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Chip Factory Jobs in Portland, OR (NOW HIRING)

Intel

EDA Tools Hardware Engineer

Hillsboro, OR · On-site

$141K - $269K/yr

Chip-level placement and routing coordination * Power grid planning and analysis * Clock tree ... Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

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Senior Business Intelligence Analyst

Hillsboro, OR · On-site

$104K - $156K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Field Service Engineer 3 (Non-Exempt)

Hillsboro, OR · On-site

$83K - $125K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Program Manager 3

Hillsboro, OR · On-site

$144K - $216K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Manager, QA Engineering

Hillsboro, OR · On-site

$129K - $194K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Manager, QA Engineering

Hillsboro, OR · On-site

$129K - $194K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Senior Director of Software Engineering

Hillsboro, OR · On-site

$275K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Field Service Engineer 1 (Non-Exempt)

Hillsboro, OR · On-site

$46K - $70K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

Onto

Field Service Engineer 1 (Non-Exempt)

Hillsboro, OR · On-site

$46K - $70K/yr

... chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for ...

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Showing results 1-20

All JobsChip Factory JobsChip Factory Jobs in Portland, OR

Chip Factory information

See Portland, OR salary details

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How much do chip factory jobs pay per hour?

As of Aug 3, 2026, the average hourly pay for chip factory in Portland, OR is $15.90, according to ZipRecruiter salary data. Most workers in this role earn between $14.81 and $16.06 per hour, depending on experience, location, and employer.

What is a chip factory?

A chip factory, also known as a semiconductor fabrication plant or 'fab,' is a specialized facility where semiconductor devices, such as microchips and integrated circuits, are manufactured. These factories use advanced equipment and processes to create tiny electronic components from silicon wafers, which are essential for computers, smartphones, automotive electronics, and many other devices. Chip factories require extremely clean environments, called cleanrooms, to prevent contamination during production. The manufacturing process is highly complex, involving multiple steps like photolithography, doping, and etching. Due to the precision and technology involved, building and operating a chip factory is a significant investment.

What is the difference between Chip Factory vs Chip Assembler?

AspectChip FactoryChip Assembler
Role FocusOversees manufacturing processes, manages equipment, and ensures quality control in chip production facilities.Assembles semiconductor components onto circuit boards, focusing on placement and soldering.
Required SkillsKnowledge of manufacturing equipment, quality standards, and safety protocols.Manual dexterity, attention to detail, and familiarity with assembly tools.
Work EnvironmentFactories with heavy machinery and production lines.Assembly lines or cleanroom environments.
Common CertificationsManufacturing or technical certifications, safety training.None specific, but technical training is beneficial.

The main difference between a Chip Factory worker and a Chip Assembler lies in their roles: the factory worker manages the manufacturing process and equipment, while the assembler focuses on putting together semiconductor components. Both roles are essential in the semiconductor industry but require different skill sets and work environments.

What are the key skills and qualifications needed to thrive as a chip factory worker?

To thrive as a Chip Factory Worker, you typically need a high school diploma, attention to detail, and basic math skills for handling manufacturing processes. Familiarity with semiconductor fabrication equipment, cleanroom protocols, and quality control systems is common, and some employers may require certifications in electronics or safety. Strong teamwork, reliability, and the ability to follow precise instructions are crucial soft skills in this environment. These competencies ensure efficient production, maintain high product quality, and uphold safety standards in the fast-paced chip manufacturing industry.

What are some common challenges faced by employees working in a chip factory, and how can they be addressed?

Employees in a chip factory often encounter challenges such as maintaining cleanroom protocols, working with complex and sensitive machinery, and meeting production targets in a fast-paced environment. Adhering to strict hygiene and safety standards is crucial to prevent contamination of semiconductor products. Continuous training, clear communication, and teamwork help employees overcome these challenges and ensure efficient manufacturing processes. Support from supervisors and access to up-to-date equipment also play key roles in fostering a productive and safe work environment.
What are popular job titles related to Chip Factory jobs in Portland, OR? For Chip Factory jobs in Portland, OR, the most frequently searched job titles are:
What job categories do people searching Chip Factory jobs in Portland, OR look for? The top searched job categories for Chip Factory jobs in Portland, OR are:
Chip Factory jobs near you
Infographic showing various Chip Factory job openings in Portland, OR as of July 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $33,082 per year, or $15.9 per hour.

Principal Collateral Device Engineer

Intel

Hillsboro, OR • On-site

Full-time

Medical, Retirement, PTO

Re-posted 2 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

20th of 156 rated electronics manufacturers

Job description

Job Details:Job Description: 

Intel is transforming from an Integrated Device Manufacturer (IDM) to a leading foundry service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the forefront of this transformation, focusing on yield improvement, performance optimization, and exceptional customer service delivery.

We are seeking a Principal Collateral Device Engineer to join our team within MDCE. This role requires regular onsite presence to fulfill essential job responsibilities and will creates next generation device and interconnect technology by ensuring the process device performance for developing processes is world class, using deep understanding of device physics.

Key Responsibilities:

  • Demonstrated expertise in leading cross functional group in defining derivative architectures including Design rules, transistors and interconnects. Expertise in CMOS semiconductor device physics and test chip design for advanced transistor device architecture.

  • Experience in scribe line layout design and process monitoring structure development.

  • Proficiency in design rule development, validation, and waiver management processes.

  • Strong understanding of DTCO skills Including understanding of SRAM, Standard cells and be the key interface and bridge between Process Integration , Yield, Device and Design.

  • Strong skills in data analysis, scripting, and statistical techniques for test chip data interpretation.

  • Excellent technical problem-solving skills with ability to balance design rule compliance with customer flexibility needs.

  • Ability to work collaboratively in globally diverse, cross-disciplinary teams to develop innovative device collateral solutions.

  • Demonstrated experience with design of experiment (DOE) principles applied to device collateral optimization.

  • Proven track record of delivering device collateral solutions in a fast-paced manufacturing environment.

  • Desire to learn, lead, and influence cross-functional teams in collateral development and design rule optimization.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Master's degree in Electrical Engineering, Physics, or related field

  • 15+ years of experience in CMOS device engineering with focus on test chip design and device collateral development

Preferred Qualifications:

  • Ph.D. degree in Electrical Engineering, Physics, or related field

  • 15+ years of experience in CMOS device engineering and collateral development

  • Hands-on experience in advanced node test chip design and scribe line optimization for 3nm-16nm FinFETs and sub 3nm GAA FETs

  • Experience with design rule checker (DRC) development and physical verification flows

  • Experience in High-Volume Manufacturing environment with focus on yield monitoring and process control structures

  • Knowledge of statistical process control (SPC) and advanced data analytics for device collateral optimization

  • Knowledge of mask generation including Boolean/OPC .

Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, California, Santa ClaraAdditional Locations:US, Arizona, Phoenix, US, Oregon, HillsboroBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $224,970.00-317,600.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

Pay

Benefits

Hours and flexibility

Workplace

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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