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Director Semiconductor Yield Engineering Jobs (NOW HIRING)

$89K - $166K/yr

Work with process engineering and R&D teams to design and execute DOE for process improvement ... Direct experience with high‑power or ultra‑high‑power semiconductor laser diodes.

... related engineering discipline. 10+ years of semiconductor or HDD high-volume manufacturing ... direct organizational authority. Preferred Experience supporting technology transfer, fab ...

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Director Semiconductor Yield Engineering information

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$73K

$194.7K

$254K

How much do director semiconductor yield engineering jobs pay per year?

As of Sep 13, 2026, the average yearly pay for director semiconductor yield engineering in the United States is $194,709.00, according to ZipRecruiter salary data. Most workers in this role earn between $141,500.00 and $253,000.00 per year, depending on experience, location, and employer.

What does a director semiconductor yield engineering do?

A Director of Semiconductor Yield Engineering oversees the teams and processes responsible for maximizing the number of usable chips produced from semiconductor wafers. This role involves analyzing manufacturing data, identifying yield issues, and implementing strategies to improve product quality and manufacturing efficiency. Directors in this field work closely with engineering, manufacturing, and quality teams to address defects, optimize processes, and drive continuous improvement. They play a crucial leadership role in ensuring that semiconductor fabrication meets cost, quality, and output goals.

What are the primary challenges faced by a director semiconductor yield engineering, and how can they be addressed?

A Director of Semiconductor Yield Engineering often encounters challenges such as rapidly evolving process technologies, variability in manufacturing yields, and coordinating cross-functional teams to resolve root causes of yield loss. Addressing these challenges requires a proactive approach to data analysis, strong collaboration with process engineers and R&D teams, and implementing continuous improvement methodologies. Effective communication and leadership are crucial for driving yield enhancement initiatives and aligning team efforts towards common production goals.

What are the key skills and qualifications needed to thrive as a director semiconductor yield engineering, and why are they important?

To thrive as a Director of Semiconductor Yield Engineering, you need a deep understanding of semiconductor manufacturing processes, statistical analysis, and yield enhancement, typically supported by an advanced degree in electrical engineering or a related field. Expertise in yield management tools (such as KLA-Tencor, Mentor Graphics, or Applied Materials), data analytics platforms, and Six Sigma or similar certifications is highly valuable. Strong leadership, problem-solving, and cross-functional communication skills set outstanding candidates apart. These competencies are critical for driving process improvements, reducing defects, and ensuring product quality in a highly competitive, technology-driven industry.

What is the difference between Director Semiconductor Yield Engineering vs Process Engineer?

AspectDirector Semiconductor Yield EngineeringProcess Engineer
CredentialsBachelor's/Master's in Electrical Engineering, Materials Science, or related; extensive experienceBachelor's/Master's in Engineering or related; some experience in semiconductor processes
Work EnvironmentLeadership role overseeing yield teams, strategic planningHands-on role in process development and optimization
Industry UsageUsed in semiconductor manufacturing companies, foundriesCommon in manufacturing plants, fabs
Search/Comparison IntentUnderstanding senior vs. technical roles in yieldLearning about process roles in semiconductor industry

The main difference is that the Director Semiconductor Yield Engineering focuses on strategic leadership, team management, and overall yield improvement, while the Process Engineer handles day-to-day process development and optimization. Both roles are essential in semiconductor manufacturing but differ in scope and seniority.

What are popular job titles related to Director Semiconductor Yield Engineering jobs?

For Director Semiconductor Yield Engineering jobs, the most frequently searched job titles are:

Infographic showing various Director Semiconductor Yield Engineering job openings in the United States as of August 2026, with employment types broken down into 90% Full Time, 5% Part Time, 4% Contract, and 1% Nights. Highlights an 87% Physical, 3% Hybrid, and 10% Remote job distribution, with an average salary of $194,709 per year, or $93.6 per hour.

