... structures, and the lifetime models supporting qualification. The mechanical problem here is ... As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage ...
... structures, and the lifetime models supporting qualification. The mechanical problem here is ... As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage ...
... structures, and the lifetime models supporting qualification. The mechanical problem here is ... As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage ...
... structures, and the lifetime models supporting qualification. The mechanical problem here is ... As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage ...
Structures Mechanic Lead
Victorville, CA · On-site
$22/hr
Structures Mechanic Lead LAUNCH Technical Workforce Solutions is seeking a Structures Mechanic with ... LAUNCH offers you an ACA compliant benefit package including company-sponsored medical insurance ...
Structures Mechanic Lead
Victorville, CA · On-site
$22/hr
Structures Mechanic Lead LAUNCH Technical Workforce Solutions is seeking a Structures Mechanic with ... LAUNCH offers you an ACA compliant benefit package including company-sponsored medical insurance ...
Aircraft Structures Mechanic Structures Mechanics that have major and minor modification background ... LAUNCH offers you an ACA compliant benefit package including company-sponsored medical insurance ...
Aircraft Structures Mechanic Structures Mechanics that have major and minor modification background ... LAUNCH offers you an ACA compliant benefit package including company-sponsored medical insurance ...
IC Package FEA Engineer
San Jose, CA · On-site
We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation ... Support technology road mapping by assessing new materials, interconnect structures, and process ...
IC Package FEA Engineer
San Jose, CA · On-site
We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation ... Support technology road mapping by assessing new materials, interconnect structures, and process ...
Staff IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$154K - $231K/yr
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
Staff IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$154K - $231K/yr
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation ... Support technology road mapping by assessing new materials, interconnect structures, and process ...
We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation ... Support technology road mapping by assessing new materials, interconnect structures, and process ...
Sr. IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$110K - $146K/yr
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
Sr. IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$110K - $146K/yr
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
Sr. IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$110K - $146K/yr
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
Sr. IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$110K - $146K/yr
This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench ... structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction ...
Staff Engineer, Packaging Mechanical Simulation San Jose, California, United States Please Note: To ... In‑depth understanding of advanced semiconductor packaging, interconnect structures, and ...
Staff Engineer, Packaging Mechanical Simulation San Jose, California, United States Please Note: To ... In‑depth understanding of advanced semiconductor packaging, interconnect structures, and ...
Provide mechanical design support throughout package- and system-development stages-from concept ... In-depth understanding of advanced semiconductor packaging, interconnect structures, and ...
Provide mechanical design support throughout package- and system-development stages-from concept ... In-depth understanding of advanced semiconductor packaging, interconnect structures, and ...
Provide mechanical design support throughout package‑ and system‑development stages--from ... In‑depth understanding of advanced semiconductor packaging, interconnect structures, and ...
Quick apply
Provide mechanical design support throughout package‑ and system‑development stages--from ... In‑depth understanding of advanced semiconductor packaging, interconnect structures, and ...
Package Engineer
Palo Alto, CA · On-site
$180K - $240K/yr
Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints. * Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and ...
Package Engineer
Palo Alto, CA · On-site
$180K - $240K/yr
Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints. * Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and ...
Mechanical Engineer, Structures
Long Beach, CA · On-site
$86K - $122K/yr
The Structures and Dynamics team covers a wide range of components and responsibilities: from the ... packages. * 2+ years of experience designing and developing mechanical components or systems.
Mechanical Engineer, Structures
Long Beach, CA · On-site
$86K - $122K/yr
The Structures and Dynamics team covers a wide range of components and responsibilities: from the ... packages. * 2+ years of experience designing and developing mechanical components or systems.
Mechanic
San Diego, CA · On-site
$26/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
San Diego, CA · On-site
$26/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
Escondido, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
Escondido, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
San Diego, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
San Diego, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
Spring Valley, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
Spring Valley, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
San Diego, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Mechanic
San Diego, CA · On-site
$26 - $36.05/hr
Prepare engine packages for painting and perform necessary clean up as required. * Perform work ... Turbomachinery Structures department. Minimum Qualifications: * High school diploma, GED or ...
Structure Package Mechanic information
What is a structure package mechanic?
What are the typical challenges faced by a structure package mechanic when working on large-scale construction projects?
