SMTS (Product Eng)
Chandler, AZ · On-site
Experience with testing memory is a plus (DRAM, FLASH, SRAM or any other emerging memory technology). * Proficient in data analysis tools like JMP and programming languages like Python or C.
Quick apply
Chandler, AZ · On-site
Experience with testing memory is a plus (DRAM, FLASH, SRAM or any other emerging memory technology). * Proficient in data analysis tools like JMP and programming languages like Python or C.
Quick apply
Chandler, AZ · On-site
Experience with testing memory is a plus (DRAM, FLASH, SRAM or any other emerging memory technology). * Proficient in data analysis tools like JMP and programming languages like Python or C.
Chandler, AZ · On-site
Experience with testing memory is a plus (DRAM, FLASH, SRAM or any other emerging memory technology). * Proficient in data analysis tools like JMP and programming languages like Python or C.
Quick apply
Chandler, AZ · On-site
Experience with testing memory is a plus (DRAM, FLASH, SRAM or any other emerging memory technology). * Proficient in data analysis tools like JMP and programming languages like Python or C.
Phoenix, AZ · On-site
Develop red team architecture and process scoring methodologies with business unit engineering ... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ...
Phoenix, AZ · On-site
Develop red team architecture and process scoring methodologies with business unit engineering ... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ...
Phoenix, AZ · On-site
Develop red team architecture and process scoring methodologies with business unit engineering ... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ...
Phoenix, AZ · On-site
Develop red team architecture and process scoring methodologies with business unit engineering ... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ...
$308K - $417K/yr
Work with engineering teams across Arm to coordinate on-time delivery of Arm IP into SoCs, and work ... time accelerators, DRAM memory technologies. * Excellent presentation, interpersonal and ...
$308K - $417K/yr
Work with engineering teams across Arm to coordinate on-time delivery of Arm IP into SoCs, and work ... time accelerators, DRAM memory technologies. * Excellent presentation, interpersonal and ...
Phoenix, AZ · On-site
... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ... Engaged with common engineering and manufacturing on gross margin initiatives. Ensure commonality ...
Phoenix, AZ · On-site
... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ... Engaged with common engineering and manufacturing on gross margin initiatives. Ensure commonality ...
Phoenix, AZ · On-site
... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ... Engaged with common engineering and manufacturing on gross margin initiatives. Ensure commonality ...
Phoenix, AZ · On-site
... DRAM, and other markets such as more than Moore and Advanced Packaging. Work closely with Market ... Engaged with common engineering and manufacturing on gross margin initiatives. Ensure commonality ...
| Aspect | Dram Engineer | Memory Engineer |
|---|---|---|
| Credentials | Bachelor's or higher in Electrical Engineering, Computer Engineering, or related fields; certifications like IEEE are common | Similar educational background; often holds certifications in memory design or semiconductor manufacturing |
| Work Environment | Design labs, semiconductor fabs, R&D centers | Design labs, semiconductor manufacturing facilities, R&D centers |
| Industry Usage | Memory chip companies, electronics manufacturers | Memory chip companies, electronics manufacturers |
| Job Focus | Design and optimize DRAM modules, ensure performance and reliability | Design and develop various types of memory, including DRAM, SRAM, Flash |
Both Dram Engineers and Memory Engineers work in similar environments and industries, often sharing educational backgrounds and certifications. While Dram Engineers focus specifically on DRAM technology, Memory Engineers may work on a broader range of memory types. The roles are closely related, with overlapping skills in semiconductor design and testing.
Job Title: Product Engineer – Senior Member of Technical Staff (SMTS)
Product engineer is responsible for NPI development from first Si through qualification and high-volume production ramp.
Employer: Everspin Technologies, Inc.
Department: Backend OPS
Reports To: VP Backend OPS
Terms: Full Time/Exempt/Salary/In Office
About Everspin
Headquartered in Chandler, Arizona, Everspin Technologies (Nasdaq: MRAM) is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 200 Million MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. For more information, visit www.everspin.com.
The Role
Reporting to VP Backend OPS, and based in our Chandler, Arizona headquarters, the SMTS Product engineer is responsible for bringing all new MRAM products(NPI) to market involving pre-Si design spec definitions; first Si verification; datasheet spec validation; developing wafer sort, final test and characterization programs and reliability characterization. Responsibilities include working with Design and Operations teams to create and execute characterization and debug plans for circuit validation, screen development and debug of any non-conformance. Additionally, the group works with the Process and Device teams to develop a yield pareto correlating wafer sort and final test failure mechanisms to bit properties thus defining a path to yield improvement. In addition, during the qualification phase, group responsibilities involve reliability/technology certification (both standard JEDEC and technology specific stresses).
Specific responsibilities will include:
Qualifications & competencies
Physical Demands and Work Environment
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Semiconductor and electronic component manufacturing
51 - 200 Employees
Chandler, AZ, US
2008