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Cryogenic Engineering Jobs in Washington (NOW HIRING)

... engineering teams. * Familiarity with manufacturing systems such as Netsuite MRP, MES (Manufacturing Execution Systems), PLM (Arena/Agile), and Jira. * Experience with cryogenic system wiring or ...

Schedule delivery of packaged and cryogenic products to meet internal goals, customer expectation ... engineering company with 2025 sales of $34 billion. We live our mission of making our world more ...

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Cryogenic Engineering information

What are the key skills and qualifications needed to thrive as a cryogenic engineer, and why are they important?

To thrive as a Cryogenic Engineer, you need a solid background in mechanical, chemical, or electrical engineering, typically supported by a relevant engineering degree and experience in low-temperature systems. Familiarity with CAD software, cryogenic process simulation tools, and safety regulations, as well as certifications in cryogenics or pressure systems, are often required. Strong problem-solving abilities, attention to detail, and effective teamwork are critical soft skills for this field. These competencies ensure the safe and efficient design, operation, and maintenance of cryogenic systems, which are vital for applications in industries like aerospace, medical, and energy.

What is cryogenic engineering?

Cryogenic engineering is a specialized field of engineering that focuses on the production, maintenance, and application of extremely low temperatures, typically below -150°C (-238°F). This discipline involves the design and operation of equipment and systems used to produce, store, and transport liquefied gases such as liquid nitrogen, helium, and hydrogen. Applications of cryogenic engineering can be found in industries like aerospace, medical technology, energy, and scientific research, where materials and processes require ultra-low temperatures. Cryogenic engineers work on challenges related to thermal insulation, material properties at low temperatures, and safe handling of cryogenic fluids.

What is the difference between Cryogenic Engineering vs Mechanical Engineering?

AspectCryogenic EngineeringMechanical Engineering
Required CredentialsBachelor's or Master's in Cryogenic Engineering or related fieldsBachelor's or Master's in Mechanical Engineering
Work EnvironmentLaboratories, research facilities, industries handling low-temperature systemsFactories, design offices, manufacturing plants
Industry UsageSpecialized in low-temperature systems, liquefied gases, cryogenics researchBroad applications including machinery, automotive, aerospace

While both fields require engineering degrees, Cryogenic Engineering focuses on low-temperature systems and liquefied gases, often working in specialized labs and industries. Mechanical Engineering covers a wider range of mechanical systems and industries, making Cryogenic Engineering a niche within the broader mechanical field.

What are some common challenges faced by cryogenic engineers in daily operations?

Cryogenic engineers often work with extremely low temperatures, which presents unique challenges such as material brittleness, thermal contraction, and the need for specialized insulation. Ensuring safety and preventing leaks or contamination are critical, as even minor failures can have significant consequences. Additionally, cryogenic engineers frequently collaborate with multidisciplinary teams, including mechanical, electrical, and safety engineers, to design, test, and maintain complex systems. Adapting to new technologies and strict regulatory standards is also a regular part of the job.

How much does a cryogenic engineer make?

The average salary for a cryogenic engineer typically ranges from $70,000 to $120,000 per year, depending on experience, education, and location. Senior roles or those with specialized skills in cryogenic systems and certifications can earn higher salaries, often exceeding $150,000 annually.

What does a cryogenic engineer do?

A cryogenic engineer designs, develops, and maintains systems that handle extremely low-temperature fluids and gases, such as liquid nitrogen or helium. They work on applications like superconducting magnets, space technology, and liquefied gases, often using specialized tools and safety protocols to ensure system efficiency and safety.
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What cities in Washington are hiring for Cryogenic Engineering jobs? Cities in Washington with the most Cryogenic Engineering job openings:
Infographic showing various Cryogenic Engineering job openings in Washington as of August 2026, with employment types broken down into 88% Full Time, 8% Part Time, 3% Contract, and 1% Nights. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution.

NIST PREP Postdoc Associate in Metrology of Materials, Surfaces, and Processes for Semiconductor Adv

Southeastern Universities Research Association

Gaithersburg, MD • On-site

$70K - $90K/yr

Full-time

Re-posted 13 days ago


Job description

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest and thus requires that such institutions be the recipients of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration.
Research Title: Metrology of Materials, Surfaces, and Processes for Semiconductor Advanced Packaging
The work will entail: We are seeking a highly motivated researcher to advance measurement science for next-generation hybrid advanced packaging. This role will contribute to the development of novel surface and materials metrology methods that enable predictive control of bonding processes and heterogeneous integration. The successful candidate will work within the Dynamic Mechanical Metrology Project of the Quantum Measurement Division to help establish the quantitative foundations needed for reliable, high-density microelectronic assembly, supporting national efforts to strengthen U.S. leadership in semiconductor manufacturing and advanced packaging technologies.
The main responsibilities are:
  • Design, model, and performance of test methods to evaluate bond quality of bonded chip pairs using different wafer materials and bond methods.
  • Design and fabrication of test rigs for bond strength measurement.
  • Implement bond strength testing at cryogenic and high temperatures.
  • Closely coordinate with teams performing materials characterization, surface and thin film thin film characterization.

Qualifications
Necessary Qualifications:
  • PhD in mechanical engineer, physics, electrical engineering, materials science, or a related field.
  • Experience with wafer and/or hybrid chip bonding processes.
  • Experience with destructive test methods, such as those utilizing materials test machines or related instruments.
  • Proficiency in finite element modeling, using tools such as COMSOL or ANSYS
  • Proficiency in CAD, using tools such as SolidWorks or Autodesk.
  • Proficiency in programming languages, such as Python, Java, or Matlab.
  • Excellent communication skills and ability to work effectively in a team.

Desirable Qualifications:
  • Experience, including process development, in back-end semiconductor device fabrication, including wafer cleaning and handling.
  • Familiarity with silicon electronic and photonic device processing
  • Experience with custom infrared microscopy and optical measurement setups.
  • US citizenship strongly preferred

Privacy Act StatementAuthority: 15 U.S.C. § 278g-1(e)(1) and (e)(3) and 15 U.S.C. § 272(b) and (c)
Purpose: The National Institute for Standards and Technology (NIST) hosts the Professional Research Experience Program (PREP) which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post-bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty.
PREP is a 5-year cooperative agreement between NIST laboratories and participating PREP Universities to establish a collaborative research relationship between NIST and U.S. institutions of higher education in the following disciplines including (but may not be limited to) biochemistry, biological sciences, chemistry, computer science, engineering, electronics, materials science, mathematics, nanoscale science, neutron science, physical science, physics, and statistics. This collection of information is needed to facilitate the administrative functions of the PREP Program.
Routine Uses: NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to all the published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates.
Disclosure: Furnishing this information is voluntary. When you submit the form, you are indicating your voluntary consent for NIST to use of the information you submit for the purpose stated. By applying to a CHIPS-funded PREP opportunity, you also acknowledge that participation in the project requires signing a Non-Disclosure Agreement (NDA) prior to beginning any work.
SURA is an Equal Opportunity Employer. We believe that no one should be discriminated against because of their differences, such as age, disability, ethnicity, gender, gender identity and expression, religion, or sexual orientation. All employment decisions shall be made without regard to age, race, creed, color, religion, sex, national origin, ancestry, disability status, veteran status, sexual orientation, gender identity or expression, genetic information, marital status, citizenship status, or any other basis as protected by federal, state, or local law.
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