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Etch Process Engineer Jobs (NOW HIRING)

Senior Dry Etch Process Engineer

Boise, ID · On-site

$99K - $128K/yr

As a Senior Dry Etch Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost ...

Senior Dry Etch Process Engineer

Boise, ID · On-site

$99K - $128K/yr

As a Senior Dry Etch Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost ...

Job Qualifications * BS or higher in Chemical Engineering, Chemistry, Electrical Engineering, Physics or Material Science. * At least 5+ year's ETCH process experience working in a high-volume ...

Principal Process Engineer-Etch

Camas, WA · On-site

$108K - $156K/yr

Job Qualifications * BS or higher in Chemical Engineering, Chemistry, Electrical Engineering, Physics or Material Science. * At least 5+ year's ETCH process experience working in a high-volume ...

Process Development Engineer

Alhambra, CA · On-site

$73K - $110K/yr

Deposition and Etch Process Development & Ownership (35%): * Develop, qualify, and maintain PECVD ... Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering ...

Etch engineer is expected to implement/improve process control by use of FDC and SPC methods. Engineer is expected to work in team environment to drive improvement in tool capability, to reduce ...

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data ...

Process Development Engineer

Alhambra, CA · On-site

$73K - $110K/yr

The Process Development Engineer - InP Wafer Fab position is responsible for development ... Deposition and Etch Process Development & Ownership (35%): * Develop, qualify, and maintain PECVD ...

... etch processing, kinetic theory, or basic plasma physics. * Data science basics / Python coding or programming or scripting is desirable. * Education: BS + 2 years of relevant semiconductor ...

Process Engineer I-IV

Hillsboro, OR · On-site

$64K - $146K/yr

Engineering & Science Job Schedule: Full time Remote: No WORK STYLE DESIGNATION: Hybrid (+50 ... The Demo Team supports development of advanced dry etch processes that win customer tool-of-record ...

Process Engineer I-IV

Hillsboro, OR · Hybrid

$64K - $146K/yr

Engineering & Science Job Schedule: Full time Remote: No WORK STYLE DESIGNATION: Hybrid (+50 ... The Demo Team supports development of advanced dry etch processes that win customer tool-of-record ...

Own and sustain the Dry Etch process area or a part thereof along with other department engineers and technicians as part of a 24*7 High Volume Silicon Carbide Wafer Fab. Respond to any process ...

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Etch Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do etch process engineer jobs pay per year?

As of Jun 21, 2026, the average yearly pay for etch process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are the typical challenges faced by an Etch Process Engineer, and how can they be addressed?

Etch Process Engineers often encounter challenges such as maintaining process stability, optimizing etch selectivity, and minimizing defects in semiconductor manufacturing. Addressing these challenges requires strong analytical skills, attention to detail, and frequent collaboration with equipment engineers and process integration teams. Staying current with new etching techniques and maintaining thorough documentation can help resolve issues efficiently. Additionally, clear communication within cross-functional teams is essential for troubleshooting and continuous improvement.

What is the difference between Etch Process Engineer vs Plasma Process Engineer?

AspectEtch Process EngineerPlasma Process Engineer
CredentialsBachelor's in Chemical, Materials, or Electrical EngineeringBachelor's in Chemical, Materials, or Electrical Engineering
Work EnvironmentCleanroom semiconductor fabrication facilitiesCleanroom semiconductor fabrication facilities
Industry UsageSemiconductor manufacturing, microfabricationSemiconductor manufacturing, microfabrication
Job FocusEtching patterns onto wafers using chemical or plasma processesDeveloping and optimizing plasma-based processes for etching and deposition

Both roles are integral to semiconductor fabrication, often working in similar environments and requiring comparable technical backgrounds. The Etch Process Engineer primarily focuses on the etching process itself, while the Plasma Process Engineer specializes in plasma-based techniques that can include etching and deposition. Understanding these distinctions helps in choosing the right career path or job search focus.

What are the key skills and qualifications needed to thrive as an Etch Process Engineer, and why are they important?

To thrive as an Etch Process Engineer, you need a strong background in materials science, chemical engineering, or a related field, typically supported by a relevant bachelor's or master's degree. Familiarity with semiconductor fabrication tools, such as plasma etchers and process control systems, as well as knowledge of industry standards like SEMI and SPC, is essential. Strong analytical thinking, problem-solving abilities, and effective communication skills help in troubleshooting complex processes and collaborating with cross-functional teams. These skills and qualities are vital for optimizing manufacturing yields, ensuring process stability, and driving innovation in semiconductor production.

What are Etch Process Engineers?

