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Apprentice Principal Packaging Engineer Jobs (NOW HIRING)

Velaura

Principal Packaging Engineer

Boston, MA · On-site

$200K - $300K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura's next-generation SoCs. This role will lead packaging from concept through ...

CONAGRA

Principal Packaging Engineer

Chicago, IL · On-site

$109K - $159K/yr

You will also act as a technical mentor and key resource for packaging engineering platforms. A Taste of Your Responsibilities * Champion ideas for technology improvements, compliance requirements ...

Ingredion

Principal Packaging Engineer

Indianapolis, IN · On-site

$123K - $164K/yr

Mechanical Engineering is preferred, but Chemical, Industrial, Packaging, and Electrical Engineering are also considered.Experience with packaging equipment (robots, metal detection, force flow ...

SCHWAN'S

Principal Packaging Engineer

Hopkins, MN · On-site

$107K - $178K/yr

We are hiring a Principal Packaging Process Engineer in our R&D Team supporting ourNorth American business, and this person will be responsible for supporting package development projects that meet ...

Conagra Brands

Principal Packaging Engineer

Chicago, IL · Hybrid

$109K - $159K/yr

You will also act as a technical mentor and key resource for packaging engineering platforms. A Taste of Your Responsibilities * Champion ideas for technology improvements, compliance requirements ...

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All JobsApprentice Principal Packaging Engineer Jobs

Apprentice Principal Packaging Engineer information

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How much do apprentice principal packaging engineer jobs pay per hour?

As of Sep 14, 2026, the average hourly pay for apprentice principal packaging engineer in the United States is $18.39, according to ZipRecruiter salary data. Most workers in this role earn between $14.66 and $21.88 per hour, depending on experience, location, and employer.

What is the difference between Apprentice Principal Packaging Engineer vs Packaging Engineer?

AspectApprentice Principal Packaging EngineerPackaging Engineer
Required CredentialsEntry-level, often pursuing or with a degree in packaging or engineeringBachelor's degree in packaging, engineering, or related field
Work EnvironmentTraining-focused, supervised, often in manufacturing or R&D settingsDesign, development, testing, and implementation of packaging solutions
Employer & Industry UsageManufacturers, packaging companies, consumer goods industriesConsumer goods, food & beverage, pharmaceuticals, manufacturing

The Apprentice Principal Packaging Engineer is an entry-level role focused on learning and supporting packaging projects under supervision, while the Packaging Engineer is a more experienced professional responsible for designing and developing packaging solutions independently. Both roles are common in manufacturing and consumer goods industries, but the apprentice position emphasizes training and skill development.

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Apprentice Principal Packaging Engineer jobs near you
Infographic showing various Apprentice Principal Packaging Engineer job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 89% Full Time, 7% Part Time, and 3% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $38,247 per year, or $18.4 per hour.

Principal Packaging Engineer

Boston, MA • On-site

Velaura
See more jobs at Velauraexternal

$200K - $300K/yr

Full-time

Medical, Dental, Vision, PTO

Re-posted yesterday

Key responsibilities

  • Own package architecture from concept through production for Velaura SoCs.

  • Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.

  • Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.

Job description

Role Overview
We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura's next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.
Responsibilities

 Own package architecture from concept through production for Velaura SoCs.

 Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.

 Drive package technology selection, including flip-chip, advanced substrates, fan-out, and future multi-die integration approaches.

Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.

 Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.

Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification.

Work with foundry, assembly, substrate, and test partners to successfully deliver products to production.

Help define Velaura's long-term packaging roadmap as future products evolve.

Required Qualifications

Deep experience developing advanced semiconductor packages for high-performance SoCs.

Strong understanding of package architecture, substrate technologies, bumping, assembly flows, and manufacturing.

Experience co-optimizing package design with silicon, board, SI/PI, thermal, and mechanical teams.

Hands-on experience with signal integrity, power integrity, thermal, and reliability

considerations in advanced packages.

Ability to balance technical excellence with cost, yield, manufacturability, and schedule.

Excellent communication skills and a collaborative, first-principles engineering mindset.

Preferred Qualifications

Advanced packaging technologies including chiplets, 2.5D integration, silicon bridges, or heterogeneous integration.

HBM integration and high-bandwidth memory package architecture.

Advanced process nodes (N3, N2, or beyond).

Experience working with leading foundries, OSATs, and substrate vendors.

Experience in an early-stage semiconductor company.

$200,000 - $300,000 a year
Compensation & Benefits

At Velaura, we believe exceptional talent deserves exceptional rewards. Compensation for this role includes a base salary and very competitive equity compensation, allowing team members to share in the company's long-term success.

The base pay listed represents a good faith estimate that the Company reasonably expects to pay for this position at the time of hire. Actual compensation will depend on multiple factors, including the candidate's skills, qualifications, relevant experience, and geographic location.

In addition to base salary and equity compensation, Velaura offers a comprehensive benefits package that may include medical, dental, and vision coverage; paid time off; flexible work arrangements; professional development opportunities; and other benefits designed to support the well-being and growth of our team.

Velaura is committed to pay equity and transparency and regularly benchmarks compensation to ensure we remain competitive in the market.

Why Velaura?

Velaura is building next-generation compute technology for cloud, edge, and Physical AI. Our solutions will enable robots, autonomous systems, drones, and other intelligent machines to operate efficiently in the physical world.
This is an opportunity to help build foundational technology at a time when the industry is undergoing fundamental change. You will work alongside experienced leaders, architects, engineers, and operators who have delivered industry-defining products across mobile, cloud, semiconductor, and AI platforms. If you enjoy solving difficult problems, working across disciplines, and helping shape the future of Physical AI, we would love to hear from you.

Equal Employment Opportunity and Accommodations

Velaura is an Equal Opportunity Employer that is committed to inclusion and diversity. Qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, disability or protected veteran status. We also take affirmative action to offer employment
opportunities to minorities, women, individuals with disabilities, and protected veterans.

Velaura is committed to working with qualified individuals with physical or mental disabilities. Applicants who would like to contact us regarding the accessibility of our website or who need special assistance or a reasonable accommodation for any part of the application or hiring process may contact us at: [email protected]. This contact
information is for accommodation requests only. Evaluation of requests for reasonable accommodation will be determined on a case-by-case basis.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
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