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Thermal Fluid Simulation Engineer Jobs (NOW HIRING)

Cspeed

Thermal Simulation Engineer

Palo Alto, CA · On-site

MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background. * 6+ years of thermal simulation for semiconductor packages or electronic systems, including ...

Cspeed

Thermal Simulation Engineer

Palo Alto, CA · On-site

MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background. * 6+ years of thermal simulation for semiconductor packages or electronic systems, including ...

Boyd Corporation

$46K - $60K/yr

... Simulation: ANSYS (Fluent, Icepak, Mechanical) or similar CFD tools, System-level thermal-fluid ... Programming: Python and/or MATLAB for modeling, simulation, and data analysis, LabVIEW

OpenAI

Lead Thermal Simulation Engineer

San Francisco, CA · On-site

$423K - $485K/yr

About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will ...

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How much do thermal fluid simulation engineer jobs pay per year?

As of Sep 11, 2026, the average yearly pay for thermal fluid simulation engineer in the United States is $104,528.00, according to ZipRecruiter salary data. Most workers in this role earn between $80,000.00 and $129,000.00 per year, depending on experience, location, and employer.

What is a thermal fluid simulation engineer?

A Thermal Fluid Simulation Engineer is a specialized engineer who uses computational tools and modeling techniques to analyze and predict the behavior of fluids and heat transfer in various systems. These engineers work on projects involving heating, cooling, and fluid flow, often in industries like automotive, aerospace, energy, or manufacturing. Their work helps optimize designs for efficiency, safety, and performance by simulating real-world thermal and fluid dynamics before prototypes are built. They typically use software like ANSYS Fluent or COMSOL Multiphysics and collaborate closely with other engineering teams.

What are the key skills and qualifications needed to thrive as a thermal fluid simulation engineer?

To thrive as a Thermal Fluid Simulation Engineer, you need a solid background in mechanical or chemical engineering, thermodynamics, and fluid mechanics, typically supported by a relevant engineering degree. Proficiency with simulation tools such as ANSYS Fluent, COMSOL Multiphysics, or MATLAB, as well as experience in computational fluid dynamics (CFD), is essential. Strong analytical thinking, problem-solving, and effective communication skills help you interpret data and present findings clearly to multidisciplinary teams. These skills and qualifications are crucial for accurately modeling complex thermal-fluid systems and delivering reliable solutions in engineering projects.

What are some common challenges faced by thermal fluid simulation engineers when validating simulation results with real-world data?

Thermal Fluid Simulation Engineers often encounter challenges when correlating simulation data with real-world results due to factors such as incomplete material properties, uncertainties in boundary conditions, and complexities in physical phenomena like turbulence or phase changes. Accurately modeling these factors requires close collaboration with experimental engineers and access to high-quality experimental data. To address these challenges, engineers frequently calibrate models, apply sensitivity analyses, and iteratively refine their simulations to improve agreement with test results, ensuring reliable and actionable insights for design or process optimization.

What are popular job titles related to Thermal Fluid Simulation Engineer jobs?

For Thermal Fluid Simulation Engineer jobs, the most frequently searched job titles are:

Infographic showing various Thermal Fluid Simulation Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $104,528 per year, or $50.3 per hour.

Thermal Simulation Engineer

Palo Alto, CA • On-site

Cspeed
See more jobs at Cspeedexternal

Full-time

Re-posted 8 days ago

Job description

The Role

This position owns thermal modeling for CspeedIO optical engines, from die-level power maps through cooling boundary conditions, and the correlation of those models against measured hardware.

Thermal design here is a functional requirement rather than a reliability margin. Photonic device behavior is temperature-dependent, so wavelength and channel-to-channel uniformity shift with the temperature field across the photonic IC. The assembly also contains a small-footprint, high-flux die whose temperature must be held within a narrow window, and the engine operates adjacent to a host ASIC whose dissipation we do not control. The deliverable is a defensible temperature field, not a junction temperature.

Responsibilities

Thermal modeling and architecture

  • Build and maintain thermal models of the optical engine spanning die, package, interface materials, lid, and cold plate, for air- and liquid-cooled configurations.
  • Establish the cooling boundary condition methodology and its validity limits, and quantify thermal crosstalk from adjacent high-power devices.
  • Resolve the temperature field across the photonic IC to the resolution photonic design requires, and own the resulting gradient and uniformity specifications.

Materials and interfaces

  • Define the heat extraction path for high-flux die within the assembly, die attach, and thermal interface material selection where footprint and power density are constraining.
  • Quantify the sensitivity of engine temperature to material property tolerance and assembly variation.

Correlation and design influence

  • Define the thermal characterization plan and lead simulation-to-hardware correlation to a stated and tracked accuracy tolerance.
  • Provide thermal requirements and constraints to package layout, photonic design, and electrical design during architecture definition rather than after freeze.
  • Generate reduced-order thermal models for system integrators and customers, and engage cold plate, heat sink, and thermal material suppliers.
Required Qualifications
  • MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background.
  • 6+ years of thermal simulation for semiconductor packages or electronic systems, including one product carried from architecture through hardware correlation.
  • Expert proficiency in a commercial thermal or CFD tool for electronics: Ansys Icepak or Fluent, Simcenter Flotherm, Cadence Celsius, or equivalent.
  • Command of heat transfer fundamentals sufficient to defend a model rather than only to run one.
  • Demonstrated correlation of thermal simulation against measured hardware, with methodology revised on that basis.
Preferred Qualifications
  • Silicon photonics or optoelectronic thermal work, particularly thermo-optic sensitivity and wavelength stability.
  • Thermal design for small-footprint, high-flux die.
  • Direct-to-chip liquid cooling and cold plate design or specification.
  • 5D/3D package thermal modeling, and coupled electrothermal or thermal-structural workflows.
  • First-generation product experience where the thermal methodology had to be established rather than inherited.
Scope and Impact

The temperature field this position defines sets the operating envelope for the photonic IC and the thermally critical die around it, and therefore constrains link budget, tuning power, and achievable channel density. The methodology does not currently exist in a documented, correlated form.

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