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Global electronic assembly process technology for Rockwell Automation

We are looking for a experienced engineering professional; exact level will be based on depth and quality of experience. This position will support global electronic assembly operations with significant onsite time at Mequon and New Berlin facilities, and reports to the manager of manufacturing process engineering - PCBA

This engineering role supports global electronic assembly operations across Rockwell Automation facilities and operates within a specialized team positioned at the intersection of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis.

The mission is to provide expert-level leadership in electronic assembly to enhance quality, reliability, throughput, and long-term profitability through standardization, strategic capital deployment, and technology innovation.

Technical Subject Matter Expertise

• Maintain deep expertise in at least two electronic assembly processes, including but not limited to: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick-and-place, SMT reflow, AOI, equipment maintenance & troubleshooting

Process & Standards Leadership

• Develop and deploy global electronic assembly process standards

• Reduce cost, improve quality, and increase throughput

• Author and maintain procedures, work instructions, and training materials

• Drive compliance to best‑practice standardization across global facilities

Capital Equipment & Technology Deployment

• Lead equipment selection, justification, purchase, and implementation

• Manage capital projects from requirement definition through production release

• Benchmark emerging electronic assembly technologies via suppliers, industry conferences, and technical forums

• Assessing global electronic assembly manufacturing facilities against standardized criteria

Data-Driven Process Optimization

• Use DOE, control charts, and statistical analysis

• Monitor and report electronic assembly KPIs to drive continuous improvement

• Apply Lean Six Sigma methodologies (DMAIC and DMADV)

Cross-Functional & Design Engagement

• Partner with design teams on DFM / DFA

• Integrate assembly considerations into Electronic Assembly Design Guidelines

• Share knowledge through presentations, documentation, and technical reviews

• Bachelor's Degree in Relevant Field

• Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job opening

• Typically requires 8 years of experience

• BS or MS in Engineering (Mechanical, Electrical, or Industrial preferred)

• 7–10+ years hands‑on electronic assembly manufacturing experience

• Depth in solder profiling, SMT, post‑SMT or conformal coat processes

• IPC‑A‑610 familiarity

• Lean Six Sigma experience (Green Belt+ preferred)

You should be proficient in:

• Bachelor's Degree
• 5 Why (Root Cause Analysis Method)
• ISO 22000
• Process Engineering
• Design for Assembly (DFA)
• Electrical / Electronic Systems
• Engineering Degree
• AS9100 Experience