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Temporary Principal Hardware Architect Jobs (NOW HIRING)

Hardware Architect LOCATION: Melbourne / Florida (US-FL), United States " BRAND: KB Signaling " REQUISITION ID: 10334 " JOB GRADE: 14 " ON-SITE/REMOTE: On-site KB Signaling delivers unparalleled end ...

The Hardware Architect will serve as the primary technical authority for hardware architecture decisions, providing technical leadership across multiple hardware development programs from concept ...

Principal Hardware Engineer

Mountain View, CA · On-site

$145K - $192K/yr

In the role of Principal Hardware Engineer, you will define, develop and deliver production ... Supports in investigating scalable architecture alternatives and development paths for ADAS/AD and ...

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Temporary Principal Hardware Architect information

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How much do temporary principal hardware architect jobs pay per year?

As of Jul 31, 2026, the average yearly pay for temporary principal hardware architect in the United States is $203,216.00, according to ZipRecruiter salary data. Most workers in this role earn between $175,500.00 and $222,000.00 per year, depending on experience, location, and employer.
What are the most commonly searched types of Principal Hardware Architect jobs? The most popular types of Principal Hardware Architect jobs are:

Sr. Principal Hardware Architect

The Hiring Method, LLC

Fremont, CA • Hybrid

$150K - $190K/yr

Full-time

Medical, Dental, Vision, Retirement

Posted 22 days ago


Job description

Work Setting: Hybrid – Fremont, CA (onsite preferred with flexibility to work remotely up to two days per week)

Travel: Approximately 10–20%, primarily for customer meetings, technical collaboration, and project support

Compensation: $150,000 to $190,000 base salary, open to negotiate.

Bonus: Target annual bonus of approximately 12–15%, based on level

Benefits: Comprehensive medical, dental, vision, 401(k), annual bonus, equity/RSU eligibility, and comprehensive employee benefits package

Work Authorization: Sponsorship support is available for qualified TN-1 candidates and H-1B transfers.


Position Summary

A global leader in optical communications technology is seeking a Senior Principal Hardware Architect to help design the next generation of high-speed optical transceivers powering AI infrastructure, hyperscale data centers, and high-performance computing.

This is a highly technical individual contributor role for an experienced hardware architect with expertise in high-speed electrical design, signal integrity, power integrity, and optical transceiver development. The successful candidate will play a key role in developing next-generation PAM4 optical modules supporting speeds of 1.6T, 2.4T, and beyond.

The ideal candidate is passionate about solving complex hardware challenges, enjoys working cross-functionally with multidisciplinary engineering teams, and wants to help shape products used by many of the world's largest cloud and AI infrastructure providers.


Key Responsibilities

• Lead the architecture and design of high-speed optical transceivers from concept through production

• Design high-speed hardware with an emphasis on signal integrity (SI), power integrity (PI), PCB/PCBA design, and RF performance

• Define electrical architecture for next-generation optical modules supporting AI, machine learning, and hyperscale datacenter applications

• Collaborate with firmware, software, optics, process engineering, product management, quality, and manufacturing teams throughout product development

• Support system integration, design validation, EVT/DVT activities, NPI, and production readiness

• Perform design reviews, troubleshooting, RF simulations, lab validation, and performance optimization

• Drive continuous improvements in manufacturability, reliability, and overall product performance


Required Qualifications

• Bachelor's degree in Electrical Engineering or a related discipline (Master's or Ph.D. preferred)

• Experience designing hardware for optical transceivers, optical modules, or other high-speed communication systems

• Strong background in signal integrity (SI/PI), PCB/PCBA design, and high-speed RF design

• Experience with PAM4 signaling and high-speed serial interfaces

• Hands-on experience bringing products from concept through validation and production

• Strong analytical, troubleshooting, and cross-functional communication skills

• Ability to thrive as a technical expert and individual contributor within a collaborative engineering organization

Preferred Qualifications

• Experience with DSPs, Silicon Photonics, EMLs, drivers, TIAs, and optical packaging technologies

• High-density multilayer PCB design experience

• RF simulation using CST, HFSS, or similar modeling tools

• Optical and electrical laboratory characterization experience

• Script-based test automation

• Experience supporting AI infrastructure, hyperscale datacenters, networking, or high-performance computing applications


Why This Opportunity

• Opportunity to develop next-generation optical transceivers enabling AI and hyperscale networking

• Highly technical role with significant influence over product architecture and design

• Work alongside world-class experts in photonics, optics, and high-speed hardware engineering

• Exposure to cutting-edge technologies including PAM4, Silicon Photonics, and next-generation optical interconnects

• Collaborative engineering culture with strong cross-functional engagement

• Competitive compensation, annual bonus, equity opportunity, and excellent long-term career growth

• Opportunity to work on products deployed by many of the world's leading cloud and AI infrastructure companies