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Structure Package Mechanic Jobs in California (NOW HIRING)

... structures, and the lifetime models supporting qualification. The mechanical problem here is ... As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage ...

We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation ... Support technology road mapping by assessing new materials, interconnect structures, and process ...

Package Engineer

Palo Alto, CA · On-site

$180K - $240K/yr

Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints. * Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and ...

The Structures and Dynamics team covers a wide range of components and responsibilities: from the ... packages. * 2+ years of experience designing and developing mechanical components or systems.

Mechanic

San Diego, CA · On-site

$26/hr

Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...

Mechanic

Escondido, CA · On-site

$26 - $36.05/hr

Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...

Mechanic

San Diego, CA · On-site

$26 - $36.05/hr

Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...

Mechanic

Spring Valley, CA · On-site

$26 - $36.05/hr

Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...

Mechanic

San Diego, CA · On-site

$26 - $36.05/hr

Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...

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Structure Package Mechanic information

What is a structure package mechanic?

A Structure Package Mechanic is a skilled tradesperson responsible for assembling, installing, maintaining, and repairing the structural components of aircraft or other large machinery. They work with various materials such as metals and composites, reading blueprints and technical drawings to ensure structural integrity and compliance with safety standards. This role often involves tasks like riveting, welding, and inspecting structures for damage or wear. Structure Package Mechanics are commonly employed in the aerospace, defense, and manufacturing industries.

What are the typical challenges faced by a structure package mechanic when working on large-scale construction projects?

Structure Package Mechanics often encounter challenges such as coordinating with multiple trades on-site, adhering to tight project schedules, and ensuring compliance with safety and quality standards. They must be adept at interpreting technical drawings and adapting to unexpected site conditions, such as material delays or design changes. Collaboration with engineers, supervisors, and other mechanics is crucial to resolve issues quickly and maintain progress, making strong communication and problem-solving skills essential for success in this role.

What are the key skills and qualifications needed to thrive as a structure package mechanic, and why are they important?

To thrive as a Structure Package Mechanic, you need a solid background in mechanical assembly, blueprint reading, and understanding of structural systems, typically supported by relevant vocational training or an apprenticeship. Familiarity with hand and power tools, precision measuring instruments, and sometimes certifications like OSHA safety training are commonly required. Attention to detail, problem-solving abilities, and effective teamwork set top performers apart in this role. These skills and qualities are crucial for ensuring the safe, accurate, and efficient assembly and maintenance of structural components in industries such as aerospace or construction.

What is the difference between Structure Package Mechanic vs Aircraft Maintenance Technician?

AspectStructure Package MechanicAircraft Maintenance Technician
CertificationsFAA Airframe & Powerplant (A&P) licenseFAA Airframe & Powerplant (A&P) license
Work EnvironmentAircraft structures, assembly, and repairFull aircraft maintenance, including systems and structures
Industry UsagePrimarily in aerospace manufacturing and repairCommercial, private, and military aviation
Job FocusStructural components and packagesOverall aircraft maintenance including structures

Both roles require FAA A&P certification and work in aviation environments. The Structure Package Mechanic specializes in aircraft structural components and packages, focusing on assembly and repair of structural parts. The Aircraft Maintenance Technician has a broader scope, handling all aircraft systems and structures. While overlapping in certifications and work environment, the key difference lies in the specific focus on structural packages versus comprehensive aircraft maintenance.

What cities in California are hiring for Structure Package Mechanic jobs?

Cities in California with the most Structure Package Mechanic job openings:

Infographic showing various Structure Package Mechanic job openings in California as of August 2026, with employment types broken down into 73% Full Time, 14% Part Time, and 13% Contract. Highlights an 75% Physical, 2% Hybrid, and 23% Remote job distribution.

Package Mechanical FEA Engineer

Palo Alto, CA

Full-time

Re-posted 8 days ago


Job description

The Role

This position owns structural finite element analysis for CspeedIO optical engine packages: warpage prediction through the assembly process, stress in bump and interconnect structures, and the lifetime models supporting qualification.

The mechanical problem here is constrained twice. As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage, interconnect stress, dielectric cracking, and delamination. In addition, warpage is an optical constraint - out-of-plane deformation displaces optical facets and coupling features, so a package that is mechanically sound can still fail optically. Acceptance criteria are therefore set by optical coupling as well as by reliability.

Responsibilities

Warpage and process simulation

  • Predict warpage at each stage of the assembly process - bonding, reflow, underfill cure, encapsulation, lid attach, singulation - using process-sequential modeling rather than end-state analysis alone, including viscoelastic and cure-shrinkage behavior.
  • Own the flatness, coplanarity, and facet planarity budgets that assembly and optical coupling depend on.

Interconnect stress and reliability

  • Analyze stress and strain in micro-bump, copper pillar, C4, and second-level interconnect structures, including chip-package interaction and low-k dielectric risk.
  • Own solder and interconnect fatigue life prediction, and model thermal cycling, shock, drop, and board-level reliability against JEDEC and IPC methodology.
  • Quantify stress in the photonic IC and its consequences for optical performance, in partnership with the photonic design team.

Methodology, correlation, and design influence

  • Define simulation methodology and modeling standards with documented, auditable assumptions, and correlate predictions against measured warpage, cross-section, and reliability data.
  • Provide design guidance and sign-off criteria during architecture definition - stack-up, thickness, bump pitch, underfill and stiffener selection - rather than after design freeze.
  • Engage substrate suppliers and OSATs on process assumptions, measured warpage data, and material characterization.
Required Qualifications
  • MS or PhD in Mechanical Engineering, Materials Science, Engineering Mechanics, or equivalent practical background.
  • 6+ years of structural FEA for semiconductor packaging, including warpage and interconnect stress analysis on a product carried into build.
  • Deep hands-on capability in Ansys Mechanical, Abaqus, or equivalent, including nonlinear material modeling.
  • Command of nonlinear and time-dependent material behavior - creep, viscoplasticity, viscoelasticity, fatigue - with correct treatment of temperature and rate dependence.
  • Working knowledge of solder constitutive models and fatigue life prediction methods.
  • Demonstrated correlation against physical measurement, and the judgment to distinguish a modeling error from a process excursion.
Preferred Qualifications
  • Chip-package interaction analysis including back-end-of-line and low-k dielectric stress.
  • Board-level reliability and PCB-to-package interaction modeling; JEDEC and IPC qualification methodology.
  • Photonic or optoelectronic packaging, particularly warpage as an optical alignment constraint or stress effects on optical behavior.
  • Coupled thermal-structural workflows, including transfer of a computed temperature field into a structural model.
  • Design of experiments and surrogate modeling to compress large parametric studies.
Scope and Impact

Warpage and interconnect stress determine whether the engine can be assembled at yield and whether it survives qualification, and because warpage displaces optical coupling features the same analysis constrains optical performance. Errors here surface at build and cost months rather than margin.