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Advanced Packaging Jobs in Gilbert, AZ (NOW HIRING)

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$135K/yr

Prior experience in optimizing silicon performance and conducting tradeoff studies for advanced packaging designs. Join Intel and become an integral part of shaping tomorrow's technology today. Apply ...

Intel

Packaging Technical Program Manager

Phoenix, AZ · On-site

$128K - $165K/yr

You will lead cross-functional programs that support APTM manufacturing quality systems, advanced packaging readiness, supplier quality improvements, phase gate readiness, and measurable outcomes ...

INTEL

Packaging Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

Intel Corporation

Packaging Module Engineer

Phoenix, AZ · On-site

The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of ...

Intel

Packaging Module Engineer

Phoenix, AZ · On-site

The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of ...

INTEL

Packaging Module Engineer

Phoenix, AZ · On-site

The Role and Impact As a Packaging Module Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of ...

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Advanced Packaging information

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How much do advanced packaging jobs pay per hour?

As of Aug 10, 2026, the average hourly pay for advanced packaging in Gilbert, AZ is $18.79, according to ZipRecruiter salary data. Most workers in this role earn between $16.30 and $19.90 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What cities near Gilbert, AZ are hiring for Advanced Packaging jobs? Cities near Gilbert, AZ with the most Advanced Packaging job openings:
Advanced Packaging jobs near you
Infographic showing various Advanced Packaging job openings in Gilbert, AZ as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 15% Part Time, and 5% Contract. Highlights an 83% Physical, 5% Hybrid, and 12% Remote job distribution, with an average salary of $39,073 per year, or $18.8 per hour.

Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging

Amazon

Tempe, AZ • On-site

Full-time

Re-posted 5 days ago

Amazon rating

7.4

Company rating: 7.4 out of 10

Based on 7,073 frontline employees who took The Breakroom Quiz

6th of 39 rated national retailers

Job description

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
We are seeking a Sr

Package Layout Engineer to lead the end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will own the package layout from initial floor planning through tape out and manufacturing release. You'll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
Key job responsibilities
- Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release.
- Drive physical design of advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Define and optimize package floorplans considering die placement, bump maps, power/ground distribution, high-speed signal escape routing, and decoupling capacitor placement.
- Perform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers.
- Participate in die-level RDL routing and bump planning in coordination with ASIC physical design teams, ensuring the die-package interface is co-optimized for power delivery and signal routing from the earliest design stages.
- Drive cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels to achieve the best overall power delivery network and high-speed signaling performance, minimizing impedance discontinuities and routing bottlenecks at each interface boundary.
- Develop and maintain package stack-up definitions in collaboration with SI/PI and materials engineering teams, ensuring impedance targets, layer utilization, and manufacturing constraints are met.
- Create and enforce package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance and high yield.
- Run and review physical verification checks (DRC, connectivity, shorts/opens) and drive design closure with zero escapes.
- Manage package design schedules, milestones, and deliverables, coordinating across multiple concurrent projects and tape out cycles.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.
- Interface with OSAT vendors and foundry partners on substrate and interposer manufacturing feasibility, design rule negotiations, and process capability alignment.
- Identify packaging technology risks early and propose design or process mitigations to ensure reliability and manufacturability.
- Mentor junior layout engineers and contribute to the development of team best practices, automation flows, and design reuse strategies.
About the team
Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and we're building an environment that celebrates knowledge-sharing and mentorship

Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.
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About Amazon

Sourced by ZipRecruiter

Amazon.com, Inc., commonly known as Amazon, is an American multinational technology company. It was founded by Jeff Bezos in 1994 and initially started as an online marketplace for books. Since then, Amazon has expanded its operations and become one of the largest e-commerce companies in the world. Amazon's primary business is its online retail platform, where customers can purchase a vast array of products, including electronics, clothing, books, home goods, and much more. The company offers a convenient and user-friendly shopping experience, with features such as fast shipping, customer reviews, and personalized recommendations. In addition to its e-commerce platform, Amazon has diversified its business into various other areas. One of its notable ventures is Amazon Web Services (AWS), a comprehensive cloud computing platform that provides services such as storage, compute power, and database management to individuals and businesses. AWS has become a leader in the cloud computing industry, powering many websites and applications worldwide. Amazon has also developed its own consumer electronics, including the popular Amazon Kindle e-reader, Fire tablets, Fire TV streaming devices, and the Alexa-powered Echo smart speakers. The Alexa voice assistant, integrated into these devices, allows users to interact with their devices using voice commands, perform tasks, and access information. Furthermore, Amazon has expanded into media and entertainment. It operates Prime Video, a streaming service that offers a wide range of movies, TV shows, and original content. Amazon Music provides a platform for streaming and purchasing digital music, while Audible offers audiobooks and other audio content. The company's commitment to customer satisfaction and convenience is demonstrated by its membership program, Amazon Prime. Prime members receive various benefits, including free two-day shipping, access to streaming services, exclusive deals, and more.

Industry

It services, book publishers, retail, real estate and computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Seattle, WA, US

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