IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract โ 1 Year +
No openings : 4
Skills Required
Bachelorโs or Masterโs degree in Electrical /Electronics Engineering
Experience Tier: Senior-level (primary); Mid-level (secondary)
โข Senior-Level: ~10+ years in IC packaging / package design
โข Mid-Level: 4โ6+ years (MS) or 6+ years (BS) in IC packaging / package design
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
โข Physical Design & Layout
โข Substrate design and layout
โข SI/PI aware design implementation
โข Design for performance, manufacturability, yield, and reliability
โข Design rule compliance
Thanks :