufacturing technologies. Explore how your skills and expertise can shape the ...

INTEL

Module Development Engineer

Lafayette, OR

$109K - $154K/yr

Experience in direct wafer-level assembly module engineering or fab process and hardware technology ... Intel's advanced manufacturing technologies. Explore how your skills and expertise can shape the ...

Intel

WLA Yield Defect Metrology Engineer

Hillsboro, OR · On-site

... Intel's global network of semiconductor fabrication, assembly and test plants. This role requires regular onsite presence to fulfill essential job responsibilities. The Inline Wafer Level Assembly ...

Intel

WLA Yield Analysis Systems Eng

Hillsboro, OR

$98K - $193K/yr

Experience with Intel's wafer defect metrology and analysis ecosystem * Experience with Industry ... and assembly. We ensure our foundry customers' products receive our utmost focus in terms of ...

Intel

WLA Yield Analysis Systems Eng

Phoenix, AZ · On-site

$98K - $193K/yr

Experience with Intel's wafer defect metrology and analysis ecosystem * Experience with Industry ... and assembly. We ensure our foundry customers' products receive our utmost focus in terms of ...

Intel

WLA Yield Analysis Systems Eng

Albuquerque, NM · On-site

$98K - $193K/yr

Experience with Intel's wafer defect metrology and analysis ecosystem * Experience with Industry ... and assembly. We ensure our foundry customers' products receive our utmost focus in terms of ...

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All JobsIntel Wafer Level Assembly Jobs

Intel Wafer Level Assembly information

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$14

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$38

How much do intel wafer level assembly jobs pay per hour?

As of Jun 16, 2026, the average hourly pay for intel wafer level assembly in the United States is $24.62, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $28.12 per hour, depending on experience, location, and employer.

What is the difference between Intel Wafer Level Assembly vs Intel Chip Packaging Technician?

AspectIntel Wafer Level AssemblyIntel Chip Packaging Technician
CredentialsTechnical certifications, associate degrees in electronics or related fieldsTechnical certifications, associate degrees in electronics or related fields
Work EnvironmentCleanroom environments focused on wafer processingManufacturing floors focused on packaging and assembly
Industry UsageInvolved in wafer-level processing before die separationHandles final packaging and testing of chips

Intel Wafer Level Assembly specialists focus on processing wafers at the micro-level, preparing them for die separation, while Intel Chip Packaging Technicians handle the final packaging, testing, and assembly of chips. Both roles require technical skills and work in cleanroom or manufacturing environments, but they differ in their specific stage of the semiconductor manufacturing process.

What is Intel Wafer Level Assembly?

Intel Wafer Level Assembly refers to the advanced manufacturing processes where semiconductor devices are assembled and packaged directly on the silicon wafer before it is diced into individual chips. This technique enables higher efficiency, better performance, and more compact designs compared to traditional assembly methods. Wafer level assembly is crucial for producing modern processors and memory devices, as it supports faster data transfer, improved thermal management, and cost-effective mass production. Intel utilizes sophisticated equipment and cleanroom environments to ensure the quality and reliability of chips produced through this method.

What are some common challenges faced by engineers in Intel Wafer Level Assembly, and how can they be addressed?

Engineers in Intel Wafer Level Assembly often encounter challenges such as maintaining high yield rates, troubleshooting equipment malfunctions, and adhering to strict process controls. The work environment is fast-paced and highly collaborative, requiring close coordination with quality assurance, process engineering, and equipment maintenance teams. Addressing these challenges typically involves strong analytical skills, proactive problem-solving, and continuous learning to stay updated with evolving manufacturing technologies. Regular cross-functional meetings and process improvement initiatives also help teams stay aligned and address issues efficiently.

What are the key skills and qualifications needed to thrive in Intel Wafer Level Assembly, and why are they important?

To excel in Intel Wafer Level Assembly, you need a solid understanding of semiconductor manufacturing processes, attention to detail, and typically a technical diploma or associate degree in electronics or a related field. Familiarity with cleanroom protocols, automated assembly tools, and quality control systems is essential, and certifications such as IPC or Six Sigma can be advantageous. Strong problem-solving skills, teamwork, and effective communication help individuals adapt to fast-paced, detail-oriented environments. These skills ensure high-quality production, minimize defects, and support efficient collaboration in semiconductor manufacturing.
Infographic showing various Intel Wafer Level Assembly job openings in the United States as of June 2026, with employment types broken down into 4% Locum Tenens, 10% Full Time, 85% Contract, and 1% Summer. Highlights an 95% Physical, 3% Hybrid, and 2% Remote job distribution, with an average salary of $51,210 per year, or $24.6 per hour.
Module Development Engineer

Module Development Engineer

INTEL

Hillsboro, OR

$109K - $154K/yr

Full-time

Medical, Retirement, PTO

Posted 27 days ago

Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers

Job description

Job Description

Join Intel as a Module Development Engineer and become a key driver in advancing cutting-edge technologies within high-volume manufacturing and future technology development. In this role, you will lead the design and development of sophisticated manufacturing processes that enable pioneering product designs and innovative device architectures. Your contributions will directly impact Intel's position as a leader in advanced semiconductor technologies and support its mission to push the boundaries of industry innovation. Collaborate with world-class teams and partners to deliver impactful solutions and shape Intel's technological roadmap.
Key Responsibilities


- Drive the development and enablement of new technology for high-volume manufacturing and future advancements, focusing on process integration and equipment solutions.
- Lead the design and development of complex manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Conduct theoretical simulations and practical engineering studies to meet desired device specifications through feasibility studies.
- Perform pathfinding activities to spearhead process and hardware development for emerging device architectures.
- Develop roadmaps for technologies that support future advancements and maintain Intel's leadership in the industry.
- Collaborate with equipment and materials suppliers to implement enabling elements of advanced technologies.
- Recommend and execute modifications to existing equipment and processes to improve production efficiency and optimize output.
- Stay informed of industry trends related to process and material manufacturing, anticipating future needs and driving innovation

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications


- Bachelor's degree with 3+ years of experience OR Master's degree with 2+ years of experience OR PhD degree with no required prior experience in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or related engineering disciplines,  

Experience listed above should be in the following:

  • Semiconductor processing, process development, or cleanroom environments.
  • Proficiency in statistical tools, such as Statistical Process Control (SPC) and/or Design of Experiments (DOE).
  • Experience in direct wafer-level assembly module engineering or fab process and hardware technology development.

Preferred Qualifications


- Familiarity with semiconductor packaging and assembly technologies.
- Demonstrated ability to troubleshoot complex process issues and apply structured problem-solving methodologies.
- Experience working with advanced process control systems and data analysis tools, such as JMP software.
- Proven track record in driving continuous improvement projects in multidisciplinary teams.

Prior Singulation Experience (Laser and Dicing process)

 
This role offers the opportunity to make a meaningful impact on Intel's advanced manufacturing technologies. Explore how your skills and expertise can shape the future-apply today.

Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $109,600.00-$154,800.00
*Salary range dependent on a number of factors including location and experienceWorking ModelThis role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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