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Job Description:

Lieu : Montreal, QC (mode hybride)

Type de poste : Permanent, temps plein

EXFO est un chef de file mondial en matiere de solutions intelligentes de test, de surveillance et d'analyse de reseaux. Nos technologies soutiennent les plus grands fournisseurs de services de telecommunications, fabricants d'equipements reseau et fournisseurs de services Web a travers le monde.

Presente dans plus de 25 pays et comptant plus de 2 000 employes, EXFO est le leader mondial des tests de fibre optique et possede le plus important deploiement de solutions d'assurance de services actifs. Nos solutions materielles et logicielles permettent a nos clients d'accelerer les transformations technologiques liees a la fibre optique, a la 5G, a la virtualisation, a l'Internet des objets (IoT) et a l'analytique des donnees.

Sous la supervision du Chef de groupe R&D d'ingenierie materielle, vous evoluerez au sein d'un environnement multisite et multidisciplinaire ou vous contribuerez au developpement de solutions materielles de pointe destinees a la validation des reseaux de telecommunications.

A titre d'Architecte materiel Senior, vous assurerez la vigie technologique et proposerez des solutions innovantes pour nos plateformes haute vitesse (106,25 Gbps, 224 Gbps et plus) ainsi que pour nos systemes embarques. Vous jouerez un role cle dans les decisions technologiques strategiques qui orienteront les futurs produits d'EXFO.

• Concevoir l'architecture materielle globale de systemes complexes en optimisant les performances, la fiabilite et l'evolutivite.
• Analyser differentes approches technologiques et recommander les meilleures solutions pour le developpement de produits innovants.
• Definir, planifier et realiser des preuves de concept (PoC) afin d'evaluer les nouvelles technologies.
• Agir comme expert technique lors de la resolution de problemes architecturaux majeurs durant le cycle de developpement.
• Assurer une vigie technologique active en participant a des conferences internationales, salons specialises et rencontres avec les principaux partenaires technologiques.
• Collaborer etroitement avec les equipes de R&D afin de soutenir les decisions techniques strategiques.
• Contribuer a l'evolution des plateformes materielles haute vitesse d'EXFO.
• Effectuer toute autre tache connexe au besoin.

• Baccalaureat en genie electrique ou l'equivalent.
• Minimum de 10 ans d'experience en developpement de produits materiels haute vitesse.
• Solide expertise en conception de materiel complexe (electronique, mecanique, FPGA, traitement et integrite du signal).
• Excellente connaissance de l'ecosysteme technologique haute vitesse (connecteurs, DSP, FPGA, transceivers optiques).
• Expertise des systemes embarques utilisant des architectures CPU/MCU et interfaces LCD.
• Experience en conception de circuits de gestion d'alimentation et de batteries.
• Tres bonne comprehension des enjeux d'integrite de signal dans les PCB haute densite.
• Maitrise des normes IEEE 802.3 (DJ/CK) ainsi que des standards OIF CEI-224VSR et CEI-112VSR.
• Excellente capacite a vulgariser des concepts techniques complexes afin de soutenir la prise de decision.
• Leadership, esprit d'equipe, rigueur documentaire et excellente capacite a gerer les priorites.
• Bilinguisme (francais et anglais), a l'oral et a l'ecrit.
• Citoyennete canadienne ou residence permanente au Canada obligatoire.
• Disponibilite pour voyager quelques fois par annee, principalement aux Etats-Unis.

• Joignez-vous a un chef de file mondial des technologies de telecommunications.
• Travaillez sur des produits de tres haute technologie qui faconnent les reseaux de demain.
• Evoluez dans un environnement multidisciplinaire, collaboratif et innovant.
• Mode de travail hybride.
• Excellentes possibilites de developpement professionnel et d'evolution de carriere.
• Gamme complete d'avantages sociaux.

La connaissance de l'anglais est requise pour ce poste, puisque ses responsabilites impliquent des echanges frequents, tant a l'oral qu'a l'ecrit, avec des clients, partenaires, fournisseurs ou collegues situes a l'exterieur du Quebec.

Location: Montreal, QC (Hybrid)

Position Type: Permanent, Full-Time

EXFO is a global leader in intelligent test, monitoring, and analytics solutions for the telecommunications industry. Our technologies support the world's leading communication service providers, network equipment manufacturers, and cloud service providers.

With more than 2,000 employees across 25 countries, EXFO is the global leader in fiber optic testing and the world's largest provider of active service assurance solutions. Our hardware and software solutions help customers accelerate technology transformations related to fiber optics, 5G, virtualization, the Internet of Things (IoT), and advanced analytics.

Reporting to the Hardware Engineering R&D Group Manager, the Senior Hardware Architect will work within a multidisciplinary, multi-site engineering environment developing next-generation hardware solutions for telecommunications network testing.

As a Senior Hardware Architect, you will provide technical leadership for EXFO's high-speed hardware platforms (106.25 Gbps, 224 Gbps and beyond) and embedded systems. You will evaluate emerging technologies, define hardware architectures, and play a key role in strategic technology decisions.

• Design the overall hardware architecture of complex systems while balancing performance, reliability, and scalability.
• Analyze emerging technologies and recommend innovative hardware solutions.
• Lead hardware proof-of-concept (PoC) initiatives to validate new technologies.
• Provide technical leadership in solving major architectural and development challenges.
• Monitor technology trends by attending international conferences, trade shows, and collaborating with key technology partners.
• Support multidisciplinary R&D teams in making critical technical decisions.
• Contribute to the evolution of EXFO's next-generation high-speed hardware platforms.
• Perform other related duties as required.

• Bachelor's degree in Electrical Engineering or equivalent.
• Minimum of 10 years of experience developing high-speed hardware products.
• Strong expertise in complex hardware design including electronics, mechanics, FPGA development, signal processing, and signal integrity.
• Strong knowledge of the high-speed technology ecosystem including connectors, DSPs, FPGAs, and optical transceivers.
• Expertise with embedded systems using CPU/MCU architectures and LCD interfaces.
• Experience designing battery management and power circuits.
• Strong understanding of high-speed PCB signal integrity.
• Knowledge of IEEE 802.3 electrical standards and OIF CEI-224VSR / CEI-112VSR specifications.
• Excellent communication skills with the ability to explain complex technical concepts to support strategic decision-making.
• Strong leadership, teamwork, documentation, and organizational skills.
• Fluent in both English and French (spoken and written).
• Canadian citizenship or permanent residency required.
• Willingness to travel internationally several times per year, primarily to the United States.

• Join a global leader in telecommunications technology.
• Work on innovative products that shape the future of network technologies.
• Collaborative, multidisciplinary, and stimulating work environment.
• Flexible hybrid work model.
• Excellent opportunities for professional growth and career development.
• Comprehensive benefits package.

English is required for this position, as the role involves frequent verbal and written communication with customers, partners, suppliers, and colleagues located outside of Quebec.

EXFO is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

EXFO is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.