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$12

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$26

How much do advanced packaging jobs pay per hour?

As of Jul 16, 2026, the average hourly pay for advanced packaging in California is $18.60, according to ZipRecruiter salary data. Most workers in this role earn between $16.15 and $19.71 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Advanced Packaging position, and why are they important?

To excel in Advanced Packaging, you need a strong background in materials science, engineering, semiconductor fabrication, and process optimization, often supported by a relevant degree and industry experience. Familiarity with advanced packaging equipment, cleanroom protocols, and design software such as CAD tools or SEM analysis is typically required. Attention to detail, problem-solving abilities, and effective cross-functional communication are valuable soft skills in this role. These competencies are vital for developing innovative packaging solutions that meet stringent technical standards and support product reliability in high-tech manufacturing environments.

What are the most common challenges faced by professionals in Advanced Packaging roles?

Professionals in Advanced Packaging frequently encounter challenges related to keeping pace with rapidly evolving semiconductor technologies and strict quality control standards. The work often requires collaborating closely with R&D, process engineering, and manufacturing teams to troubleshoot issues and continuously improve packaging designs. Maintaining precision in a high-stakes, cleanroom environment and adapting to new materials or methods are also common aspects of the job. These challenges offer valuable opportunities for skill development and innovation, making the role both demanding and rewarding for those passionate about advanced manufacturing.

What is an Advanced Packaging job?

An Advanced Packaging job involves developing and implementing semiconductor packaging technologies to enhance performance, power efficiency, and miniaturization. Professionals in this role work on heterogeneous integration, 2.5D/3D packaging, wafer-level packaging, and advanced interconnect solutions. They collaborate with design, process, and manufacturing teams to optimize package reliability and scalability. This role is critical in enabling next-generation chips for applications like AI, high-performance computing, and mobile devices.

What are popular job titles related to Advanced Packaging jobs in California? For Advanced Packaging jobs in California, the most frequently searched job titles are:
What job categories do people searching Advanced Packaging jobs in California look for? The top searched job categories for Advanced Packaging jobs in California are:
What cities in California are hiring for Advanced Packaging jobs? Cities in California with the most Advanced Packaging job openings:
Advanced Packaging jobs near you
Advanced Packaging Development Engineer

Advanced Packaging Development Engineer

Broadcom

Irvine, CA • On-site

$127K - $203K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 20 days ago

Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz

11th of 142 rated electronics manufacturers

Job description

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Job Description:

Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.

Key job scope includes

- packaging technology roadmap future product needs for 3-5 years

- support development of key components (HBM, iVR, Si Cap) for advanced packaging

- manage reliability test to qualify new technology

- lead yield improvement activities for new technology ramp-up

The job requires intensive experience in related area - such as 2.5D/3D and HBM technology development and reliability/yield improvements. Project management and team work skills are required. Strength in technology innovation, development, and enablement are key factors to consider.

A M.S. degree in related engineering field with at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree) is required.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $127,100- $203,400

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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