Reliability & Yield Engineering Manager

Albuquerque, NM • On-site

3D Glass Solutions
Electrical Equipment, Appliance, and Component Manufacturing • 11 - 50 employees

$93K - $117K/yr

Full-time

Re-posted 4 days ago


Job description

Job/Position Summary
We are seeking a Reliability & Yield Engineering Manager to lead yield improvement, process qualification, reliability validation, and failure analysis for an advanced substrate fabrication line. The role will support glass-core and organic-core substrate technologies, including TGV structures, RDL build-up, fine-line copper routing, dielectric build-up, plating, surface finish, and final electrical test.
This position is critical to moving products from development through qualification, ramp, and production. The ideal candidate will combine strong process integration knowledge with hands-on reliability engineering, statistical analysis, defect reduction, and customer qualification experience.
Primary Responsibilities
Yield Engineering
  • Lead yield improvement programs across the substrate fabrication flow, including glass core, TGV, build-up dielectric, copper plating, lithography, laser drilling, via formation, surface finish, and final electrical test.
  • Develop yield Pareto analysis, defect density tracking, layer-level yield models, and inline-to-final-yield correlation.
  • Drive root cause analysis for yield loss mechanisms.
    Establish and maintain process control plans, SPC charts, excursion management systems, and yield
  • dashboards.
  • Work closely with process engineering, equipment engineering, production, test, and quality teams to improve process capability and reduce scrap.

Reliability Engineering
  • Own reliability qualification planning and execution for substrate products, test vehicles, coupons, and customer programs.
  • Define and manage reliability test plans, including 85°C/85%RH, biased HAST, temperature cycling, thermal shock, reflow simulation, MSL, high-temperature storage, insulation resistance, electromigration, electrochemical migration, CAF/dendrite testing, and mechanical reliability tests.
  • Analyze reliability failures and correlate them back to process, material, design, and contamination sources.
  • Run accelerated lifetime testing and extract activation energy and acceleration factor to develop reliability models of passive devices

Process Qualification and Ramp Support
  • Support process integration and product qualification for new substrate technologies, including glass substrates with TGV, ABF/polyimide build-up, fine-line RDL, ENEPIG or other surface finishes, and advanced packaging substrates.
  • Work with design, process, test, and quality teams to define product-specific reliability requirements and acceptance criteria.
  • Support transition from engineering lots to pilot production and high-volume manufacturing.

Requirements
  • Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or related field. Advanced degree preferred.
  • 8+ years of experience in semiconductor packaging.
  • This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities
  • A strong understanding of advanced substrate fabrication, glass or organic core substrates, copper plating and via metallization, RDL and fine-line lithography, surface finish processes, package-level reliability testing, and failure analysis.
  • Experience with reliability standards and test methods such as JEDEC, IPC, AEC-Q, or customer-specific qualification requirements.
  • Strong statistical analysis skills, including SPC, DOE, Cp/Cpk, GR&R, yield modeling, and data-driven root cause analysis. Must have strong analytical skills and be proficient in JMP analysis.
  • Experience preparing customer-facing reliability reports, qualification documents, 8D reports, and corrective action plans.
  • Experience with glass substrates, through-glass vias, TGV metallization, RF substrates, chiplet substrates, AI/HPC substrates, or advanced interposers is preferred.
  • Hands-on knowledge of analytical tools such as SEM/EDS, FIB, X-ray, SAM, ion chromatography, profilometry, metrology, electrical test, and cross-section analysis is preferred.
  • Experience ramping a new fab, pilot line, or advanced packaging manufacturing process is preferred.
  • Familiarity with customer qualification for aerospace, defense, telecom, automotive, AI/HPC, or high-reliability electronics markets is preferred.

Physical/Working Requirements
  • Must be able to wear personal protective gear most of the day (where applicable).
  • Prolonged periods of sitting or standing.

Behavioral Traits
  • Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
  • A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
  • The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.

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About 3D Glass Solutions

Sourced by ZipRecruiter

Industry

Electrical equipment, appliance, and component manufacturing

Company size

11 - 50 Employees

Headquarters location

Albuquerque, NM, US

Year founded

2006