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Temporary Rf Design Engineer Jobs in Oregon (NOW HIRING)

The Impact You'll Make The RF Engineer designs, develops, modifies, and evaluates electronic ... Responsibilities include determining design approaches and parameters, analyzing equipment to ...

The Impact You'll Make The RF Engineer designs, develops, modifies, and evaluates electronic parts ... Determines design approaches and parameters. Analyzes equipment to establish operating data ...

OR

$170K - $250K/yr

The Role We are seeking a Senior ASIC Design Verification Engineer whose role will be to verify the ... Experience in space, telecom, or RF/digital mixed systems is a plus. Compensation and Benefits:

Analog Engineer

Hillsboro, OR

$220K/yr

As an Analog Circuit Design Engineer, you will be at the forefront of designing and developing ... design. * Experience with PLLs, bandgap references, inductors, transmission lines, and RF or ...

Analog Engineer

Hillsboro, OR · On-site

$220K/yr

As an Analog Circuit Design Engineer, you will be at the forefront of designing and developing ... design. * Experience with PLLs, bandgap references, inductors, transmission lines, and RF or ...

You'll design and deploy RFID, Bluetooth, and IoT solutions that power next-generation logistics ... Apply RF engineering principles and tools to maximize system performance and reliability. * Support ...

OR · On-site

$130K - $200K/yr

The Role We are seeking an ASIC Design Verification Engineer whose role will be to verify the ... Experience in space, telecom, or RF/digital mixed systems is a plus. Compensation and Benefits:

Apply expertise in high-density, high-speed, mixed-signal, analog, digital, and RF designs * Define ... D engineering experience * Experience with Cadence Allegro PCB design tools Preferred ...

Sr. Digital ASIC Engineer

Hillsboro, OR · On-site

$91K - $177K/yr

Job Title: Sr. Digital ASIC Engineer Posting Start Date: 6/9/26 Job Location(s): Hillsboro If you ... RF, firmware, test and evaluation teams to design and ensure functional and performance ...

Requisition ID: 77738 Description This position is for an experienced digital design engineer ... RF, firmware, test and evaluation teams to design and ensure functional and performance ...

OR

$130K - $180K/yr

The Role We are seeking a Mixed-Signal Behavioral Modeling Engineer to own the creation of ... and digital design flows. * Knowledge of signal processing theory, RF system modeling, or ...

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Temporary Rf Design Engineer information

What are the key skills and qualifications needed to thrive as a Temporary RF Design Engineer, and why are they important?

To thrive as a Temporary RF Design Engineer, you need a solid background in electrical engineering, expertise in RF circuit design, and familiarity with wireless communication standards, often supported by a relevant degree. Proficiency in tools like Cadence, ADS, HFSS, and spectrum analyzers, along with knowledge of simulation software, is typically required. Strong problem-solving, teamwork, and communication skills help you collaborate effectively and adapt to project demands. These abilities ensure efficient design, troubleshooting, and timely delivery of high-quality RF solutions in a fast-paced, project-based environment.

What is the difference between Temporary Rf Design Engineer vs RF Design Engineer?

AspectTemporary Rf Design EngineerRF Design Engineer
CredentialsBachelor's in Electrical Engineering, RF certificationsBachelor's or higher in Electrical Engineering, RF certifications
Work EnvironmentContract-based, project-specificFull-time, ongoing projects
Industry UsageTemporary staffing for telecom, defensePermanent roles in wireless, telecom companies

The main difference is that a Temporary Rf Design Engineer works on short-term, project-based assignments, often through staffing agencies, while an RF Design Engineer typically holds a permanent position with ongoing responsibilities. Both roles require similar qualifications, but their employment nature and duration differ.

What are some typical challenges faced by Temporary RF Design Engineers, and how can they adapt quickly to new projects?

Temporary RF Design Engineers often encounter challenges such as rapidly acclimating to unfamiliar project requirements, integrating with existing teams, and understanding unique client specifications. To succeed, it's important to quickly review project documentation, establish clear communication with team members, and leverage previous experience to troubleshoot issues efficiently. Adaptability, strong technical fundamentals, and proactive problem-solving are key qualities that help temporary engineers deliver results within tight timelines.

What are Temporary RF Design Engineers?

Temporary RF Design Engineers are professionals who are hired on a short-term or contract basis to design, test, and optimize radio frequency (RF) systems and components. Their work typically involves tasks such as creating RF circuit layouts, performing simulations, troubleshooting issues, and ensuring compliance with industry standards. They may work in industries like telecommunications, aerospace, or consumer electronics, and often collaborate with other engineering teams to deliver functional prototypes or products. Their temporary status means they are usually brought in to address specific project needs or to provide specialized expertise for a limited duration.
Physical Design Methodology Engineer

Physical Design Methodology Engineer

Intel Corporation

Hillsboro, OR • On-site

$164K - $269K/yr

Full-time

Medical, Retirement, PTO

Posted 13 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

10th of 139 rated electronics manufacturers


Job description

Job Details:
Job Description:
Advanced Design and Foundational IP (ADFIP) is part of Design Technology Platform (DTP) under Foundry Technology Development. ADFIP's core focus is design-technology co-optimization (DTCO), system-design co-optimization (STCO) and foundational IP development to support Intel technology development, internal client/server/NEX products and external tier0/tier1 customers. The organization develops logic libraries, memories, high-speed I/Os, analog and mixed signal IPs, RF/mm Wave circuits and 3D IC, and conducts comprehensive Si validation on process and package development test vehicles and FIP characterization vehicles. Advanced power, performance and area (PPA) analysis are conducted across domains to guide silicon and packaging technology definition to maximize technology PPA entitlement and minimize process risks and cost. As a process technology design engineer, you will be responsible for creating methodologies, models, and flows for advanced design rules for a specific process node and characterizes those models through silicon validation. Ensures IP and SoC design meets requirements and standards for a specific manufacturing process technology. Identifies ways to optimize silicon designs by evaluating device performance over a range of operating conditions. Resolves prototype issues and determines whether problems are design or process related. Conducts experiments to identify potential challenges in the process and ensure that the process meets yield, quality, and reliability standards. Drives continuous improvements to enhance the designs, materials, and methodologies. Disseminates process development information to design groups, ensures it meets future product requirements, and extracts necessary technical and device performance data for IP and SoC designs. Works with IP and SoC design teams to capture and optimize process requirements to enable competitive designs and products.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
  • Bachelors with 6+ years of experience or master's degree in electrical engineering, Computer Engineering, or Computer Science with 4+ years of industry experience or PhD. with 2+ years of experience.

3+ years of experience with the following technical skills:
  • Working knowledge of digital design and signoff.
  • Able to independently complete Netlist RTL-GDS place and route (APR), signoff tasks.

Preferred Qualifications:
  • Strong technical understanding of semiconductor technology.
  • Working knowledge on Intel's leading process design rules.
  • Experience in working with BOTH Cadence and Synopsys EDA tool/flow
  • Demonstrated ability to work independently in a fast-paced environment.
  • Experience in optimizing PPA for low power designs such as GPU/AI

Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara, US, Texas, Austin
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,470.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968