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Advanced Packaging Jobs in Gilbert, AZ (NOW HIRING)

Packaging Technical Program Manager

Phoenix, AZ · On-site

$128K - $165K/yr

You will lead cross-functional programs that support APTM manufacturing quality systems, advanced packaging readiness, supplier quality improvements, phase gate readiness, and measurable outcomes ...

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

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Advanced Packaging information

See Gilbert, AZ salary details

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How much do advanced packaging jobs pay per hour?

As of Aug 21, 2026, the average hourly pay for advanced packaging in Gilbert, AZ is $18.79, according to ZipRecruiter salary data. Most workers in this role earn between $16.30 and $19.90 per hour, depending on experience, location, and employer.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

Is advanced packaging a stable career?

Advanced packaging is a stable career within the electronics and semiconductor industries, as demand for miniaturized and high-performance electronic devices continues to grow. Professionals in this field often require technical skills, certifications, and familiarity with manufacturing processes, which support long-term employment opportunities.

What cities near Gilbert, AZ are hiring for Advanced Packaging jobs?

Cities near Gilbert, AZ with the most Advanced Packaging job openings:

Infographic showing various Advanced Packaging job openings in Gilbert, AZ as of August 2026, with employment types broken down into 1% As Needed, 78% Full Time, 19% Part Time, and 2% Contract. Highlights an 84% Physical, 3% Hybrid, and 13% Remote job distribution, with an average salary of $39,073 per year, or $18.8 per hour.

Packaging Technical Program Manager

Intel

Phoenix, AZ • On-site

$128K - $165K/yr

Full-time

Medical, Retirement, PTO

Posted 27 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers


Job description

Job Details:Job Description: 

The Role and Impact
Intel Foundry is building the operating discipline needed to deliver complex manufacturing, packaging, and technology commitments with speed, quality, and confidence. This role drives the systems, signals, and execution routines that show what is ready, what is at risk, and what needs action for APTM phase gate execution.
You will lead cross-functional programs that support APTM manufacturing quality systems, advanced packaging readiness, supplier quality improvements, phase gate readiness, and measurable outcomes across Assembly, Packaging, Test, and Manufacturing operations. This role is designed for a technically strong program leader who can operate in the details, communicate at the right level of detail, and drive disciplined follow-through across organizations.

What You'll Accomplish

  • Build and execute project and program plans aligned to business objectives, phase gate requirements, quality system needs, technology scope, timelines, resources, and stakeholder expectations.
  • Drive program life cycles from planning through implementation, testing, documentation, training, change control, close-out, and lessons learned.
  • Lead cross-functional collaboration across APTM, Foundry manufacturing, quality, supplier, automation, central services, and customer-facing organizations.
  • Create visibility to program health by tracking schedule, cost, resources, risks, dependencies, quality metrics, key performance indicators, and readiness status.
  • Run schedule, milestone, readiness, and stakeholder reviews that surface issues early, drive decisions, and maintain execution discipline.
  • Clarify user, technical, manufacturing, phase gate, and quality requirements so APTM and partner teams understand ownership, dependencies, and deliverables.
  • Identify risks, execution gaps, and decision points; define mitigation plans that protect program stability and business continuity.
  • Communicate status, issues, impacts, decisions, and recovery actions clearly to technical, operational, and executive audiences.
  • Support quality automation, dashboards, Quality Review Board governance improvements, supplier quality initiatives, phase gate execution improvements, and systemic quality improvements for APTM execution.

Behavioral Traits

  • High ownership mindset with a structured, disciplined approach to program execution, quality, and operational excellence.
  • Ability to turn ambiguity into direction across complex, multi-site environments.
  • Strong stakeholder management and communication skills for technical, operational, and executive audiences.
  • Strong problem-solving, risk management, program management, and execution skills in fast-paced environments.
  • Ability to influence, align, and drive accountability across Foundry, supplier, factory, and central organizations.

What Intel Foundry Can Offer You

  • High-visibility work that directly supports Intel Foundry phase gate execution and APTM manufacturing quality outcomes.
  • Exposure to advanced packaging, manufacturing quality systems, supplier readiness, and cross-functional Foundry execution.
  • Opportunity to build operating discipline, readiness visibility, and repeatable execution models for complex technology programs.
  • Collaboration with technical, operational, and customer-facing teams across Intel Foundry.

This position is not eligible for Intel immigration sponsorship

Qualifications:

The minimum qualifications are required to be initially considered for this position. Minimum qualifications may be obtained through a combination of industry-relevant job experience, internship experience, and/or schoolwork, classes, or research. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.


Minimum Qualifications

  • Bachelor's degree in engineering, Technology, Operations, Program Management, or a related discipline.
  • 7+ years of experience in:
    • Packaging technology, manufacturing, quality, engineering, operations, or project/program management environments.
    • leading complex, cross-functional projects or programs with measurable business, technical, or operational outcomes.
    • building project plans and managing schedules, risks, resources, dependencies, documentation, and stakeholder communications.
  • Ability to lead through influence across manufacturing, quality, supplier, central service, customer-facing, and APTM stakeholder organizations.

Preferred Qualifications

  • Master's degree in engineering, Technology, Operations, Program Management, or a related discipline.
  • 10+ years of experience in:
    • Packaging technology, manufacturing, quality, engineering, operations, or project/program management environments.
    • APTM, semiconductor manufacturing, substrate, wafer-level assembly, advanced packaging, or phase gate execution environments.
    • Supporting quality systems, supplier quality, corrective and preventive actions, 8D problem solving, Quality Review Boards, or systemic improvement initiatives.
    • Deploying automation, dashboards, key performance indicators, performance management systems, or business process improvements across multiple sites.
    • Understanding of industry-standard Quality and Reliability expectations.
    • Supporting Foundry customers or customer-facing quality requirements.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,320.00-236,810.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968