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Wire Bonding Machine Operator Jobs (NOW HIRING)

HEICO

Semiconductor Assembly Operator

Sunnyvale, CA · On-site

$19.25 - $23.25/hr

We are currently looking for a Semiconductor Assembly Operator to join our team. The primary ... wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the ...

Heico

Semiconductor Assembly Operator

Sunnyvale, CA

$19.25 - $23.25/hr

We are currently looking for a Semiconductor Assembly Operator to join our team. The primary ... wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the ...

HEICO

Semiconductor Assembly Operator

Sunnyvale, CA · On-site

$19.25 - $23.25/hr

We are currently looking for a Semiconductor Assembly Operator to join our team. The primary ... wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the ...

John Galt Staffing

Wire Bonder

Lawrence, MA · On-site

$22 - $25/hr

Overview We are seeking a Hybrid Operator to join our microelectronics manufacturing team, working ... Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent ...

John Galt Staffing

Wire Bonder

Lawrence, MA · Hybrid

$22 - $25/hr

Overview We are seeking a Hybrid Operator to join our microelectronics manufacturing team, working ... Execute wire bonding (gold and/or aluminum wedge/ball bonding) to MIL-STD-883 or equivalent ...

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How much do wire bonding machine operator jobs pay per hour?

As of Sep 10, 2026, the average hourly pay for wire bonding machine operator in the United States is $18.19, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.47 per hour, depending on experience, location, and employer.

What does a wire bonding machine operator do?

A Wire Bonding Machine Operator is responsible for operating and maintaining machines that connect tiny wires to semiconductor devices, such as integrated circuits, during the manufacturing process. Their duties include setting up wire bonding equipment, monitoring the bonding process, inspecting completed bonds for quality, and performing routine maintenance. This role requires attention to detail, steady hands, and the ability to follow precise instructions to ensure the reliability of electronic components.

What are the key skills and qualifications needed to thrive as a wire bonding machine operator?

To thrive as a Wire Bonding Machine Operator, you need a solid understanding of microelectronics manufacturing, fine motor skills, and typically a high school diploma or equivalent. Familiarity with wire bonding machines, microscopes, and process control systems, as well as relevant safety certifications, is often required. Attention to detail, manual dexterity, and strong problem-solving abilities are important soft skills for this role. These skills ensure high-quality, precise assembly of electronic components, directly impacting product reliability and yield in advanced manufacturing environments.

What are some typical challenges faced by a wire bonding machine operator, and how can they be addressed?

Wire Bonding Machine Operators often encounter challenges such as maintaining high precision during the bonding process and troubleshooting equipment issues. Attention to detail is crucial, as even minor misalignments can impact product quality. Operators can address these challenges by adhering to strict cleanroom protocols, performing regular machine calibrations, and collaborating closely with engineering and quality assurance teams. Ongoing training and staying updated with new bonding technologies also help operators excel in their roles.

What is the difference between Wire Bonding Machine Operator vs Electronic Assembler?

AspectWire Bonding Machine OperatorElectronic Assembler
Required CredentialsHigh school diploma or equivalent; training on wire bonding equipmentHigh school diploma or equivalent; basic soldering and assembly skills
Work EnvironmentManufacturing floor, cleanroom settingsAssembly line, electronics manufacturing environment
Industry UsageElectronics, semiconductor manufacturingElectronics, consumer devices, aerospace
Common Search/ComparisonYesYes

The main difference between a Wire Bonding Machine Operator and an Electronic Assembler lies in their specific roles. The Wire Bonding Machine Operator specializes in operating equipment that bonds wires to electronic components, requiring specialized training. In contrast, the Electronic Assembler performs general assembly tasks, including soldering and component placement. Both roles are vital in electronics manufacturing but focus on different aspects of the production process.

What cities are hiring for Wire Bonding Machine Operator jobs?

Cities with the most Wire Bonding Machine Operator job openings:

What states have the most Wire Bonding Machine Operator jobs?

States with the most job openings for Wire Bonding Machine Operator jobs include:

What are popular job titles related to Wire Bonding Machine Operator jobs?

For Wire Bonding Machine Operator jobs, the most frequently searched job titles are:

Infographic showing various Wire Bonding Machine Operator job openings in the United States as of September 2026, with employment types broken down into 40% Full Time, 58% Part Time, 1% Contract, and 1% Nights. Highlights an 99% Physical, and 1% Remote job distribution, with an average salary of $37,827 per year, or $18.2 per hour.

Semiconductor Assembly Operator

Sunnyvale, CA • On-site

HEICO
See more jobs at HEICOexternal

$19.25 - $23.25/hr

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 29 days ago

Job description

Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), is a manufacturer of semiconductors components. Pyramid Semiconductor is a complete semiconductor integrated circuit designer and manufacturer. We provide our customers with high reliability parts for their legacy programs.
We are currently looking for a Semiconductor Assembly Operator to join our team. The primary responsibility of this position is to perform die attach and operate a wire bonding machine to wire silicon dice on ceramic packages. Additionally, based on the manufacturing needs, the person will be trained in different positions such as visual inspection, burn-in, testing, and other duties as assigned.
Main responsibilities:
  • Performs die attach of die to various packages.
  • Performs wire bonding of the devices using the manual and automated bonders
  • Clip the devices with lids and performs sealing of the devices.
  • Coordinates various tasks in assembly for optimum performance.

Key qualifications:
  • High school diploma or equivalent required.
  • 5+ years of experience in a semiconductor manufacturing environment, including wire bonding.
  • Ability to work in a cleanroom environment.
  • Ability to follow instructions, work in a team environment, and assist where needed.

Compensation and benefits:
BCBS and Kaiser medical plans with different options
  • Dental and vision plans
  • 401(k) with employer match
  • Sick and Vacation time
  • Health Savings Account (HSA) with Company Contributions

And more...
We are committed to providing our employees with opportunities for growth and development.

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