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Staff Wafer Level Process Development Engineer Jobs

Knauf Insulation

Process Development Engineer

The Process Development Engineer is responsible for driving the development, optimization, and standardization of white wool manufacturing processes and product quality across KINA plants, serving as ...

Socket.dev

hardware engineer 5

California, MO · On-site

Senior Staff Reliability Engineer, RF Characterization and Reliability Overview We are seeking ... process at the wafer level. * ESD (Electrostatic Discharge) Characterization: * Designing and ...

Corning Inc.

NY · On-site

Design, development and implementation of new connectivity products (from concept, through ... Researching new raw materials and developing new processing. * Study new trends in fiber optic ...

Socket.dev

Process Development Engineer, Etch

Austin, TX · On-site

$90K - $180K/yr

About the role As a Process Development Engineer, Etch at fab2, you'll be responsible for experiment design and execution of new semiconductor, etching and thin-film fabrication methods. We're ...

New

SiTime Corporation

MEMS Engineer II

Ann Arbor, MI · On-site

$93K - $128K/yr

As a MEMS Development Engineer, you will work on development and characterization of the next ... Perform the wafer-level characterization of MEMS resonators * Design and optimize the wafer-level ...

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Staff Wafer Level Process Development Engineer information

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How much do staff wafer level process development engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for staff wafer level process development engineer in the United States is $101,612.00, according to ZipRecruiter salary data. Most workers in this role earn between $80,500.00 and $119,000.00 per year, depending on experience, location, and employer.

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Staff Package Development Engineer

Austin, TX • On-site

Renesas Electronics
See more jobs at Renesas Electronicsexternal

Full-time

Re-posted 12 days ago

Job description

Company Description
Job Description
The Package Development Engineer is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements. This role works closely with cross-functional teams, including silicon design, package design, manufacturing, reliability, quality, and OSAT partners to bring new package technologies from concept through high-volume manufacturing.
The ideal candidate combines strong semiconductor packaging expertise with a hands-on, problem-solving mindset and the ability to drive complex technology development activities in a global environment.
Qualifications
  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
  • Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
  • Strong knowledge of semiconductor assembly processes, including,
    • Wafer backgrind
    • Wafer dicing
    • Die attach
    • Flip-chip assembly
    • Wire bonding
    • Underfill
    • Encapsulation and molding
    • Ball attach
    • Package singulation
    • Surface-mount technology (SMT)
  • Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.
  • Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.
  • Experience conducting package reliability testing, failure analysis, and root-cause investigations.
  • Strong analytical, project management, and communication skills.
  • Ability to work independently and effectively within cross-functional global teams.

Preferred Qualifications
  • Master's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.
  • Experience with advanced packaging technologies such as:
    • Flip-Chip CSP (FCCSP)
    • System-in-Package (SiP)
    • Fan-Out Packaging (FOPLP/FOWLP)
    • Wafer-Level Packaging (WLP/WLCSP)
    • 2.5D/3D Packaging
  • Knowledge of package thermal, mechanical, and electrical characterization techniques.
  • Experience supporting automotive-grade product qualification and reliability standards.
  • Knowledge of sustainability initiatives, packaging materials selection, and cost optimization techniques.

Education/Experience:
Ph.D. - 2 plus years relevant industry experience
Master's Degree - 5 plus years relevant industry experience
Bachelor's Degree - 7 plus years relevant industry experience
Key Competencies:
  • Strong technical problem-solving skills
  • Engineering rigor and attention to detail
  • Innovation and research mindset
  • Project ownership and execution
  • Cross-functional leadership
  • Vendor and supplier management
  • Effective technical communication
  • Ability to thrive in a fast-paced development environment
  • Continuous learning and improvement orientation

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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