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Overview

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

A major success factor for Keysight continues to be the development and deployment of breakthrough digital, analog, and mixed signal Application Specific Integrated Circuits (ASICs), modules, and subsystems that drive the performance, differentiation, and value of new products. We have an exciting opportunity for a highly motivated R&D Hardware Design Engineer to join our ASIC Packaging, Subsystem, and Integration team. In this role, you will participate in the design and integration of high-performance integrated circuit packaging and subsystem solutions for the world’s highest performance test and measurement products including Oscilloscopes, Signal Generators, Bit-Error Rate Testers, and Frequency-Domain Instruments.

This role will be based in our Colorado Springs, Colorado facility at the base of Pikes Peak. Our beautiful development campus includes both office and advanced technology, assembly & machining facilities, as well as an 18-hole disc golf course, volleyball/basketball courts, a complete fitness center, and cafeteria. Our city is consistently rated as one of the best places to live in the United States. We enjoy bountiful outdoor access, year-round recreational opportunities, and over 300 days of sunshine per year.

Responsibilities

You’ll collaborate across global teams to design, optimize, and implement ASIC packaging and subsystem solutions that meet test & measurement product functionality, performance, quality and schedule requirements. This role is part of Keysight Laboratories, a world-renowned technology organization which enables Keysight to be first to market with breakthrough products and solutions.

• ASIC package, module, and subsystem development including layout, integration, SI/PI analysis, and power delivery network design
• Modeling & optimization of high-frequency RF and high-speed digital I/O interconnects
• Close collaboration with system, IC design, and test teams to develop and define hardware architecture, requirements, functionality, and performance
• Identification of appropriate packaging technologies for each chip design and investigation of next generation industry solutions
• Support for instrument product development to enable integration of critical ASIC blocks
• Collaboration with internal and external supply chain manufacturing partners to identify, develop, deploy, and execute new processes
• Collaboration with the test & reliability teams in the characterization and qualification of each ASIC
• Lifecycle support for existing ASIC components

Qualifications

• BS or MS degree in Electrical Engineering or equivalent
• Minimum 7+ years of experience (MS and 5 years) in hardware/circuit design, RF/microwave design, high-frequency modeling/optimization, or high-power density design
• Proven experience with semiconductor, packaging, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies
• Excellent understanding of Electrical Engineering principles, Signal Integrity, RF/Microwave theory, and high frequency circuit design methodologies
• Strong knowledge of thermodynamics and thermostructural analysis principles
• Excellent understanding of materials science principles
• Familiarity with IC design methodologies, processes, and workflows preferred

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Qualifications:

• BS or MS degree in Electrical Engineering or equivalent
• Minimum 7+ years of experience (MS and 5 years) in hardware/circuit design, RF/microwave design, high-frequency modeling/optimization, or high-power density design
• Proven experience with semiconductor, packaging, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies
• Excellent understanding of Electrical Engineering principles, Signal Integrity, RF/Microwave theory, and high frequency circuit design methodologies
• Strong knowledge of thermodynamics and thermostructural analysis principles
• Excellent understanding of materials science principles
• Familiarity with IC design methodologies, processes, and workflows preferred

#LI-MED1

Education:UNAVAILABLEEmployment Type: UNAVAILABLE