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Bump Jobs (NOW HIRING)

DensityAI

Package Layout Engineer

Mountain View, CA

$200K - $275K/yr

You'll take multi-die 2.5D and 3D packages from bump map through tapeout release -- defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high ...

DensityAI

Package Layout Engineer

Mountain View, CA · On-site

$200K - $275K/yr

You'll take multi-die 2.5D and 3D packages from bump map through tapeout release - defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high ...

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Bump information

See salary details

$278

$5.7K

$6.8K

How much do bump jobs pay per week?

As of Aug 17, 2026, the average weekly pay for bump in the United States is $5,654.77, according to ZipRecruiter salary data. Most workers in this role earn between $4,509.62 and $6,730.77 per week, depending on experience, location, and employer.

What is a bump?

A 'Bump' job typically refers to a position within the live events, film, or broadcasting industry, where a 'bump' crew is responsible for the setup (bump-in) and teardown (bump-out) of equipment, staging, and sets. These roles involve physically demanding work, often outside of regular business hours, and require teamwork and attention to detail. Bump staff may be involved in lighting, audio, video, and general stagehand duties, helping to ensure that events run smoothly and efficiently.

What are the key skills and qualifications needed to thrive as a bump (rigging technician), and why are they important?

To thrive as a Rigging Technician (sometimes called a 'Bump'), you need a solid understanding of rigging techniques, mechanical principles, and safety standards, often supported by relevant OSHA certifications or technical training. Familiarity with rigging hardware, lifting equipment, and load calculation software is typically required. Strong attention to detail, teamwork, and effective communication are key soft skills for coordinating with other crew members and ensuring safe operations. These skills and qualities are crucial for maintaining safety, efficiency, and reliability in environments like construction sites, film sets, or live events.

What are some common challenges faced by bump technicians in film and television production, and how can they be addressed?

Bump Technicians in film and television often face tight deadlines and last-minute changes to set designs or props, requiring adaptability and problem-solving skills. Managing multiple requests from various departments, such as art or lighting, can be challenging, so strong communication and organizational abilities are essential. Building good relationships with the crew and proactively seeking clarification on tasks can help ensure smooth operations and successful project completion.

What is the difference between Bump vs Delivery Driver?

AspectBumpDelivery Driver
Required CredentialsNone or basic licenseValid driver's license, possibly specific vehicle certifications
Work EnvironmentWarehouse, retail stores, or event venuesOn the road, customer locations, various routes
Employer & Industry UsageRetail, logistics, event companiesFood services, courier services, e-commerce
Common Search & ComparisonYesYes

While both Bump and Delivery Driver roles involve transportation, Bump typically refers to moving items within a location or event, often requiring minimal credentials. Delivery Drivers focus on transporting goods or food to customers, often needing a valid license and familiarity with routes. Understanding these differences helps job seekers find the right position based on credentials, environment, and industry expectations.

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What states have the most Bump jobs?

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Bump jobs near you
Infographic showing various Bump job openings in the United States as of August 2026, with employment types broken down into 92% Full Time, 4% Part Time, 1% Temporary, 2% Contract, and 1% Nights. Highlights an 98% Physical, 1% Hybrid, and 1% Remote job distribution, with an average salary of $294,048 per year, or $141.4 per hour.

Senior/Staff Process Engineer (Wafer Bumping/Fan-Out)

Doist

San Jose, CA • On-site

$120 - $180/hr

Other

Posted 4 days ago

Job description

# Senior/Staff Process Engineer (Wafer Bumping/Fan-Out)Lumilens • San Jose, CA • • 2h agoSave this role or tell us whether you want more jobs like it.**Core Responsibilities*** Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers, with OSAT or at internal line.* Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin.* Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric photoresists, plating chemistries, underfills, and solder alloys.* Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).* Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to WLCSP (e.g., RDL cracking, bridging ball bridging, bump missing, delamination, or wafer warpage). Utilize specialized analytics instrumentation including SEM, CSAM, and physical cross-sectioning. Conduct root cause analysis and formulate improvement solutions.* Optimize key bumping process parameters including wafer cleaning, UBM sputtering, solder ball plating, reflow and bump inspection to improve bump uniformity and yield.* Manage incoming wafer quality control, establish SPC control plans and monitor process variation to ensure long-term process stability* Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.**Key Requirements & Qualifications*** **Education:** A bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.* **Experience:** 5+years of hands-on wafer bumping or Fan-out process integration or development experience, at OSAT or IDM internal advanced packaging line. Process exposure/experience on interposer, 2.5D/3D, chip on wafers on substrate, will be an added advantage.* **Technical Knowledge:** + Deep practical understanding and hands-on experience of photolithography, wet etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD), moulding process adapted for backend bump fabrication. + Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity. + Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.* **Software Tools:** High proficiency with robust analytical platforms like JMP, Minitab, or Python. #J-18808-Ljbffr

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