What are the key skills and qualifications needed to thrive as a structure package mechanic, and why are they important?
What is the difference between Structure Package Mechanic vs Aircraft Maintenance Technician?
| Aspect | Structure Package Mechanic | Aircraft Maintenance Technician |
|---|---|---|
| Certifications | FAA Airframe & Powerplant (A&P) license | FAA Airframe & Powerplant (A&P) license |
| Work Environment | Aircraft structures, assembly, and repair | Full aircraft maintenance, including systems and structures |
| Industry Usage | Primarily in aerospace manufacturing and repair | Commercial, private, and military aviation |
| Job Focus | Structural components and packages | Overall aircraft maintenance including structures |
Both roles require FAA A&P certification and work in aviation environments. The Structure Package Mechanic specializes in aircraft structural components and packages, focusing on assembly and repair of structural parts. The Aircraft Maintenance Technician has a broader scope, handling all aircraft systems and structures. While overlapping in certifications and work environment, the key difference lies in the specific focus on structural packages versus comprehensive aircraft maintenance.
What cities in California are hiring for Structure Package Mechanic jobs?
Cities in California with the most Structure Package Mechanic job openings:

Package Mechanical FEA Engineer
Palo Alto, CA
Full-time
Re-posted 8 days ago
Job description
This position owns structural finite element analysis for CspeedIO optical engine packages: warpage prediction through the assembly process, stress in bump and interconnect structures, and the lifetime models supporting qualification.
The mechanical problem here is constrained twice. As in any advanced package, expansion mismatch across a heterogeneous stack drives warpage, interconnect stress, dielectric cracking, and delamination. In addition, warpage is an optical constraint - out-of-plane deformation displaces optical facets and coupling features, so a package that is mechanically sound can still fail optically. Acceptance criteria are therefore set by optical coupling as well as by reliability.
ResponsibilitiesWarpage and process simulation
- Predict warpage at each stage of the assembly process - bonding, reflow, underfill cure, encapsulation, lid attach, singulation - using process-sequential modeling rather than end-state analysis alone, including viscoelastic and cure-shrinkage behavior.
- Own the flatness, coplanarity, and facet planarity budgets that assembly and optical coupling depend on.
Interconnect stress and reliability
- Analyze stress and strain in micro-bump, copper pillar, C4, and second-level interconnect structures, including chip-package interaction and low-k dielectric risk.
- Own solder and interconnect fatigue life prediction, and model thermal cycling, shock, drop, and board-level reliability against JEDEC and IPC methodology.
- Quantify stress in the photonic IC and its consequences for optical performance, in partnership with the photonic design team.
Methodology, correlation, and design influence
- Define simulation methodology and modeling standards with documented, auditable assumptions, and correlate predictions against measured warpage, cross-section, and reliability data.
- Provide design guidance and sign-off criteria during architecture definition - stack-up, thickness, bump pitch, underfill and stiffener selection - rather than after design freeze.
- Engage substrate suppliers and OSATs on process assumptions, measured warpage data, and material characterization.
- MS or PhD in Mechanical Engineering, Materials Science, Engineering Mechanics, or equivalent practical background.
- 6+ years of structural FEA for semiconductor packaging, including warpage and interconnect stress analysis on a product carried into build.
- Deep hands-on capability in Ansys Mechanical, Abaqus, or equivalent, including nonlinear material modeling.
- Command of nonlinear and time-dependent material behavior - creep, viscoplasticity, viscoelasticity, fatigue - with correct treatment of temperature and rate dependence.
- Working knowledge of solder constitutive models and fatigue life prediction methods.
- Demonstrated correlation against physical measurement, and the judgment to distinguish a modeling error from a process excursion.
- Chip-package interaction analysis including back-end-of-line and low-k dielectric stress.
- Board-level reliability and PCB-to-package interaction modeling; JEDEC and IPC qualification methodology.
- Photonic or optoelectronic packaging, particularly warpage as an optical alignment constraint or stress effects on optical behavior.
- Coupled thermal-structural workflows, including transfer of a computed temperature field into a structural model.
- Design of experiments and surrogate modeling to compress large parametric studies.
Warpage and interconnect stress determine whether the engine can be assembled at yield and whether it survives qualification, and because warpage displaces optical coupling features the same analysis constrains optical performance. Errors here surface at build and cost months rather than margin.