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NXP Semiconductors

Systems IC Architect

San Jose, CA · On-site

$284K/yr

Lead integration of ICs and power semiconductors into advanced packages and systems. This role ... NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin ...

NXP Semiconductors

Systems IC Architect

Austin, TX · On-site

$240K/yr

Lead integration of ICs and power semiconductors into advanced packages and systems. This role ... NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin ...

NXP Semiconductors

Distribution Business Manager

Own and execute territory growth strategies aligned with NXP's Intelligent Edge vision, driving market share and customer expansion. * Forge strong partnerships with distribution leaders, conducting ...

NXP Semiconductors

Lab Operation Technician

Austin, TX · On-site

$18.75 - $25/hr

Work will be onside at the Austin NXP site. Job Requirements * Support engineers working in a post silicon validation lab. * Asset and lab equipment tracking, including support for * equipment ...

NXP Semiconductors

Software Architect

Austin, TX · On-site

Leading the architecture and design of innovative, high-performance solutions supporting NXP's advanced technologies and products. * Collaborating with product management, R&D, and customer-facing ...

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Nxp Semiconductors Jobs Information

Infographic showing various job openings at Nxp Semiconductors in the United States as of August 2026, with employment types broken down into 100% Full Time. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution.

Package Thermal & Mechanical Simulation Engineer

NXP Semiconductors N.V.

Austin, TX • On-site

Full-time

Re-posted 2 days ago

Job description

The future starts here! Are you ready to join NXP in Package Innovation?
The Package Innovation organization is responsible for the design of new packaging concepts and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.
Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.
The Package Innovation Mechanical & Thermal Modelling team uses Finite Element and Finite Volume simulation methodologies. They are used to shorten development cycles and deliver optimized design solutions for semiconductor packages. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures containing many non-linearities.
To reinforce our modeling and simulation team, we are looking for a mechanical engineer, located in Austin TX, USA. Your role is to develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming at a first-time right product qualification. A second key focus area will be to analyze the thermal performance of package concepts and technologies in modelized and actual applications.
Your responsibilities
  • Be a part of the on-site Package Innovation simulation team at NXP Austin and collaboratively solve engineering questions for package development projects.
  • Collaborate with product development teams and package project leads in support of risk mitigation and design optimization.
  • Support problem-solving of package related issues during lifetime testing.
  • Analyze thermal performance of products.

Your team
The modelling team's responsibility is to support new product and technology developments with thermal and mechanical modelling. When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions. The team has a global presence but also has several other members on site in Austin. The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.
Your profile
To be successful in this role you have:
  • A Master or Ph.D. degree qualified in Mechanical Engineering or equivalent is required
  • Experience with Finite Element Modelling, preferably with Ansys or Marc Mentat
  • Fluent in English
  • Understanding of semiconductor packaging technologies is preferred.
  • Willingness to be present on site for at least 3 days/week

Furthermore, you are:
  • An excellent communicator, teamplayer, influencer and networker.
  • A self-starter with initiative, flexibility and command skills.

More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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