... electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level ... Lead maturity gate reviews, publish progress reports to executives and peers on monthly and ...
... electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level ... Lead maturity gate reviews, publish progress reports to executives and peers on monthly and ...
Lead maturity gate reviews, publish progress reports to executives and peers on monthly and ... electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level ...
Lead maturity gate reviews, publish progress reports to executives and peers on monthly and ... electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level ...
Executive Plating Electroplating information
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$11.78 - $15.25
6% of jobs
$17.82 is the 25th percentile. Wages below this are outliers.
$15.25 - $18.73
25% of jobs
The median wage is $20.57 / hr.
$18.73 - $22.20
35% of jobs
$23.89 is the 75th percentile. Wages above this are outliers.
$22.20 - $25.68
18% of jobs
$25.68 - $29.15
9% of jobs
$29.15 - $32.63
3% of jobs
$32.63 - $36.10
1% of jobs
$36.10 - $39.58
2% of jobs
$39.58 - $43.05
0% of jobs
$43.05 - $46.53
0% of jobs
$46.53 - $50
0% of jobs
$11
$23
$50
How much do executive plating electroplating jobs pay per hour?
As of Jul 12, 2026, the average hourly pay for executive plating electroplating in the United States is $23.56, according to ZipRecruiter salary data. Most workers in this role earn between $17.79 and $24.52 per hour, depending on experience, location, and employer.
What cities are hiring for Executive Plating Electroplating jobs? Cities with the most Executive Plating Electroplating job openings:
What are the most commonly searched types of Plating Electroplating jobs? The most popular types of Plating Electroplating jobs are:
What states have the most Executive Plating Electroplating jobs? States with the most job openings for Executive Plating Electroplating jobs include:
Full-time
Re-posted 9 days ago
Onsemi rating
8.3
Based on 19 frontline employees who took The Breakroom Quiz
Job description
Technical and customer support for the qualification of SiC die sales and development
SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.
If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.
- Strong communication skills
- Ability to lead development projects and implement strategies on a global basis
- Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding
- Knowledge of materials and material interactions
- Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals
- Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams
- Understand detailed customer requirements and verify latest technologies meet or exceed all expectations
- Document findings and process flows to create baseline for new technology platforms
- Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis.
About onsemi
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