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Advanced Packaging Process Engineer Jobs (NOW HIRING)

Stabilus

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Packaging Process Engineer

Gastonia, NC · On-site

$75K - $94K/yr

Packaging Process Engineer | Stabilus USA | Gastonia, NC | 13 August 2026 Job Summary The Packaging Process Engineer position is based at our U.S. Corporate Headquarters in Gastonia, NC. Under the ...

Amat

Process Engineer - Advanced Packaging

Santa Clara, CA · On-site

$147K - $202K/yr

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing ... Utilize advanced techniques and methodologies to characterize hardware-process interactions across ...

ARTHREX

Sr. Packaging Process Engineer

Fort Myers, FL · On-site

Skills: * Advanced knowledge of Packaging Materials * Advanced understanding of supporting ... engineers and technicians. * Ability to create and maintain accurate pFEMAs for assigned processes.

Actalent

Senior Process Engineer

Carlsbad, CA · On-site

$106K - $138K/yr

Job Title: Senior Process Engineer This Senior Process Engineer role focuses on developing ... Design and implement advanced packaging processes, with a primary focus on flip chip assembly and ...

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Advanced Packaging Process Engineer information

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How much do advanced packaging process engineer jobs pay per year?

As of Sep 15, 2026, the average yearly pay for advanced packaging process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is an advanced packaging process engineer?

An Advanced Packaging Process Engineer is a specialized professional in the semiconductor industry who focuses on developing and optimizing the processes used to assemble and package microchips and electronic components. Their work includes designing and improving advanced packaging technologies such as 2.5D/3D integration, wafer-level packaging, and system-in-package (SiP) solutions. They ensure high performance, reliability, and manufacturability of the final products by collaborating with cross-functional teams in engineering, manufacturing, and quality assurance. This role is crucial for meeting the industry's demands for smaller, faster, and more efficient electronic devices.

What are the key skills and qualifications needed to thrive as an advanced packaging process engineer?

To thrive as an Advanced Packaging Process Engineer, you need a strong background in materials science, semiconductor manufacturing, and process optimization, usually backed by a relevant engineering degree. Familiarity with tools such as AutoCAD, failure analysis equipment, and process control systems, as well as knowledge of standards like IPC and JEDEC, is typically required. Strong problem-solving, attention to detail, and effective communication skills help engineers collaborate across teams and address complex technical challenges. These skills and qualities are crucial for ensuring innovative, reliable, and cost-effective semiconductor packaging solutions.

What are some common challenges faced by advanced packaging process engineers in the transition from R&D to high-volume manufacturing?

Advanced Packaging Process Engineers often encounter challenges when scaling up new packaging technologies from research and development to high-volume manufacturing. These challenges include ensuring process stability, maintaining yield and quality standards, and integrating new processes with existing production lines. Engineers must closely collaborate with cross-functional teams such as design, quality assurance, and equipment maintenance to resolve issues quickly and meet production targets. Continuous optimization and troubleshooting are key aspects of the role, requiring strong problem-solving skills and adaptability.

What is the difference between Advanced Packaging Process Engineer vs Packaging Engineer?

AspectAdvanced Packaging Process EngineerPackaging Engineer
CredentialsBachelor's or higher in Engineering, certifications like IPC or Six SigmaBachelor's in Engineering or related field, certifications vary
Work EnvironmentSemiconductor, electronics manufacturing, R&D labsConsumer goods, industrial products, manufacturing facilities
Industry UsageHigh-tech electronics, semiconductor industryConsumer products, packaging design and production
Job FocusDeveloping advanced packaging processes, improving yield and reliabilityDesigning, testing, and implementing packaging solutions

The Advanced Packaging Process Engineer specializes in developing and optimizing complex packaging processes for high-tech industries like semiconductors, focusing on innovation and reliability. In contrast, the Packaging Engineer typically works on designing and managing packaging solutions for consumer and industrial products. While both roles require engineering knowledge and certifications, their industry focus and daily tasks differ significantly.

What cities are hiring for Advanced Packaging Process Engineer jobs?

Cities with the most Advanced Packaging Process Engineer job openings:

What states have the most Advanced Packaging Process Engineer jobs?

States with the most job openings for Advanced Packaging Process Engineer jobs include:

What are popular job titles related to Advanced Packaging Process Engineer jobs?

For Advanced Packaging Process Engineer jobs, the most frequently searched job titles are:

Infographic showing various Advanced Packaging Process Engineer job openings in the United States as of September 2026, with employment types broken down into 1% As Needed, 77% Full Time, 18% Part Time, 3% Contract, and 1% Nights. Highlights an 89% Physical, 2% Hybrid, and 9% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Advanced Packaging Process Integration Engineer

Essex Junction, VT • On-site

GlobalFoundries
Manufacturing • 10K+ employees
Learn more about GlobalFoundriesexternal

$143K - $247K/yr

Full-time

Re-posted 16 days ago

GlobalFoundries rating

8.3

Company rating: 8.3 out of 10

Based on 35 frontline employees who took The Breakroom Quiz

Job description

About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role: This advanced packaging process integration engineering role will lead post Fab process development to meet customer requirements. The candidate will have a strong focus on wafer finishing and assembly processes to support silicon photonics and other product lines.
Essential Responsibilities:
  • Lead packaging process development efforts and planning by working with the unit process engineers and directly with tools & materials suppliers for advanced packaging in Burlington, VT (Fab 9).

  • Drive semiconductor process development in CMP, wafer thinning, and dicing. Collaborate with unit process engineers to develop new processes for advanced packaging roadmaps.

  • Lead next generation packaging and assembly development to support different product needs. Partner with internal design, fabrication and packaging teams to set assembly specs/requirements and drive new assembly flow/process development.

  • Drive understanding of failure modes and work with cross functional teams to identify and resolve technical issues.

  • Adopt design for cost methodology to enable continuous improvement projects.

  • Generate IP related to novel wafer integration & packaging technology.

  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.

  • Develop expertise in processes, materials and tooling to leverage available characterization resources.

  • Collaborate with OSATs (Outsourced Assembly and Test) to develop new packaging integration processes.

Other Responsibilities:
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

  • Other duties as assigned by the manager.

Required Qualifications:
  • Education - PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related fields from an accredited degree program.

  • At least 15 years of prior related work experience in wafer finishing (thinning, dicing, bumping, and RDL) and assembly processes.

  • Language Fluency - English (Written & Verbal).

  • Travel - Up to 10%.

Preferred Qualifications:
  • Experience in bringing packaged products from development into production.

  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.

  • Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.

  • Strong written and verbal communication skills.

  • Strong planning and organizational skills.

Expected Salary Range
$143,000.00 - $247,000.00
The exact Salary will be determined based on qualifications, experience and location.
The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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