Cycling Infrastructure Jobs (NOW HIRING)

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

We are seeking a Sr. Staff Thermo Mechanical Engineer to join our Advanced Technology Infrastructure team, focusing on mechanical simulation and structural reliability of semiconductor test and validation infrastructure. This role plays a critical part in ensuring the mechanical robustness, dimensional stability, and long term reliability of sockets, test assemblies, handlers/thermal heads and package level interfaces used in next generation high power XPU and Silicon Photonics programs.
You will work at the intersection of mechanical simulation, materials, packaging, test engineering, and manufacturing, applying advanced modeling and experimental techniques to understand stress, warpage, and process induced behavior across the full lifecycle-from early concept through validation and production readiness.
This position is ideal for an engineer who combines deep analytical modeling skills with hands on correlation and enjoys solving complex, multi physics mechanical problems in high stakes hardware environments.

What You Can Expect

• Perform advanced thermomechanical finite element simulations to evaluate stress, strain, deformation, and structural integrity of test sockets, thermal heads, interconnects, fixtures, handlers, and package interfaces

• Lead warpage and deformation analysis for multimaterial assemblies, accounting for CTE mismatch, nonlinear material behavior, temperature gradients, and boundary conditions

• Develop thermal cycling and mechanical fatigue models to predict longterm reliability, including creep, stress relaxation, and interface degradation

• Create processaware mechanical models capturing effects of assembly, cure, reflow, compression, pressfit, and loadpath evolution through manufacturing and test

• Translate package and test infrastructure requirements into mechanical design constraints and reliability metrics for early architecture decisions

• Correlate simulation results with mechanical testing, thermal cycling data, warpage metrology, and strain measurements to validate and refine models

• Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield

• Support rootcause analysis of lab or field issues related to cracking, delamination, contact degradation, excessive warpage, or mechanical instability

• Develop simulation methodologies, modeling guidelines, and best practices to improve consistency and prediction accuracy across programs

• Partner closely with thermal, packaging, test, reliability, and manufacturing teams to ensure mechanical compatibility and systemlevel alignment

• Interface with external vendors and manufacturing partners on material selection, tolerances, and mechanical performance expectations

• Document and communicate results through clear technical reports, design reviews, and executivelevel summaries

What We're Looking For

• Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience or Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience or equivalent professional experience in lieu of a formal degree

• Deep experience in thermomechanical simulation and structural FEA for complex, multimaterial systems

• Strong understanding of solid mechanics, material behavior, heatinduced stress, fatigue, and reliability physics

• Experience modeling warpage, contact mechanics, and mechanical interfaces in semiconductor or highprecision hardware

• Proficiency with simulation tools such as ANSYS, Abaqus, COMSOL, or equivalent, including nonlinear and transient analyses

• Handson experience correlating simulation with physical testing and metrology

• Ability to translate complex simulation results into actionable design guidance

• Strong communication skills and ability to influence crossfunctional technical decisions

• Experience with semiconductor packaging, test infrastructures, probe cards, or handlerintegrated mechanical systems

• Familiarity with thermal cycling standards and hardware qualification methodologies

• Experience with process modeling and manufacturinginduced stress analysis

• Scripting or automation experience using Python, MATLAB, or similar tools

• Prior technical leadership on crossorg infrastructure or platform programs

Expected Base Pay Range (USD)

118,010 - 176,800, $ per annum

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

#LI-TT1