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Advanced Packaging Jobs in California (NOW HIRING)

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Advanced Packaging information

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How much do advanced packaging jobs pay per hour?

As of Aug 9, 2026, the average hourly pay for advanced packaging in California is $18.60, according to ZipRecruiter salary data. Most workers in this role earn between $16.15 and $19.71 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in advanced packaging?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in advanced packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an advanced packaging?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are popular job titles related to Advanced Packaging jobs in California? For Advanced Packaging jobs in California, the most frequently searched job titles are:
What cities in California are hiring for Advanced Packaging jobs? Cities in California with the most Advanced Packaging job openings:
Infographic showing various Advanced Packaging job openings in California as of August 2026, with employment types broken down into 1% As Needed, 71% Full Time, 24% Part Time, 2% Temporary, and 2% Contract. Highlights an 86% Physical, 2% Hybrid, and 12% Remote job distribution, with an average salary of $38,685 per year, or $18.6 per hour.

Staff Program Manager - Advanced Packaging Technology

Broadcom

Irvine, CA

$109K - $175K/yr

Full-time

Re-posted 25 days ago


Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers


Job description

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Job Description:

Staff Program Manager - Advanced Packaging Technology

Overview
The Staff Program Manager will manage one or more very large scale Advanced Packaging manufacturing projects, through the entire lifecycle from greenfield factory construction, to tool procurement, and all the way to production ramp. Extensive collaboration is required with all stakeholders (R&D and Factory Teams, internal Project Team members & executives, Partners, EPC Contractor and Tool Vendors worldwide) to achieve all project milestones on schedule and within budget, with proven yield and quality in production


Key Responsibilities
Technology Development and Transfer for Production
Achieve on time Technology Qualification, through collaborate with in-house and partner R&D teams developing disruptive technologies.
Facilitate successful Technology Transfer from R&D into High Volume Manufacturing (HVM)
Factory Construction
Coordinate greenfield construction of a very large scale advanced packaging manufacturing facility
Manage the EPC contractor and other local architectural, engineering, and sub- contractor firms to ensure strict timeline and safety compliance.
Oversee compliance with local codes / requirements for land development, civil engineering, cleanroom construction, and facility hook-up.
Report program status, budget variances, and milestone achievements directly to executive leadership.
Tool Procurement & Integration
Work with Factory and R&D Teams on Tool selection, procurement, logistics, and installation of next generation equipment for Heterogeneous Integration from global tier-one vendors
Coordinate complex international logistics to import highly sensitive tooling and materials
Oversee the hook-up, facility integration, and initial hardware qualification of all manufacturing lines.
Production Ramp & Yield Optimization
Partner with Factory & R&D teams and Tool vendors, for operational transition from tool qualification to HVM readiness
Accelerate yield learning curves and meet target defect-density metrics in collaboration with process engineering and quality teams
Manage manufacturing cycle time, line balancing, and factory automation deployment during the ramp phase.
Establish standard operating procedures (SOPs) and training pipelines to upscale the local workforce for stable production.
Financial & Local Regulatory Compliance
Manage multi-billion-dollar CapEx and OpEx budgets and cash flows, in collaboration with Finance teams.
Ensure compliance with local Regulatory Agency requirements
Implement strict risk-mitigation frameworks to handle supply chain bottlenecks and labor market constraints.
Required Qualifications
Education & Experience
Education: Master's degree in Engineering, Materials Science, or related STEM field. MBA preferred.
Experience: 6+ years managing very large projects, with explicit experience in greenfield factory construction and factory ramps.
Domain: Deep technical understanding of advanced packaging and semiconductor manufacturing technologies (Heterogeneous Integration, Substrates, Co-packaged Optics).
Ramp Expertise: Proven track record transitioning a semiconductor facility from construction to high-volume production.
Geography: Foundational knowledge of delivering large-scale offshore industrial projects


Skills & Certifications
Certifications: PMP, PgMP, or equivalent senior-level project management credentials.
Operations: Strong grasp of factory physics, statistical process control (SPC), yield management, and Lean manufacturing.
Supply Chain: Expertise in managing global semiconductor tool and material vendors.
Software: Advanced mastery of enterprise scheduling tools (e.g., Primavera P6, MS Project).
Soft Skills: Exceptional stakeholder management skills for navigating dynamically changing business and product requirements

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is$109,700 - $175,500

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.


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