Etch Process Engineers are specialized professionals who develop, optimize, and monitor the etching processes used in semiconductor manufacturing. They work to ensure precise removal of material from silicon wafers using chemical or plasma etching techniques, which is critical for defining micro- and nano-scale patterns on chips. Their responsibilities include process development, troubleshooting, equipment maintenance, and data analysis to improve yield and device performance. Etch Process Engineers often collaborate with other engineering teams to support new technology introductions and meet production goals.
More about Etch Process Engineer jobs
What cities are hiring for Etch Process Engineer jobs? Cities with the most Etch Process Engineer job openings:
What states have the most Etch Process Engineer jobs? States with the most job openings for Etch Process Engineer jobs include:
Infographic showing various Etch Process Engineer job openings in the United States as of June 2026, with employment types broken down into 100% Locum Tenens. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.
Process Development Engineer, Dry Etch

Process Development Engineer, Dry Etch

Skorpios Technologies, Inc.

Temecula, CA

$90K - $170K/yr

Other

Posted 17 days ago


Job description

Description

The Dry Etch Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.  

  • Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments and adjust or optimize processes for Fab Operation. 
  • Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality. 
  • Guide and assist Process Technicians through challenging process steps. 
  • Analyze metrology results and disposition lots based on data and pass/fail criteria. 
  • Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team. 
  • Provide effective pass-downs to support uninterrupted operation for Dry Etch activities.
  • Sustain and improve processes for wafer fabrication. 
  • Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality, and product yields. 
  • Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment. 
  • Assure that the manufactured products conform to specifications and application requirements. 
  • Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations  
  • Sustain existing processes in the areas of, Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM) and Barrel etching, etch process recipe creations, inspections, defects control, and standard Dry Etch related metrology such as ellipsometry or profilometry.
  • Create and maintain operating specifications for production processes and equipment. 
  • Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.

Requirements

  • Processing experience in a fab in the area of Dry Etch processing using Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave Ashing
  • Experience with Statistical Process Control (SPC) 
  • Basic understanding of algebraic concepts
  • Data extraction, analysis, and reporting experience
  • Basic understanding of Semiconductor processing
  • Ability to troubleshoot basic problems and address root causes
  • Ability to understand all maintenance activity details required to ensure a healthy and repeatable process
  • Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines
  • Ability to operate processing tools, write and run Dry Etch recipes, inspect wafers under the microscope, and perform basic characterization related to Dry Etch processing with particles / defects metrology, and thickness / uniformity metrology
  • Must be able to work offset shifts: Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays).
  • BS in Electrical Engineering, Material Science, Physics, Chemistry, or related + 9 years, MS + 7 years, or Ph.D. + 4 years

Competencies

  • Hands-on mindset
  • Excellent Communication skills
  • Collaboration
  • Quick Learner
  • Strong interpersonal skills
  • Self-starter
  • Prioritization
  • Accountability
  • Innovative

Work Environment

80%+ of work is performed in the Fab, which a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. The use of personal protective equipment to prevent exposure to hazardous materials can be expected. Frequent gowning and de-gowning is required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected.


Physical Demands

  • Frequently in a stationary position, often      sitting and/or standing for prolonged periods (3 hours)
  • Frequently viewing a computer monitor for prolonged periods (3      hours)
  • Frequently walking around the Fab for prolonged periods (3 hours)
  • Occasionally required to push and/or pull 50+ lbs objects, such as      tool components
  • Occasionally required to lift 50+ lbs and occasionally carry that      amount short distances (# ft)
  • Occasionally required reach, bend, twist, squat, kneel, and stoop to      access and work on tools in the Fab
    • May often require repetitive motions involving the wrists, hands,       and/or fingers
    • May require different positions and motions in tight and confined       spaces
  • Occasionally required to handle items using small ranges of motion      (e.g. fingers and hands) and large ranges of motion (e.g., full-arms and      shoulders) for carrying cassettes and lot boxes
  • Constantly required to wear PPE 

Work Authorization/Security Clearance Requirements

Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.


Affirmative Action/EEO Statement 

The employment policy of Skorpios is to provide equal opportunity to all individuals. Employment decisions are based on merit and business needs. It is the policy of this Company not to discriminate against any employee, or applicant for employment, because of age, sex (including pregnancy, perceived pregnancy, childbirth, breastfeeding, or related medical conditions), color, race, creed, national origin, religious persuasion (including religious dress and grooming practices), marital status, sexual orientation, gender identity, political belief, genetics, disability that does not prohibit performance of essential job functions with or without reasonable accommodations, medical condition, or any other protected characteristic under applicable federal, state, or local laws. Skorpios also does not discriminate on the basis of national origin or citizenship status, as provided under the Immigration Reform and Control Act of 1986.


Other Duties

Please note this job description is not designed to cover or contain a comprehensive listing of activities, duties, or responsibilities that are required of the job. Duties, responsibilities, and activities may change at any time with or without notice at the discretion of the company. 


****Recruiters or Agencies will not be considered for this position***