Flex Communications Engineer Jobs (NOW HIRING)

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish...The people here at Apple don't just create products - they create the kind of wonder that's revolutionized entire industries. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. ..Join Apple, and help us leave the world better than we found it. Apple products are as alluring on the inside as they are on the outside. Inside every one of our products are some of the world's most challenging consumer Flexible printed circuit boards (Flex PCBs) and PCBA designs. In this highly visible role, you will have the opportunity to make a significant impact on Apple products by bringing designs from concept to mass production, leaving a footprint for years to come across various business units.
As a Flex DFM Engineer, you'll partner with Apple Product Design and Hardware Engineering to design Flex PCBs and lead the evaluation/implementation of end-to-end fabrication and assembly solutions. You will ensure our manufacturing solutions meet our product quality, cost, yield, capacity, schedule, and environmental goals. Our team possesses deep knowledge of the Flex fabrication processes and raw materials. We maintain Apple's general design guidelines and product specifications for Flex PCBs, as well as the technology development roadmap.
B.S./M.S. degree in Chemical, Materials Science, Mechanical, Electrical or related fields with 5+ years of research, process or product development experience in an applicable fieldExperience selecting materials and manufacturing processes based on engineering requirements in a professional environment Established capability in statistical data analysis, including DOE and SPCManage multiple assignments simultaneously with a detail-oriented focus on documentation, organization, and the establishment of critical milestonesExcellent written and verbal communication skills and demonstrated leadership abilityStrong communication skills with the ability to articulate technical detail to others with varying levels of technical expertise across diverse professional backgroundsDrive technical leadership at global supplier sites during NPI and production ramps; travel internationally to ensure operational excellence by identifying process gaps and implementing timely resolutionsWillingness to participate in communication with overseas team members at irregular hours and international business travel to support project implementation and collaborate with external vendors as necessary (~30%)
Ph.D. degree in Chemical, Materials Science, Mechanical, Electrical, Manufacturing Engineering with research or process development in flexible electronics or semiconductor fabricationKnowledge of industry specifications for Flex and/or Rigid PCBs and assembliesA proven understanding of the link between Flex PCB design rules, industry capabilities, and the specific processes required to meet performance benchmarksExperience in failure mode analysis, root cause investigation, and problem solving for product yield and quality issues as well as driving corrective actionsDemonstrated knowledge of cause and effect relationship between manufacturing practices and defect modes in flexible printed circuitsFlex PCB and assemblies.Familiarity with PCB surface mount assembly of flexible circuits including standard methodologies for material and tooling selection as well as component footprint design rules.Firsthand experience with backend processes and tooling design for flexible printed circuitFlex PCB assemblies including punching, bending, and attachment of stiffeners and adhesives.Experience with failure analysis techniques like EDX, SEM, FTIR, etc.Experience with Allegro, Valor, NX8, 3D CAD, and JMP