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Job/Position Summary

The Process Integration & Technology Transfer Director will own the end-to-end manufacturing process flow for the company's advanced substrate fab in India. This role is responsible for translating product and technology requirements into a manufacturable, qualified, and scalable process-of-record.

The role bridges technology development, equipment selection, facilities readiness, process module engineering, quality, reliability, and production ramp. The ideal candidate should have strong hands-on experience in advanced substrates, semiconductor packaging, PCB/substrate manufacturing, glass substrates, ABF buildup, Digital & RF modules, or panel-level processing.

Primary Responsibilities

1. End-to-End Process Flow Ownership
Own the full substrate manufacturing process flow from incoming core to finished substrate.
Define the process-of-record for glass and/or organic-core substrate manufacturing.
Integrate process modules, including cleaning, via formation, metallization, seed/barrier, plating, dielectric buildup, lithography, etch, strip, surface finish, inspection, reliability, and electrical test.
Ensure all process steps are compatible with panel size, material stack, line/space targets, via density, warpage limits, and customer reliability requirements.
Identify process gaps, yield risks, and integration conflicts before tool installation.
2. Technology Transfer & Ramp Readiness
Lead transfer of technology from the U.S., partner, or development team into India manufacturing.
Convert R&D recipes and engineering assumptions into production-capable process flows.
Define process windows, control parameters, qualification plans, and ramp milestones.
Work with equipment engineering to ensure tools are capable of meeting process requirements.
Work with manufacturing to develop SOPs, operator instructions, training plans, and production controls.
3. Process Module Integration
Own integration across incoming glass or organic core inspection, surface preparation, cleaning, TGV/via processing, PVD/electroless/seed metallization, copper plating and via fill.
Integrate dielectric coating, lamination or buildup, laser drilling/ablation, lithography/exposure, develop/etch/strip, solder mask or final dielectric, and ENEPIG/surface finish.
Coordinate warpage control, routing/singulation, AOI/metrology, electrical test, and reliability testing into the final manufacturing flow.
4. Design Rule & Product Integration
Work with design, customers, and product engineering to define manufacturable design rules.
Translate customer requirements into process capability requirements.
Support design-for-manufacturing reviews for RF IPD, glass substrates, interposers, organic substrates, and advanced packaging substrates.
Define limits for line/space, via diameter, via pitch, dielectric thickness, copper thickness, registration, warpage, surface finish, and panel-level tolerances.
Support reference coupon design for process monitoring, reliability, and customer qualification.
5. Yield, Defectivity & Failure Analysis
Own process-related yield improvement during development, qualification, and ramp.
Lead root-cause analysis for defects such as opens, shorts, delamination, voids, dendrite growth, seed residue, plating defects, dielectric defects, warpage, adhesion failures, and via resistance variation.
Work with quality and reliability teams to define failure-analysis workflows and corrective actions.
Use SPC, DOE, FMEA, control plans, and defect Pareto analysis to improve yield.
Establish process monitors and inline control structures.
6. Equipment & Facilities Interface
Partner with equipment engineering on tool capability, tool selection, FAT/SAT criteria, and qualification requirements.
Review tool specifications from a process capability standpoint.
Provide process input to facilities on utilities, chemicals, exhaust, cleanroom class, vibration, humidity, UPW, waste segregation, and temperature control.
Ensure facility and utility design supports process stability and contamination control.
Participate in tool install, commissioning, and process qualification.
7. Quality, Reliability & Customer Qualification
Define the process qualification plan for new products and new process flows.
Work with quality to establish control plans, reliability test plans, acceptance criteria, and customer documentation.
Support qualification for humidity testing, thermal cycling, solder reflow, adhesion, ionic contamination, electrical continuity, via resistance, and surface finish reliability.
Support ISO 9001, IATF 16949, AS9100, or customer-specific quality systems as needed.
Lead technical customer discussions related to process capability and qualification status.
8. Team Building & Leadership
Build and lead the India process integration and module engineering team.
Hire process engineers for plating, lithography, dielectric buildup, wet process, metrology, test, and reliability interface.
Mentor engineers on structured problem-solving, DOE, SPC, failure analysis, and process control.
Establish a disciplined engineering review process for process changes and yield excursions.
Coordinate with U.S. or global technical teams to maintain technology alignment.

Requirements

Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Microelectronics, Semiconductor Processing, or related field.
12-20+ years of experience in semiconductor packaging, substrate manufacturing, PCB, display, semiconductor fab, MEMS, RF module, or high-tech manufacturing.

Physical/Working Requirements

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

Behavioral Traits

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.